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1. 发明公开

EP1133219A4 HEATING DEVICE AND HEATING METHOD 审中-公开
标题翻译：加热装置和加热方法
公开(公告)号：EP1133219A4
公开(公告)日：2004-10-27
申请号：EP99947863
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NONOMURA MASARU , ABE TOSHIHIRO , NAGAFUKU NOBUYASU , MATSUMOTO KUNIYO , SASAKI TAKASHI
IPC分类号： B23K1/012 , H05K3/34 , B23K3/047
CPC分类号： B23K1/012 , H05K3/3494
摘要： A heating device and heating method, wherein the supplied heat quantity provided by a heating gas is controlled so that the supplied heat quantity (Q3, t4) provided by the heating gas when a heat treatment for solder or the like is unnecessary or is lower than the supplied heat quantity (Q1, t3) provided by the heating gas when a heat treatment for solder or the like is necessary, thereby lowering the electric power consumption when a heat treatment for substrates is unnecessary.

2. 发明专利

JPH04365400A ELECTRONIC PART MOUNTING MACHINE 失效
公开(公告)号：JPH04365400A
公开(公告)日：1992-12-17
申请号：JP14165891
申请日：1991-06-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MURAOKA NOBUHIKO , MATSUMOTO KUNIYO , MORI AKIRA
IPC分类号： H05K3/34 , H05K13/04
摘要： PURPOSE:To provide an electronic part mounting machine which enables a soldering process to be performed with one machine and electronic part to be fitted highly accurately. CONSTITUTION:A nozzle 2 for discharging a cream solder by the pressure of compressed air is provided at an end of a tank 1 which houses the cream inside and then a part holding nozzle 5 which transfers and mounts an electronic part 14, an optical beam irradiation portion 6 which heats and fuses the coated cream solder and performs soldering, and an air cylinder 3 which moves and positions the tank 1, the part holding nozzle 5, and the optical beam irradiation portion 6 are provided.

3. 发明专利

JPH04286185A DRAWING DEVICE 失效
公开(公告)号：JPH04286185A
公开(公告)日：1992-10-12
申请号：JP5086791
申请日：1991-03-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MINAMITANI SHOZO , MURAOKA NOBUHIKO , MATSUMOTO KUNIYO
IPC分类号： B43L13/00 , H05K3/10
摘要： PURPOSE:To conduct stable discharge by rapidly robbing heat from peripheral environment, heat carried by air for pressing, frictional heat generated when air for pressing flows into a tank, etc., in order to prevent the effect of these heat on a viscous material in the tank and stabilizing the temperature of the viscous material immediately before discharge and stabilizing viscosity. CONSTITUTION:A drawing device has a tank 7, in which a viscous material 8 for forming an electronic circuit is housed and from which the viscous material 8 is discharged, a thermocouple 11 (or an infrared temperature sensor) measuring the temperature of the viscous material 8 housed in the tank 7 or the viscous material 8 discharged outside the tank 7, a temperature regulator 6 regulating the temperature of the viscous material 8 in said tank 7, and a control section 12 receiving the temperature data of said viscous material 8 obtained from said thermocouple 11, adjusting the temperature of said temperature regulator 6 and regulating the temperature of the viscous material 8 in said tank 7.

4. 发明专利

JPH0685443A DIP SOLDERING DEVICE 失效
公开(公告)号：JPH0685443A
公开(公告)日：1994-03-25
申请号：JP23171592
申请日：1992-08-31
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMOTO KUNIYO , HOSOYA NAOTO
IPC分类号： B23K1/08 , H05K3/34
摘要： PURPOSE:To secure the inert gas concentration in the part to be soldered by feeding a bit of inert gas. CONSTITUTION:A guide 18 composed of a plate 19 and a curtain 16 is arranged above a preheater 5. Resultantly, the air heated by the preheater 5 flowing in the direction (b) along the preheater 5 is vented upward running along the arrow (c). Accordingly, the outside air flowing above a dip vessel 6 is suppressed so that the inert gas concentration in the part to be soldered by feeding a bit of inert gas may be secured.

