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1. 发明申请

WO9708655A3 SCREEN PRINTING METHOD AND SCREEN PRINTING APPARATUS 审中-公开
标题翻译：屏幕打印方法和屏幕打印设备
公开(公告)号：WO9708655A3
公开(公告)日：1997-05-29
申请号：PCT/JP9602432
申请日：1996-08-30
申请人： MATSUSHITA ELECTRIC IND CO LTD , TAKAHASHI KEN , CHIKAHISA NAOICHI , NAGASAWA YOUSUKE , NAITO TAKAO , WACHI AKIHIKO , YANACHI SEISHIRO , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
发明人： TAKAHASHI KEN , CHIKAHISA NAOICHI , NAGASAWA YOUSUKE , NAITO TAKAO , WACHI AKIHIKO , YANACHI SEISHIRO , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34 , G06T11/20
CPC分类号： B41F15/0818 , H05K3/1233 , H05K3/3484 , H05K2201/09727 , H05K2203/0139 , H05K2203/0264 , H05K2203/0783 , H05K2203/163
摘要： A screen printing method for screen printing solder paste at a reference print speed by using a squeegee, the screen printing method comprising: a step for, upon an occurence of print standby time during a printing operation, measuring the print standby time; and a step for, at a resumption of printing with the print standby canceled, screen-printing the solder paste placed on a screen mask during the standby time, by moving the squeegee at an adjusted print speed lower than the reference print speed based on a relationship between the print standby time and a print time due to the adjusted print speed after the resumption of printing.
摘要翻译：一种丝网印刷方法，用于通过使用刮板将基准印刷速度的锡膏进行丝网印刷，所述丝网印刷方法包括：在打印操作期间发生打印待机时间的步骤，测量打印待机时间; 以及步骤，为了在取消打印待机状态下恢复打印时，在待机时间内，通过以低于基准打印速度的调节打印速度移动刮板，基于在恢复打印之后由于调整后的打印速度而导致打印待机时间与打印时间之间的关系。

2. 发明专利

DE69632537T2 未知
公开(公告)号：DE69632537T2
公开(公告)日：2005-06-02
申请号：DE69632537
申请日：1996-08-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI KEN , CHIKAHISA NAOICHI , NAGASAWA YOUSUKE , NAITO TAKAO , WACHI AKIHIKO , YANACHI SEISHIRO , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
摘要： A screen printing method for printing, with use of a screen printing apparatus, solder paste (122) on an electrode (125) of a board (102) to be printed, by positioning a screen mask (101) onto the board and by printing the solder paste supplied onto the screen mask into the screen mask with a squeegee (123) of a print head (103) which moves parallel to the screen mask while being kept in contact with the screen mask, wherein the board is classified into a first area (121) where a value of each of opening sizes of the mask along a direction in which the squeegee moves is smaller than a specified threshold, and a second area (120) where a value of each of opening sizes of the mask is not smaller than the threshold, and a speed of the squeegee at the first area is made slower than a speed of the squeegee at the second area.

3. 发明公开

EP1133219A4 HEATING DEVICE AND HEATING METHOD 审中-公开
标题翻译：加热装置和加热方法
公开(公告)号：EP1133219A4
公开(公告)日：2004-10-27
申请号：EP99947863
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NONOMURA MASARU , ABE TOSHIHIRO , NAGAFUKU NOBUYASU , MATSUMOTO KUNIYO , SASAKI TAKASHI
IPC分类号： B23K1/012 , H05K3/34 , B23K3/047
CPC分类号： B23K1/012 , H05K3/3494
摘要： A heating device and heating method, wherein the supplied heat quantity provided by a heating gas is controlled so that the supplied heat quantity (Q3, t4) provided by the heating gas when a heat treatment for solder or the like is unnecessary or is lower than the supplied heat quantity (Q1, t3) provided by the heating gas when a heat treatment for solder or the like is necessary, thereby lowering the electric power consumption when a heat treatment for substrates is unnecessary.

