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1. 发明授权

US06891116B2 Substrate with liquid electrode 失效
标题翻译：基板与液体电极
公开(公告)号：US06891116B2
公开(公告)日：2005-05-10
申请号：US10414128
申请日：2003-04-14
申请人： Lewis R. Dove , Marvin Glenn Wong , Mitsuchika Saito
发明人： Lewis R. Dove , Marvin Glenn Wong , Mitsuchika Saito
IPC分类号： H01H29/28 , H01H29/00
CPC分类号： H01H29/28 , H01H2029/008
摘要： A substrate, a method for producing a substrate, and a switch incorporating a substrate are disclosed. In one embodiment, the substrate has a first layer, a first electrode deposited on the first layer, and a second layer mated to the first layer. The second layer defines a duct leading from the first electrode to a surface of the second layer opposite the first electrode. A liquid electrode fills at least a portion of the duct.
摘要翻译：公开了一种基板，一种基板的制造方法和一种结合有基板的开关。在一个实施例中，衬底具有第一层，沉积在第一层上的第一电极和与第一层配合的第二层。第二层限定从第一电极引导到与第一电极相对的第二层的表面的导管。液体电极填充管道的至少一部分。

2. 发明授权

US06841746B2 Bent switching fluid cavity 失效
标题翻译：弯曲开关流体腔
公开(公告)号：US06841746B2
公开(公告)日：2005-01-11
申请号：US10414343
申请日：2003-04-14
申请人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
发明人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
IPC分类号： H01H29/28 , H01H61/00 , H01H29/00
CPC分类号： H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.
摘要翻译：一种具有第一和第二配合基板的开关，其在弯曲开关流体腔的第一和第二相交通道之间限定它们。开关流体保持在弯曲的开关流体腔内，并响应于施加到开关流体的力而在第一和第二开关状态之间移动。更多的开关流体在第一开关状态下被迫进入第一相交通道，并且在第二开关状态下，更多的开关流体被迫进入相交通道中的第二个。

3. 发明授权

US06825429B2 Hermetic seal and controlled impedance RF connections for a liquid metal micro switch 失效
标题翻译：用于液态金属微动开关的密封和阻抗RF连接
公开(公告)号：US06825429B2
公开(公告)日：2004-11-30
申请号：US10403743
申请日：2003-03-31
申请人： Lewis R. Dove , Marvin Glenn Wong
发明人： Lewis R. Dove , Marvin Glenn Wong
IPC分类号： H01H904
CPC分类号： H01H29/28 , H01H2029/008
摘要： One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint. In case (b) the cover block may be soldered to dielectric layer. In another embodiment for cases (a) and (b) glass frit is used in place of solder. Disturbances to signal line impedance may be compensated by changes in signal conductor width. The layer of suitable dielectric material may be a thin sheet or gasket of previously patterned ceramic material, or it may be formed by the application of a thick film paste. Suitable thick film dielectric materials deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141 A/D thick film compositions from DuPont.
摘要翻译：可能具有相同表面信号导体的衬底上的一个或多个LIMMS器件通过以下方式密封：（a）将每个整个LIMMS器件封闭在与LIMMS器件分开的通用或相应的外盖下方，并且不可渗透污染物或（b）制造每个LIMMS装置，使其单独的盖块（其已经是LIMMS的部件并且不是单独的外盖）可以与衬底气密密封。每种情况都必须限制气密密封对阻抗的影响。在（a）的情况下，衬底被与分离的外盖的周边的带状足迹相匹配的介电材料层覆盖。在（b）的情况下，衬底上的LIMMS覆盖块的整个（实心）占地面积接收一层电介质材料，该材料层本身可以用合适的粘合剂在其周边附近被覆盖。在（a）的情况下，外盖可以焊接到周边覆盖区。在（b）的情况下，盖块可以焊接到电介质层。在（a）和（b）的情况的另一实施例中，使用玻璃料代替焊料。信号线阻抗的干扰可以通过信号导体宽度的变化来补偿。合适的介电材料层可以是先前图案化的陶瓷材料的薄片或垫片，或者可以通过施加厚膜糊形成。作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