5. 发明专利

JP2007161351A Recovery method for used tape in component mounting, recovery ring, and viscous body coating equipment and component supply device using the recovery ring 有权
标题翻译：元件安装，回收环和VISCOUS体系涂层设备中使用的带的恢复方法和使用恢复环的组件供应设备
公开(公告)号：JP2007161351A
公开(公告)日：2007-06-28
申请号：JP2005355807
申请日：2005-12-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISOHATA YOSHIO , HASHIMOTO SHUNJI , MATSUMOTO KUNIYO
IPC分类号： B65H75/22 , B65H75/10 , B65H75/24
摘要： PROBLEM TO BE SOLVED: To provide a recovery ring from which a used tape wound around the recovery ring in component mounting can be easily removed, and a recovery method.
SOLUTION: Separation parts 52 for separating one annular portion are provided in the recovery ring 51. The separation parts 52 are shifted from each other along the axial direction of the recovery ring 51 by using flexibility of the recovery ring 51, and clamping force by a used tape wound around a winding face 51a is released. Alternatively, the recovery ring 51 comprises a pair of semicircular members 51A, 51B and a pair of connectors 58 connecting the members 51A, 51B so as to bend them. By a plane vertical to an axis of the recovery ring 51, the recovery ring 51 is made bendable, and by its bending, the clamping force by the used tape is released. Preferably, the connectors 58 are provided in the vicinity of either one of side faces in the width direction of the recovery ring 51.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以容易地除去在部件安装中缠绕在回收环周围的用过的带的回收环和回收方法。解决方案：用于分离一个环形部分的分离部分52设置在回收环51中。通过使用回收环51的柔性，分离部分52沿着回收环51的轴向方向彼此偏移，并且夹紧释放卷绕在绕线面51a上的用过的磁带的力。或者，恢复环51包括一对半圆形构件51A，51B和连接构件51A，51B以使其弯曲的一对连接器58。通过与回收环51的轴线垂直的平面，回收环51可弯曲，并且通过其弯曲，释放了用过的带的夹紧力。优选地，连接器58设置在回收环51的宽度方向上的任一个侧面附近。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2003179396A BOARD SUPPORT METHOD, BOARD SUPPORT DEVICE, AND COMPONENT MOUNTING UNIT 审中-公开
公开(公告)号：JP2003179396A
公开(公告)日：2003-06-27
申请号：JP2001375963
申请日：2001-12-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAITO SUSUMU , MATSUMOTO KUNIYO , SAKAI KAZUNOBU
IPC分类号： H05K13/04 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a board support method, a board support device, and a component mounting unit which are capable of effectively restraining a board from vibrating when an electronic component is mounted on the board such as a circuit board. SOLUTION: When a circuit board 1 is pinched by the ends and supported from below, support members 49A and 49B which are formed of soft and elastic material and each provided with a dimple (recess) 50 are pressed against the underside of the circuit board 1 to suck up and support the circuit board 1. Instead of the formation of a dimple on the top surface of a support member, the support member may be formed of visco-elastic material. COPYRIGHT: (C)2003,JPO

7. 发明专利

JPH11145611A PRINTED BOARD MANUFACTURING DEVICE 失效
公开(公告)号：JPH11145611A
公开(公告)日：1999-05-28
申请号：JP30625297
申请日：1997-11-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMOTO KUNIYO , NONOMURA MASARU , ABE TOSHIHIRO , CHIKAHISA NAOICHI
IPC分类号： H05K3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To make it possible to stabilize the temperature of a furnace in a short time when the temperature in heating zones in the furnace is changed to a low temperature, by a method wherein current conduction to a heater to raise the temperature in the zones is turned off extending over a specified time to set the temperature in the zones to a target temperature subsequent to a change on of the set temperature in the zones or the temperature in the vicinity of the target temperature. SOLUTION: An air blower unit is continuously operated from a state H of high set temperature T1 in heating zones in a furnace to reach a stable state K of the low set temperature in the zones via J during the change of the set temperature, and a hot air generating heater is completely turned off extending over a specified time (t). By controlling the air blower unit at the time of the change of the set temperature in such a way, the temperature change in the zones makes the outside air continue to flow in the zones by the air blower unit to reduce rapidly the temperature in the zones. After the temperature in the zones is reduced from a low set temperature T2 subsequent to the change of the set temperature to a low temperature by T3, current conduction to the heater is reopened to make the temperature in the zones come close to the target set temperature T2. As a result, the temperature of the furnace can be stabilized in the state K of the low set temperature in a short time.

