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    • 1. 发明授权
    • Apparatus and methods for uniform scan dispensing of spin-on materials
    • 用于均匀扫描分配旋涂材料的装置和方法
    • US06317642B1
    • 2001-11-13
    • US09191438
    • 1998-11-12
    • Lu YouDawn HopperChristof StreckJohn PellerinRichard J. Huang
    • Lu YouDawn HopperChristof StreckJohn PellerinRichard J. Huang
    • G06F1900
    • H01L21/6715B05D1/005
    • This invention describes improved apparatus and methods for spin-on deposition of semiconductor thin films. The improved apparatus provides for controlled temperature, pressure and gas compositions within the deposition chamber. The improved methods comprise dispensing of solutions containing thin film precursor via a moveable dispensing device and the careful regulation of the pattern of deposition of the precursor solution onto the wafer. The invention also comprises the careful regulation of deposition variables including dispensation time, wafer rpm, stop time and rates of wafer rotation. In one embodiment, the precursor solution is dispensed from the outer edge of the wafer toward the center. In alternative embodiments, processors regulate the movement of the dispensing arm and the precursor pump to provide an evenly dispensed layer of precursor solution. The invention also describes improved methods for evaporating solvents and curing thin films. The methods of this invention enable the production of spin-on thin films, which have more even film thickness and uniformity. The semiconductor thin films produced by the methods of this invention are useful for the manufacture of semiconductor devices comprising interlevel dielectric materials.
    • 本发明描述了用于半导体薄膜的旋涂沉积的改进的装置和方法。 改进的装置提供沉积室内的受控温度,压力和气体组成。 改进的方法包括通过可移动的分配装置分配含有薄膜前体的溶液,以及仔细调节前体溶液沉积在晶片上的图案。 本发明还包括仔细调节沉积变量,包括分配时间,晶片转速,停止时间和晶片旋转速率。 在一个实施方案中,前体溶液从晶片的外边缘向中心分配。 在替代实施例中,处理器调节分配臂和前驱泵的运动,以提供均匀分配的前体溶液层。 本发明还描述了用于蒸发溶剂和固化薄膜的改进方法。 本发明的方法能够生产具有更均匀的膜厚度和均匀性的旋涂薄膜。 通过本发明的方法生产的半导体薄膜可用于制造包括层间电介质材料的半导体器件。
    • 5. 发明授权
    • Replacement metal gate transistors with reduced gate oxide leakage
    • 替代金属栅极晶体管,栅极氧化物泄漏减少
    • US08053849B2
    • 2011-11-08
    • US11269745
    • 2005-11-09
    • James PanJohn Pellerin
    • James PanJohn Pellerin
    • H01L21/02
    • H01L21/28008H01L21/28088H01L21/28238H01L29/495H01L29/4966H01L29/513H01L29/517H01L29/66545
    • Thin effective gate oxide thickness with reduced leakage for replacement metal gate transistors is achieved by forming a protective layer between the gate oxide layer and metal gate electrode, thereby reducing stress. Embodiments include forming a protective layer of amorphous carbon containing metal carbides decreasing in concentration from the metal gate electrode toward the gate oxide layer across the protective layer. Embodiments of methodology include removing the removable gate, depositing a layer of amorphous carbon on the gate oxide layer, forming the metal gate electrode and then heating at an elevated temperature to diffuse metal from the metal gate electrode into the amorphous carbon layer, thereby forming the metal carbides. Embodiments also include metal gate transistors with a gate oxide layer having a high dielectric constant and silicon concentrated at the interfaces with the metal gate electrode and substrate.
    • 通过在栅极氧化层和金属栅电极之间形成保护层来实现用于替换金属栅极晶体管的具有减小的泄漏的薄的有效栅极氧化物厚度,从而降低应力。 实施例包括形成从金属栅电极朝向保护层的栅极氧化物层浓缩的含有金属碳化物的非晶碳保护层。 方法的实施例包括去除可移除栅极,在栅极氧化物层上沉积无定形碳层,形成金属栅电极,然后在升高的温度下加热以使金属从金属栅电极扩散到无定形碳层中,从而形成 金属碳化物。 实施例还包括具有高介电常数的栅极氧化物层和在与金属栅电极和衬底的界面处集中的硅的金属栅极晶体管。
    • 6. 发明授权
    • Replacement metal gate transistors with reduced gate oxide leakage
    • 替代金属栅极晶体管,栅极氧化物泄漏减少
    • US08445975B2
    • 2013-05-21
    • US13290275
    • 2011-11-07
    • James PanJohn Pellerin
    • James PanJohn Pellerin
    • H01L21/02
    • H01L21/28008H01L21/28088H01L21/28238H01L29/495H01L29/4966H01L29/513H01L29/517H01L29/66545
    • A semiconductor device has a substrate, a gate dielectric layer, and a metal gate electrode on the gate dielectric layer. The gate dielectric layer includes an oxide layer having a dielectric constant (k) greater than 4, and silicon concentrated at interfaces of the oxide layer with the substrate and with the metal gate electrode. A method of fabricating a semiconductor device includes forming a removable gate over a substrate with a gate dielectric layer between the removable gate and the substrate, forming a dielectric layer over the substrate and exposing an upper surface of the removable gate, removing the removable gate leaving an opening in the dielectric layer, forming a protective layer on the gate dielectric layer and lining the opening, and forming a metal gate electrode in the opening. The protective layer has a graded composition between the gate dielectric layer and the metal gate electrode.
