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    • 1. 发明授权
    • Methods of fabricating devices including source/drain region with abrupt junction profile
    • 制造器件的方法包括具有突变结型材的源极/漏极区域
    • US08679910B2
    • 2014-03-25
    • US13218547
    • 2011-08-26
    • Li MingSangpil SimKang-ill SeoChangwoo OhDongil Bae
    • Li MingSangpil SimKang-ill SeoChangwoo OhDongil Bae
    • H01L21/00
    • H01L21/823807H01L21/823814
    • Provided are methods of fabricating a semiconductor device including a metal oxide semiconductor (MOS) transistor. The methods include forming a gate pattern on a semiconductor substrate. The semiconductor substrate is etched using the gate pattern as an etching mask to form a pair of active trenches spaced apart from each other in the semiconductor substrate. Epitaxial layers are formed in the active trenches, respectively. The respective epitaxial layers are formed by sequentially stacking first and second layers. The first and second layers are formed of a semiconductor layer having a lattice constant greater than the semiconductor substrate, and a composition ratio of the second layer is different from that of the first layer. Semiconductor devices having the first and second layers are also provided.
    • 提供制造包括金属氧化物半导体(MOS)晶体管的半导体器件的方法。 所述方法包括在半导体衬底上形成栅极图案。 使用栅极图案作为蚀刻掩模蚀刻半导体衬底,以在半导体衬底中形成彼此间隔开的一对有源沟槽。 分别在有源沟槽中形成外延层。 通过依次层叠第一层和第二层形成各个外延层。 第一层和第二层由具有大于半导体衬底的晶格常数的半导体层形成,并且第二层的组成比不同于第一层的组成比。 还提供具有第一和第二层的半导体器件。
    • 4. 发明申请
    • INTEGRATED JUNCTION AND JUNCTIONLESS NANOTRANSISTORS
    • 集成连接和无连接的纳米器件
    • US20140145273A1
    • 2014-05-29
    • US14088650
    • 2013-11-25
    • Sung-Dae SukChangwoo OhSungil Park
    • Sung-Dae SukChangwoo OhSungil Park
    • H01L27/088
    • H01L27/0924H01L21/823412H01L21/823431H01L21/823807H01L21/823821H01L27/0883H01L27/0886H01L27/0922
    • Semiconductor devices including a first transistor and a second transistor are integrated on a substrate. Each of the first and second transistors include a nano-sized active region including source and drain regions provided in respective end portions of the nano-sized active region and a channel forming region provided between the source and drain regions. The source and drain regions of the first transistor have the same conductivity type as those of the second transistor, and the second transistor has a threshold voltage lower than that of the first transistor. The channel forming region of the second transistor may include a homogeneously doped region, whose conductivity type is the same as the source and drain regions of the second transistor and is different from the channel forming region of the first transistor.
    • 包括第一晶体管和第二晶体管的半导体器件集成在基板上。 第一和第二晶体管中的每一个包括纳米尺寸的有源区,其包括设置在纳米尺寸有源区的相应端部中的源极和漏极区以及设置在源极和漏极区之间的沟道形成区。 第一晶体管的源极和漏极区域具有与第二晶体管相同的导电类型,并且第二晶体管具有低于第一晶体管的阈值电压的阈值电压。 第二晶体管的沟道形成区域可以包括均匀掺杂区域,其导电类型与第二晶体管的源极和漏极区域相同,并且与第一晶体管的沟道形成区域不同。