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1. 发明申请

US20070121294A1 Multi-element heat exchange assemblies and methods of fabrication for a cooling system 失效
公开(公告)号：US20070121294A1
公开(公告)日：2007-05-31
申请号：US11290757
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28F9/007 , F28D15/00 , F28F7/02 , F28F2260/02 , H05K7/2079
摘要： A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.

2. 发明申请

US20070119569A1 Redundant assembly for a liquid and air cooled module 有权
标题翻译：液体和空气冷却模块的冗余组件
公开(公告)号：US20070119569A1
公开(公告)日：2007-05-31
申请号：US11290899
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.
摘要翻译：提供了一种用于空气和液体冷却模块的冗余组件。冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。辅助抽屉装有热交换器，液体泵具有管道，使得热交换器，具有管道的液体泵和冷却板形成封闭的液体冷却回路。辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

3. 发明申请

US20060250774A1 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold 有权
标题翻译：冷却装置，冷却电子模块及其制造方法采用集成冷却剂入口和出口歧管
公开(公告)号：US20060250774A1
公开(公告)日：2006-11-09
申请号：US11124513
申请日：2005-05-06
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有多个用于将冷却剂喷射到待冷却表面上的多个入口孔的集成冷却剂入口和出口歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。多个出口也设置在歧管的至少一个边缘表面上。这些出口通过歧管与出口开口流体连通，以便冷却剂通过出口开口排出并使通过歧管的压降最小化。所述至少一个边缘表面的至少一个表面平面突起与所述公共表面的表面平面投影相交。

4. 发明申请

US20060126296A1 Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly 有权
标题翻译：一种采用集成热交换组件的电子模块的冷却装置和方法
公开(公告)号：US20060126296A1
公开(公告)日：2006-06-15
申请号：US11008359
申请日：2004-12-09
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20781
摘要： A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.
摘要翻译：一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置，包括密封地接合衬底以形成空腔的外壳，电子设备和热交换组件设置在空腔内。热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。主冷却剂流动路径包括流体连通的第一和第二腔室，并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径，以及在第二室中的主要冷却剂和第三室中的二次冷却剂之间的第二热传导路径。热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。

5. 发明申请

US20060042289A1 Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack 有权
公开(公告)号：US20060042289A1
公开(公告)日：2006-03-02
申请号：US10930079
申请日：2004-08-31
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： F25D21/00 , F25D23/12 , F25D17/02
CPC分类号： H01L23/4275 , F28D20/021 , H01L2924/0002 , H05K7/20654 , Y02E60/145 , H01L2924/00
摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.

6. 发明申请

US20070121295A1 Hybrid liquid-air cooled module 审中-公开
标题翻译：混合液空冷模块
公开(公告)号：US20070121295A1
公开(公告)日：2007-05-31
申请号：US11290898
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , G06F1/20 , G06F2200/201
摘要： A method and incorporated hybrid air and liquid cooled module for cooling electronic components of a computing system is disclosed. The module is used for cooling electronic components and comprise a closed loop liquid cooled assembly in thermal communication with an air cooled assembly, such that the air cooled assembly is at least partially included in the liquid cooled assembly.
摘要翻译：公开了一种用于冷却计算系统的电子部件的方法和并入的混合式空气和液体冷却模块。该模块用于冷却电子部件，并且包括与空气冷却组件热连通的闭环液体冷却组件，使得空气冷却组件至少部分地包括在液体冷却组件中。

7. 发明申请

US20070091570A1 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
标题翻译：冷却装置和方法采用分散的冷板，其顺应地耦合在待冷却的组件的公共歧管和电子部件之间
公开(公告)号：US20070091570A1
公开(公告)日：2007-04-26
申请号：US11258316
申请日：2005-10-25
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/2079
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保良好的热界面。

8. 发明申请

US20060250770A1 Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system 有权
标题翻译：用于使用闭环热交换系统的电子机架的冷却的装置和方法
公开(公告)号：US20060250770A1
公开(公告)日：2006-11-09
申请号：US11124525
申请日：2005-05-06
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing a closed loop heat exchange system. The closed loop heat exchange system includes a first heat exchanger, a second heat exchanger, and a coolant distribution loop connecting the first heat exchanger and the second heat exchanger. When operational, the coolant distribution loop allows coolant to circulate between the first heat exchanger and the second heat exchanger. The closed loop heat exchange system couples to the electronics rack with the first heat exchanger disposed at an air inlet side of the electronics rack, and the first heat exchanger and the second heat exchanger disposed in different inlet-to-outlet air flow paths through the electronics rack to reduce an imbalance in air flow temperature of the different inlet-to-outlet air flow paths through the electronics rack.
摘要翻译：提供了设备和方法，以便于采用闭环热交换系统的电子机架的冷却。闭环热交换系统包括第一热交换器，第二热交换器和连接第一热交换器和第二热交换器的冷却剂分配回路。当操作时，冷却剂分配回路允许冷却剂在第一热交换器和第二热交换器之间循环。闭环热交换系统与设置在电子机架的空气入口侧的第一热交换器耦合到电子机架，并且第一热交换器和第二热交换器设置在不同的入口到出口的气流通道中电子机架，以减少通过电子机架的不同入口到出口气流路径的空气流温度不平衡。

9. 发明申请

US20060065874A1 Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing 有权
公开(公告)号：US20060065874A1
公开(公告)日：2006-03-30
申请号：US10954792
申请日：2004-09-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Donald Porter , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Donald Porter , Roger Schmidt , Robert Simons
IPC分类号： F16K31/00
CPC分类号： H05K7/20772
摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

10. 发明申请

US20070121299A1 Heat transfer apparatus, cooled electronic module and methods of fabrication thereof employing thermally conductive composite fins 审中-公开
标题翻译：传热装置，冷却电子模块及其制造方法采用导热复合翅片
公开(公告)号：US20070121299A1
公开(公告)日：2007-05-31
申请号：US11290756
申请日：2005-11-30
申请人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
发明人： Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L23/473 , H01L23/4735 , H01L2224/16225 , H01L2224/73253 , H01L2924/10253 , H01L2924/00
摘要： A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译：提供了一种传热装置和制造方法，用于便于从发热电子装置中除去热量。传热装置包括具有主表面的导热基底和从主表面延伸的多个导热翅片。导热翅片设置成有助于传导热量，该热传导基底可以是电子设备的一部分或耦合到电子设备的单独结构。至少一些导电翅片是复合结构，每个包括涂覆有第二材料的第一材料，其中第一材料具有第一导热性，第二材料具有第二导热性。在一个实施方案中，导热翅片是引线接合的销翅片，每个是分开的环形销翅片，其分开地引线键合到主表面上，并且间隔小于300微米。

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