4. 发明授权

US06894237B2 Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch 失效
标题翻译：信号路径的形成，以增加基于流体的开关的最大信号承载频率
公开(公告)号：US06894237B2
公开(公告)日：2005-05-17
申请号：US10413855
申请日：2003-04-14
申请人： Marvin Glenn Wong , Julius K. Botka , Lewis R. Dove
发明人： Marvin Glenn Wong , Julius K. Botka , Lewis R. Dove
IPC分类号： H01H59/00 , H01H29/00 , H01H29/30
CPC分类号： H01H29/30 , H01H29/004 , H01H2029/008
摘要： A switch has a channel plate that defines at least a portion of a number of cavities. A switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid. A plurality of planar signal conductors extend from edges of the switch to within the one or more cavities holding the switching fluid, and are in wetted contact with the switching fluid. Corners in paths of the planar signal conductors may be limited to greater than 90°, about 135°, or equal to or greater than 135°. In one embodiment, signal path corners are so limited, but the planar signal conductors do not extend to the edges of the switch. In another embodiment, the one or more cavities holding the switching fluid are at least partly defined by a bent switching fluid channel.
摘要翻译：开关具有限定多个空腔的至少一部分的通道板。开关流体保持在一个或多个空腔内，并且响应于施加到开关流体的力，可在至少第一和第二开关状态之间移动。多个平面信号导体从开关的边缘延伸到保持开关流体的一个或多个空腔内，并与开关流体接触。平面信号导体的路径中的角可以限制在大于90°，大约135°或等于或大于135°。在一个实施例中，信号路径角受到限制，但是平面信号导体不延伸到开关的边缘。在另一个实施例中，保持开关流体的一个或多个空腔至少部分地由弯曲的开关流体通道限定。

5. 发明授权

US06759610B1 Multi-layer assembly of stacked LIMMS devices with liquid metal vias 失效
标题翻译：具有液态金属通孔的堆叠LIMMS器件的多层组装
公开(公告)号：US06759610B1
公开(公告)日：2004-07-06
申请号：US10455031
申请日：2003-06-05
申请人： Lewis R. Dove , Marvin Glenn Wong
发明人： Lewis R. Dove , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H29/28 , H01H2029/008
摘要： The number of LIMMS devices in an assembly is increased by stacking multiple layers of LIMMS devices on top of one another, and interconnecting those device layers at an array of solder pads using solder balls. Each device layer uses vias to bring the needed conductors to the array of solder pads. All signals for the entire multi-layer assembly can be routed through the bottom LIMMS device layer to pass, through another array of solder pads onto a “mother substrate” of ceramic or other material that carries the multi-layer assembly. Alternatively, signals may enter or leave the upper LIMMS device layer by way of a flexible printed circuit harness. Vias may pass, either directly or by “dog legs” on interior surfaces, completely through the bottom LIMMS device layer, and through other device layers as needed. Opposing vias formed in the pair of substrates in a device layer have interior non-contacting pads that are bridged by a small ball of liquid metal held in place by a hole in a dielectric layer. Using patterned layers of dielectric to form bridging holes, cavities, channels and interconnecting passages for the LIMMS devices of both layers facilitates these needed vias and traces. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
摘要翻译：组装中LIMMS器件的数量通过将多层LIMMS器件堆叠在一起而增加，并且使用焊球将焊盘阵列上的那些器件层互连在一起。每个器件层使用通孔将所需的导体带到焊盘阵列上。用于整个多层组件的所有信号可以通过底部LIMMS器件层通过另一个焊盘阵列传递到陶瓷或承载多层组件的其它材料的“母体衬底”上。或者，信号可以通过柔性印刷电路线束进入或离开上LIMMS设备层。通孔可以直接或通过内表面上的“狗腿”完全通过底部LIMMS设备层，并根据需要通过其他设备层。在器件层中的一对衬底中形成的相反的通孔具有内部非接触焊盘，其通过由电介质层中的孔保持就位的液体金属的小球桥接。使用图案化的电介质层形成桥接孔，用于两层的LIMMS器件的空腔，通道和互连通道便于这些所需的通孔和迹线。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

6. 发明授权

US05999861A Method and apparatus for computer-aided design of different-sized RF modular hybrid circuits 失效
标题翻译：用于不同尺寸RF模块混合电路的计算机辅助设计的方法和装置
公开(公告)号：US05999861A
公开(公告)日：1999-12-07
申请号：US872285
申请日：1997-06-10
申请人： Lewis R. Dove , Daniel J. Miller
发明人： Lewis R. Dove , Daniel J. Miller
IPC分类号： G06F17/50 , G06F19/00 , G06G7/66
CPC分类号： G06F17/5068
摘要： A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.
摘要翻译：提出了一种用于设计RF模块化混合电路组件的方法和装置。该装置包括基于规则的控制机制，图形用户界面和包括模型前端和后端以及输入/输出实例的RF混合元件库。该方法包括以下步骤：初始化标准化的前平面模型和后平面模型，沿着背面的周边添加输入/输出实例，在前平面上设计混合电路并组合两个平面以得到RF模块混合布局设计。提供RF混合元件的数据库，以促进快速原型设计。然后将最终设计同时发送到光绘图仪和用于印刷厚膜并分别切割PTH的激光子系统。

