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    • 6. 发明申请
    • Gas Sensor And Flip-Chip Method For Its Manufacture
    • 气体传感器和倒装芯片的制造方法
    • US20110147803A1
    • 2011-06-23
    • US13002188
    • 2009-05-04
    • Stefan HenneckRalf Schmidt
    • Stefan HenneckRalf Schmidt
    • H01L23/58H01L21/00
    • G01N27/4141
    • A sensor element is described that includes at least one semiconductor component having a gas-sensitive layer which is attached to a substrate by the flip-chip method, the gas-sensitive layer facing the substrate and a supply arrangement being provided to supply a gas to be examined to the gas-sensitive layer. The semiconductor component is enclosed in a casing. Also described is a method for manufacturing the sensor element, in which a semiconductor component having a gas-sensitive layer is attached by the flip-chip method to a substrate in such a way that the gas-sensitive layer faces the substrate. After that, the casing is applied by a plasma sputtering method, in particular an atmospheric plasma sputtering method. Finally, a use of the sensor element in the exhaust system of an internal combustion engine is also described.
    • 描述了一种传感器元件,其包括至少一个半导体部件,其具有通过倒装芯片方法附接到基板的气敏层,面向基板的气体敏感层和供应装置,以将气体供应到 检查气敏层。 半导体部件被封装在壳体中。 还描述了一种用于制造传感器元件的方法,其中通过倒装芯片法将具有气敏层的半导体部件以气敏层面向基板的方式附着到基板上。 之后,通过等离子溅射法,特别是大气等离子体溅射法施加套管。 最后,还描述了在内燃机的排气系统中使用传感器元件。