4. 发明专利

DE69632537D1 未知
公开(公告)号：DE69632537D1
公开(公告)日：2004-06-24
申请号：DE69632537
申请日：1996-08-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI KEN , CHIKAHISA NAOICHI , NAGASAWA YOUSUKE , NAITO TAKAO , WACHI AKIHIKO , YANACHI SEISHIRO , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
摘要： A screen printing method for printing, with use of a screen printing apparatus, solder paste (122) on an electrode (125) of a board (102) to be printed, by positioning a screen mask (101) onto the board and by printing the solder paste supplied onto the screen mask into the screen mask with a squeegee (123) of a print head (103) which moves parallel to the screen mask while being kept in contact with the screen mask, wherein the board is classified into a first area (121) where a value of each of opening sizes of the mask along a direction in which the squeegee moves is smaller than a specified threshold, and a second area (120) where a value of each of opening sizes of the mask is not smaller than the threshold, and a speed of the squeegee at the first area is made slower than a speed of the squeegee at the second area.

5. 发明专利

SG71804A1 Screen printing method and screen printing apparatus 未知
公开(公告)号：SG71804A1
公开(公告)日：2000-04-18
申请号：SG1998001432
申请日：1996-08-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI KEN , CHIKAHISA NAOICHI , NAGASAWA YOUSUKE , NAITO TAKAO , WACHI AKIHIKO , YANACHI SEISHIRO , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYASU
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
摘要： A screen printing method for printing, with use of a screen printing apparatus, solder paste (122) on an electrode (125) of a board (102) to be printed, by positioning a screen mask (101) onto the board and by printing the solder paste supplied onto the screen mask into the screen mask with a squeegee (123) of a print head (103) which moves parallel to the screen mask while being kept in contact with the screen mask, wherein the board is classified into a first area (121) where a value of each of opening sizes of the mask along a direction in which the squeegee moves is smaller than a specified threshold, and a second area (120) where a value of each of opening sizes of the mask is not smaller than the threshold, and a speed of the squeegee at the first area is made slower than a speed of the squeegee at the second area.

6. 发明专利

JP2004001554A Screen printing method and screen printing machine 审中-公开
公开(公告)号：JP2004001554A
公开(公告)日：2004-01-08
申请号：JP2003273460
申请日：2003-07-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKAHASHI MASARU , CHIKAHISA NAOICHI , NAGASAWA YOSUKE , NAITO TAKAO , WACHI AKIHIKO , YANAIKE SEISHIROU , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
CPC分类号： B41F15/0818 , H05K3/1233 , H05K3/3484 , H05K2201/09727 , H05K2203/0139 , H05K2203/0264 , H05K2203/0783 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide a screen printing method capable of efficiently applying good quality printing of cream solder to a substrate wherein regions corresponding to the large and fine apertures of a screen metal mask are mixed, and an apparatus therefor. SOLUTION: The substrate is divided into a first region (121), wherein the value of the aperture dimension of the mask along the moving direction of a squeegee is smaller than a predetermined threshold value, and a second region (120), wherein the value of the aperture dimension is more than the threshold value, along the moving direction of the squeegee. The speed of the squeegee in the first region is made slower than that of the squeegee in the second region. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2003071562A Exhaust gas control method for reflow device and reflow device 审中-公开
标题翻译：用于反流装置和反流装置的排气控制方法
公开(公告)号：JP2003071562A
公开(公告)日：2003-03-11
申请号：JP2001261476
申请日：2001-08-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , IIZUKA AKIRA , NONOMURA MASARU , ABE TOSHIHIRO
IPC分类号： B23K1/008 , B23K1/00 , B23K3/04 , B23K31/02 , B23K101/42 , F27B9/30 , F27B9/40 , F27D19/00 , F27D21/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an exhaust gas control method for a reflow device and a reflow device capable of reducing power consumption by not operating a blower when the exhaustion is not needed, and capable of suppressing the increase in power caused by flowing-in of outside air by controlling the exhaust gas from respective suction ducts.
SOLUTION: In the exhaust gas control method for the reflow device for sucking a hot gas in a furnace body leaking from a base plate taking-in port 11 and a base plate taking-out port 13 from suction ducts 31, 32 provided outside the base plate taking-in port 11 and the base plate taking-out port 13 to exhaust to the outside of the device, the operation of an exhaust blower 35 connected to the suction ducts 31, 32 is controlled by the temperature of a furnace body 17, and the suction of the respective suction ducts 31, 32 is controlled by control valves 41, 42 mounted to the suction ducts 31, 32 intervened in between respectively.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于回流装置和回流装置的排气控制方法，该回流装置能够在不需要排气时通过不运行鼓风机来降低功耗，并且能够抑制由流入引起的功率的增加通过控制来自相应抽吸管道的废气来实现。解决方案：在用于从设置在基座外部的吸入管道31,32从基板入口11和基板取出口13泄漏的炉体吸入热气体的回流装置的排气控制方法中，板吸入口11和基板取出口13排出到设备的外部，连接到吸入管道31,32的排气鼓风机35的操作由炉体17的温度控制，并且相应的吸入管道31,32的吸力由安装在分别介于其间的吸入管道31,32的控制阀41,42来控制。