7. 发明授权

US06809931B2 Heat sink apparatus that provides electrical isolation for integrally shielded circuit 失效
公开(公告)号：US06809931B2
公开(公告)日：2004-10-26
申请号：US10615472
申请日：2003-07-07
申请人： Lewis R. Dove , Marvin G. Wong
发明人： Lewis R. Dove , Marvin G. Wong
IPC分类号： H05K720
CPC分类号： H01L23/552 , H01L23/13 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that the area between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

8. 发明授权

US5504986A Method of manufacturing collinear terminated transmission line structure with thick film circuitry 失效
标题翻译：使用厚膜电路制造共线端接传输线结构的方法
公开(公告)号：US5504986A
公开(公告)日：1996-04-09
申请号：US397594
申请日：1995-03-02
申请人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
发明人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
IPC分类号： H05K1/02 , H01C17/065 , H01C17/242 , H01L23/64 , H01L27/01 , H05K1/09 , H05K1/16 , H05K3/02 , H01C17/06
CPC分类号： H05K1/167 , H01C17/065 , H01C17/242 , H01L23/647 , H01L24/48 , H01L24/49 , H01L27/013 , H01L2224/05624 , H01L2224/05644 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0237 , H05K1/092 , H05K2201/0317 , H05K2201/09236 , H05K2203/049 , H05K2203/171 , H05K3/027
摘要： A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.
摘要翻译：提出了共线终端传输线结构及其制造方法。该结构包括电连接到多个电阻器的多个导体。多个导体中的每一个之间的预定间隔范围为2密耳至7密耳。使用本方法可以容易地实现更大的间隔。该方法包括以下步骤：将电阻丝网丝网印刷到基底上，该条带与多个导体的一端相邻。在将基板浸入溶液中之后，电阻器条被激光修整以形成多个电阻器。然后用温水冲洗底物以除去溶液。该溶液可以是聚乙烯醇和异丙醇混合物。

9. 发明授权

US5426405A Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects 失效
标题翻译：具有微波带宽互连的不同大小的可拆卸混合组合系列
公开(公告)号：US5426405A
公开(公告)日：1995-06-20
申请号：US366000
申请日：1994-12-29
申请人： Daniel J. Miller , Kim H. Chen , Lewis R. Dove , Vaddoarahalli K. Nagesh
发明人： Daniel J. Miller , Kim H. Chen , Lewis R. Dove , Vaddoarahalli K. Nagesh
IPC分类号： H01L23/50 , H01L23/40 , H01P1/02 , H01P3/08 , H01P5/08 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/32 , H05K3/34 , H05K3/36 , H01L23/32
CPC分类号： H01L23/66 , H01L23/4006 , H05K1/141 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K1/0243 , H05K1/0286 , H05K2201/10393 , H05K2201/10477 , H05K2201/10946 , H05K3/325 , H05K3/3421 , H05K3/368
摘要： A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.
摘要翻译：具有高频互连的一系列模块化混合组件由附接到母板的高频电路组件实现。每个组件包括标准化的导电元件和可定制的转变和电路区域。可定制的转换可以放置在导电元件的任何地方，并且能够实现低频和高频性能。组件的附接可以通过标准化的夹紧结构实现，该结构将弹性构件压缩在导电元件上，或通过弯曲导电元件并在端部焊接到主板上的附接位置。模块化混合组件系列的每个成员提供从电路组件上的传输线到主板上的传输线的受控阻抗转变。

10. 发明授权

US07265043B2 Methods for making microwave circuits 失效
标题翻译：制作微波电路的方法
公开(公告)号：US07265043B2
公开(公告)日：2007-09-04
申请号：US11510102
申请日：2006-08-25
申请人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson , Julius Botka
发明人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson , Julius Botka
IPC分类号： H01L21/44
CPC分类号： H05K1/0221 , H01C17/065 , H01L2924/0002 , H01P11/003 , H05K1/0237 , H05K1/053 , H05K1/092 , H05K1/167 , H05K3/06 , H05K3/4664 , H05K2201/09809 , H05K2201/09981 , H05K2203/1476 , H01L2924/00
摘要： Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.
摘要翻译：公开了使用厚膜组件制造微波电路的方法。在一个实施例中，该方法包括在接地平面上沉积电介质，然后在电介质上形成导体。导体通过在电介质上沉积导电厚膜并且然后“导通”导电厚膜形成。在一个实施例中，在子切割之前，将导电厚膜图案化以限定至少一个导体。在另一个实施例中，在子切换之后，将导电厚膜图案化以限定至少一个导体。在再次切割之后，蚀刻导电厚膜以暴露导体，然后在完全烧结温度下对导体进行烧制。

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