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    • 5. 发明专利
    • DE69321745T2
    • 1999-10-07
    • DE69321745
    • 1993-02-02
    • MATSUSHITA ELECTRIC IND CO LTD
    • NAKAMURA TETSURONAKAGAWA MASAHIROTANAKA EIICHIROFUJIWARA SHINJI
    • H04N1/031H04N1/028
    • A direct contact type image sensor comprising: an optical fiber array plate including a transparent substrate and an optical fiber array and having a lower face brought into close contact with an original document; a semiconductor image sensor chip including a photosensor array and mounted on an upper face of the optical fiber array plate by transparent photo-setting and insulating resin; a circuit conductive layer formed on an upper face of the transparent substrate; a bump electrode formed on a lower face of the semiconductor image sensor chip so as to be brought into contact with the circuit conductive layer; a light source for illuminating the original document; the optical fiber array plate being formed, on the upper face, with a slit for allowing light from the light source to pass therethrough; a first light shielding layer provided at other portions of the lower face of the optical fiber array plate than that corresponding to the optical fiber array; and a second light shielding layer provided at other portions of the upper face of the optical fiber array plate than those corresponding to the optical fiber array and the slit.
    • 9. 发明专利
    • DE69325696T2
    • 2000-04-06
    • DE69325696
    • 1993-12-02
    • MATSUSHITA ELECTRIC IND CO LTD
    • NAKAMURA TETSUROKAWAMOTO EIJIFUJIWARA SHINJI
    • G02B6/08H04N1/031H04N1/028G02B6/42
    • The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.