8. 发明专利

JP2001358453A REFLOW SOLDERING DEVICE AND METHOD 失效
公开(公告)号：JP2001358453A
公开(公告)日：2001-12-26
申请号：JP2000181750
申请日：2000-06-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGAFUKU NOBUYASU , NONOMURA MASARU , IIZUKA AKIRA , KURIBAYASHI TAKESHI
IPC分类号： B23K1/00 , B23K1/008 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To reliably detect the clogging of a filter and an exhaust blower without imposing a burden on a working manager, at the same time, to eliminate the need for stopping a device to check the clogging, to improve productivity in high-quality soldering treatment, and to achieve more complete automation. SOLUTION: A reflow soldering device 21 has an exhaust monitor sensor 35 that outputs a signal corresponding to the flow state of exhaust in an exhaust dust 25, an abnormality notice means 37 that informs abnormality caused by the clogging of a filter 29 and an exhaust blower 27, and a control device 39 in the case of failure that discriminates and detects the abnormality caused by the clogging of the filter 29 and exhaust blower 27 based on the output signal of the exhaust monitoring sensor 35 for controlling the operation of the abnormality notice means 37, upper-side facilities 31, and an operation management computer system 33. Also, the reflow soldering device 21 detects the clogging of the exhaust blower 27, and eliminates the need for working for checking the clogging of the exhaust blower 27 by the working manager.

9. 发明专利

JP2001203495A METHOD AND FACILITY FOR MOUNTING 失效
公开(公告)号：JP2001203495A
公开(公告)日：2001-07-27
申请号：JP2000009578
申请日：2000-01-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGAFUKU NOBUYASU , KOYAMA TOSHIYUKI , KURIBAYASHI TAKESHI , SARASHINA EIGO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a mounting facility and mounting method, where it is judged in advance whether a means for transferring a substrate interferes with a means for supporting the substrate, to prevent interference between them, related to a mounting facility which comprises a means for transferring a substrate comprising a pair of rails, so provided as to be an interval is adjusted according to the width of the substrate to be transferred and a means for transferring the substrate held by the means for transferring substrate. SOLUTION: A mounting facility comprises a means 1 for transferring a substrate comprising a pair of rails provided adjustable to an interval in matching with the width of a substrate to be transferred, and a means 2 for supporting the substrate held by the means for transferring the substrate. Here, a sensor 11 is provided for detecting in advance a positional relationship between a rail position, after the interval of rails of the means 1 is adjusted and the position of means 2 at supporting of the substrate, when a rail is moved so that the interval of rails of the means 1 is adjusted in order to hold the substrate to be transferred. Furthermore, a facility control device 4 is provided which determines whether the means 1 interferes with the means 2 based on the detecting result of the sensor 11.

10. 发明专利

JP2000188465A HEATING DEVICE AND METHOD 失效
公开(公告)号：JP2000188465A
公开(公告)日：2000-07-04
申请号：JP29095199
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NONOMURA MASARU , ABE TOSHIHIRO , NAGAFUKU NOBUYASU , MATSUMOTO KUNIYO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce power consumption when the heat treatment to a body to be joined is not required by reducing the amount of gas supply heat when the heat treatment of an object to be heated is not required as compared with a case when the heat treatment is required by a device for controlling the amount of gas supply heat. SOLUTION: A circuit substrate 2 that is a body to be joined where parts 2a are placed on cream solder is carried from an inlet to an outlet by a transport part 3. The transport part 3 is contained and a heating gas is supplied via a heater 9c. A heating chamber 7a is provided for supplying a gas with a specific flow rate and temperature onto the body to be joined as a heat source and for heating and melting an object to be heated such as solder on the body to be joined. In the starting/preparing process of a reflow device, the temperature of heated air in each chamber is controlled by controlling the heater 9c via a temperature controller 20 with a controller 21 that is joined to a temperature-monitoring sensor 17c corresponding to the heat content of the circuit substrate 2. When the circuit substrate 2 is not subjected to reflow treatment, the temperature of each chamber is maintained at a lower temperature than a specific heat-treatment temperature.

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