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    • 1. 发明专利
    • Component lot trace method
    • 组件追踪方法
    • JP2005332278A
    • 2005-12-02
    • JP2004151003
    • 2004-05-20
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • SHIMODA RIICHIKANEMATSU KOICHI
    • G05B19/418G06Q50/00G06Q50/04G06F17/60
    • Y02P90/14Y02P90/30
    • PROBLEM TO BE SOLVED: To reduce the time and cost loss required for defect extraction by quickly specifying commodities using defective components in the case of the occurrence of a defect in a manufacturing process. SOLUTION: Linking information between component lot numbers and serial numbers is stored, and a lot number of a component is extracted from a serial number and component position information which relate to the occurrence of a defect, and a commodity using the component of the lot number is extracted, so that a defective commodity is quickly specified and a countermeasure can be quickly taken. Information such as component lot numbers and serial numbers is read by utilizing bar codes or two-dimensional codes. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:通过在制造过程中发生缺陷的情况下通过使用缺陷部件快速指定商品来减少缺陷提取所需的时间和成本损失。

      解决方案:存储组件批号和序列号之间的链接信息,并且从与缺陷的发生有关的序列号和组件位置信息中提取大量的组件,以及使用组件批号 提取批号,从而快速指定有缺陷的商品,并且可以快速采取对策。 通过使用条形码或二维码读取诸如组件批号和序列号的信息。 版权所有(C)2006,JPO&NCIPI

    • 4. 发明专利
    • PACKAGING PLANT OPERATION SUPPORT SYSTEM
    • JPH1079598A
    • 1998-03-24
    • JP23221296
    • 1996-09-02
    • MATSUSHITA ELECTRIC IND CO LTD
    • OKADA YASUHIROSATO KENICHIOBARA TAKESHIKANEMATSU KOICHI
    • B23P21/00H05K13/00
    • PROBLEM TO BE SOLVED: To enable a packaging plant operation support system to output an operation condition examination result and a packaging cost examination result of high accuracy in a short time by a method, wherein a packaging cost examination algorithm and an optimal operating condition examination algorithm which calculate the mounting cost in the current operation condition from data concerning a labor cost, a cost of equipment, and an expense are provided. SOLUTION: A packaging plant operation support system 1 is equipped with an operating condition data base 2, a labor cost data base 3, an equipment cost data base 4, an expense data base 5, an optimal operating condition examination algorithm 6, and a packaging cost examination algorithm 7. By the use of the packaging cost examination algorithm 7, the component factors of a packaging cost, labor cost, cost of equipment, and expenses in a current operating conditions are accurately calculated. Packaging costs in various operating conditions are compared with each other by the use of the calculated data, the operating condition data base 2, and the optimal operating condition examination algorithm 6. Required minimum data are inputted, but data and algorithms are optionally and additionally inputted, so as to improve examination accuracy, if any.
    • 9. 发明专利
    • Packaging quality factor analysis method
    • 包装质量因子分析方法
    • JP2005286015A
    • 2005-10-13
    • JP2004096295
    • 2004-03-29
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • HISATAKE YOICHIKANEMATSU KOICHISHIMODA RIICHIYOKOMORI TADASHI
    • H05K3/34H05K13/08
    • PROBLEM TO BE SOLVED: To analyze various failure factors by performing comparative analysis for the result of a preceding process in a packaging process and to stabilize quality by restraining quality defect. SOLUTION: The method has a function 2 for narrowing down a process which is considered as a factor based on repair result which is quality final information in the packaging process, a function 3 for narrowing down a process and a failure factor by comparing to the inspection result of the preceding process based on a component name and a lead number and a function 4 for narrowing down the failure factor the process based on inspection measurement result. Since quality defect can be restrained by investigating the true factor of generated failures, quality is stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:通过对包装过程中的前述处理的结果进行比较分析并通过抑制质量缺陷来稳定质量来分析各种故障因素。 解决方案:该方法具有功能2,用于缩小被认为是基于作为包装过程中的质量最终信息的修复结果的因子的过程,用于缩小处理的功能3和通过比较的故障因子 基于组件名称和引线号的前述处理的检查结果以及基于检查测量结果来缩小故障因子的功能4。 由于通过调查产生故障的真实因素可以抑制质量缺陷,质量稳定。 版权所有(C)2006,JPO&NCIPI
    • 10. 发明专利
    • Circuit board, circuit board manufacturing method, electronic component packaging system
    • 电路板电路板制造方法,电子元器件包装系统
    • JP2005243796A
    • 2005-09-08
    • JP2004049670
    • 2004-02-25
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KANEMATSU KOICHIYOKOMORI TADASHI
    • H05K13/04H05K3/34H05K3/46H05K13/08
    • PROBLEM TO BE SOLVED: To obtain information stored in a storage element with no contact, and to enlarge the area of a region on a base body available for packaging electronic components.
      SOLUTION: The circuit board 1 comprises a base body 11 formed with a multilayer wiring pattern, a storage element 13 and a plurality of electronic components 12 packaged on the base body 11, and a antenna 14 electrically connected to the storage element 13 and used for reading the information stored in the storage element 13. On the circuit board 1, information stored in the storage element 13 can be obtained via the antenna 14 without contact. The storage element 13 used in the base body 11 is smaller than a bar code, or the like, and the antenna 14 is provided internally, thus making it possible to enlarge the area of the region on the base body 11 available for packaging electronic components 12. In the process of manufacturing the circuit board 1, the storage element 13 is packaged together with the electronic components 12, thus making it possible to simplify the process for packaging.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:获得存储在不接触的存储元件中的信息,并且扩大可用于包装电子部件的基体上的区域的面积。 解决方案:电路板1包括形成有多层布线图案的基体11,封装在基体11上的存储元件13和多个电子部件12以及与存储元件13电连接的天线14 并且用于读取存储在存储元件13中的信息。在电路板1上,可以经由天线14获得存储在存储元件13中的信息而不接触。 在基体11中使用的存储元件13小于条形码等,并且天线14设置在内部,从而可以扩大可用于包装电子部件的基体11上的区域的面积 在制造电路板1的过程中,存储元件13与电子部件12一起封装,从而可以简化封装工艺。 版权所有(C)2005,JPO&NCIPI