8. 发明专利

JPH10209628A REFLOW EQUIPMENT 失效
公开(公告)号：JPH10209628A
公开(公告)日：1998-08-07
申请号：JP1273497
申请日：1997-01-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMOTO KUNIYO , ABE TOSHIHIRO , NONOMURA MASARU , CHIKAHISA NAOICHI
IPC分类号： F27B9/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow equipment which allows the degree of freedom to be increased with respect to the time base of a temperature profile, and the requirements of the temperature profile to be met. SOLUTION: A reflow equipment 1 comprises a conveyor 3 for transporting substrates 10 and a furnace 2 for heating the substrates 10. In this reflow equipment, the zones 5-8 in the furnace to be set to different temperature conditions are constituted of one or more furnace units 4. The furnace 2 is composed by coupling these furnace units 4 with one another. The furnace 2 may be composed by coupling with one another zone units comprising a unit conveyor which conveys substrates an arbitrary conveying speed, and a unit furnace for heating the substrates.

9. 发明专利

JPH09214123A REFLOW EQUIPMENT 失效
公开(公告)号：JPH09214123A
公开(公告)日：1997-08-15
申请号：JP1961396
申请日：1996-02-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE TOSHIHIRO , MATSUDA CHUICHI , MATSUMOTO KUNIYO , CHIKAHISA NAOICHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce imperfect soldering caused by delivery difference of heat which turns to temperature irregularity on a printed board. SOLUTION: A coil type heater 8 is arranged in a duct 7, and a straightening region 10 where two slit type nozzles 9 whose directions are different by 90 deg. to the circulation direction of atmosphere are alternately arranged is formed in the outlet of the duct 7. The atmosphere which has passed the straightening region 10 is jetted against a printed board, at a uniform wind velocity of 3-5m/sec. A lower surface heating part having a plate provided with a plurality of hot air jetting ports is installed under a rail 14. Hot air jetted from the lower surface heating part is branched from the middle part of a circulation path of the atmosphere of the heating part and supplied. Heating is performed by arranging a second heater just in front of the plate 17. The hot air capable of imparting temperature gradient is jetted at a velocity of 4-5m/sec.

10. 发明专利

JP2000188465A HEATING DEVICE AND METHOD 失效
公开(公告)号：JP2000188465A
公开(公告)日：2000-07-04
申请号：JP29095199
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NONOMURA MASARU , ABE TOSHIHIRO , NAGAFUKU NOBUYASU , MATSUMOTO KUNIYO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce power consumption when the heat treatment to a body to be joined is not required by reducing the amount of gas supply heat when the heat treatment of an object to be heated is not required as compared with a case when the heat treatment is required by a device for controlling the amount of gas supply heat. SOLUTION: A circuit substrate 2 that is a body to be joined where parts 2a are placed on cream solder is carried from an inlet to an outlet by a transport part 3. The transport part 3 is contained and a heating gas is supplied via a heater 9c. A heating chamber 7a is provided for supplying a gas with a specific flow rate and temperature onto the body to be joined as a heat source and for heating and melting an object to be heated such as solder on the body to be joined. In the starting/preparing process of a reflow device, the temperature of heated air in each chamber is controlled by controlling the heater 9c via a temperature controller 20 with a controller 21 that is joined to a temperature-monitoring sensor 17c corresponding to the heat content of the circuit substrate 2. When the circuit substrate 2 is not subjected to reflow treatment, the temperature of each chamber is maintained at a lower temperature than a specific heat-treatment temperature.

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