    • 半导体器件在栅极电介质层上具有衬底,栅极电介质层和金属栅电极。 栅极电介质层包括介电常数(k)大于4的氧化物层,并且硅集中在氧化物层与衬底和金属栅电极的界面处。 一种制造半导体器件的方法包括在衬底上形成可移除栅极,在可移除栅极和衬底之间具有栅极电介质层,在衬底上形成电介质层并露出可移除栅极的上表面,去除可移除栅极离开 在电介质层中形成开口,在栅极电介质层上形成保护层并衬套开口,并在开口中形成金属栅电极。 保护层在栅极电介质层和金属栅电极之间具有渐变组成。
    • 7. 发明申请
    • REPLACEMENT METAL GATE TRANSISTORS WITH REDUCED GATE OXIDE LEAKAGE
    • 更换具有减少栅极氧化物泄漏的金属栅极晶体管
    • US20120049196A1
    • 2012-03-01
    • US13290275
    • 2011-11-07
    • James PanJohn Pellerin
    • James PanJohn Pellerin
    • H01L29/786H01L21/28
    • H01L21/28008H01L21/28088H01L21/28238H01L29/495H01L29/4966H01L29/513H01L29/517H01L29/66545
    • A semiconductor device has a substrate, a gate dielectric layer, and a metal gate electrode on the gate dielectric layer. The gate dielectric layer includes an oxide layer having a dielectric constant (k) greater than 4, and silicon concentrated at interfaces of the oxide layer with the substrate and with the metal gate electrode. A method of fabricating a semiconductor device includes forming a removable gate over a substrate with a gate dielectric layer between the removable gate and the substrate, forming a dielectric layer over the substrate and exposing an upper surface of the removable gate, removing the removable gate leaving an opening in the dielectric layer, forming a protective layer on the gate dielectric layer and lining the opening, and forming a metal gate electrode in the opening. The protective layer has a graded composition between the gate dielectric layer and the metal gate electrode.
    • 半导体器件在栅极电介质层上具有衬底,栅极电介质层和金属栅电极。 栅极电介质层包括介电常数(k)大于4的氧化物层,并且硅集中在氧化物层与衬底和金属栅电极的界面处。 一种制造半导体器件的方法包括在衬底上形成可移除栅极,在可移除栅极和衬底之间具有栅极电介质层,在衬底上形成电介质层并露出可移除栅极的上表面,去除可移除栅极离开 在电介质层中形成开口,在栅极电介质层上形成保护层并衬套开口,并在开口中形成金属栅电极。 保护层在栅极电介质层和金属栅电极之间具有渐变组成。
    • 9. 发明申请
    • Replacement metal gate transistors with reduced gate oxide leakage
    • 替代金属栅极晶体管,栅极氧化物泄漏减少
    • US20070102776A1
    • 2007-05-10
    • US11269745
    • 2005-11-09
    • James PanJohn Pellerin
    • James PanJohn Pellerin
    • H01L29/78H01L21/4763
    • H01L21/28008H01L21/28088H01L21/28238H01L29/495H01L29/4966H01L29/513H01L29/517H01L29/66545
    • Thin effective gate oxide thickness with reduced leakage for replacement metal gate transistors is achieved by forming a protective layer between the gate oxide layer and metal gate electrode, thereby reducing stress. Embodiments include forming a protective layer of amorphous carbon containing metal carbides decreasing in concentration from the metal gate electrode toward the gate oxide layer across the protective layer. Embodiments of methodology include removing the removable gate, depositing a layer of amorphous carbon on the gate oxide layer, forming the metal gate electrode and then heating at an elevated temperature to diffuse metal from the metal gate electrode into the amorphous carbon layer, thereby forming the metal carbides. Embodiments also include metal gate transistors with a gate oxide layer having a high dielectric constant and silicon concentrated at the interfaces with the metal gate electrode and substrate.
    • 通过在栅极氧化层和金属栅电极之间形成保护层来实现用于替换金属栅极晶体管的具有减小的泄漏的薄的有效栅极氧化物厚度,从而降低应力。 实施例包括形成从金属栅电极朝向保护层的栅极氧化物层浓缩的含有金属碳化物的非晶碳保护层。 方法的实施例包括去除可移除栅极,在栅极氧化物层上沉积无定形碳层,形成金属栅电极,然后在升高的温度下加热以使金属从金属栅电极扩散到无定形碳层中,从而形成 金属碳化物。 实施例还包括具有高介电常数的栅极氧化物层和在与金属栅电极和衬底的界面处集中的硅的金属栅极晶体管。