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1. 发明申请

US20140071626A1 VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE 有权
标题翻译：具有三维折叠结构的蒸汽冷凝器
公开(公告)号：US20140071626A1
公开(公告)日：2014-03-13
申请号：US13613753
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28D15/02 , B21D53/02 , H05K7/20 , F28D7/00
CPC分类号： H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
摘要翻译：提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与蒸汽冷凝通道。折叠结构包括在片材中具有多个折叠的导热片。片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触冷却液承载通道。蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带频道

2. 发明授权

US07978473B2 Cooling apparatus with cold plate formed in situ on a surface to be cooled 有权
标题翻译：具有冷板的冷却装置在待冷却的表面上原位形成
公开(公告)号：US07978473B2
公开(公告)日：2011-07-12
申请号：US12706912
申请日：2010-02-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20 , H01L23/34
CPC分类号： H01L23/4735 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。

3. 发明申请

US20080278913A1 COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED 审中-公开
标题翻译：冷却装置和冷却电子模块，具有密封的冷却回路管状结构，密封到要冷却的表面的外围
公开(公告)号：US20080278913A1
公开(公告)日：2008-11-13
申请号：US12178033
申请日：2008-07-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28C3/08 , F28F7/00 , H01L23/4735 , H01L2224/73253 , Y10S165/908
摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.
摘要翻译：使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面其中基面被密封到待冷却的表面。

4. 发明授权

US07405936B1 Hybrid cooling system for a multi-component electronics system 有权
标题翻译：用于多组件电子系统的混合冷却系统
公开(公告)号：US07405936B1
公开(公告)日：2008-07-29
申请号：US12055455
申请日：2008-03-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20736 , F28F1/20 , F28F1/22 , H05K7/20009 , H05K7/20554 , H05K7/20772
摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.
摘要翻译：为多组件电子系统提供混合冷却系统和制造方法。该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

5. 发明授权

US07274566B2 Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths 有权
标题翻译：在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置
公开(公告)号：US07274566B2
公开(公告)日：2007-09-25
申请号：US11008732
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F04B17/00
CPC分类号： H05K7/2079
摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
摘要翻译：提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。次级流体流动路径与主冷却剂流动路径分离。流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

6. 发明授权

US08020298B2 Method of fabricating a heat exchanger with angled secondary fins extending from primary fins 失效
标题翻译：制造具有从主翅片延伸的成角度的辅助翅片的热交换器的方法
公开(公告)号：US08020298B2
公开(公告)日：2011-09-20
申请号：US12246545
申请日：2008-10-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： F28F1/126 , F28D2001/0266 , F28D2021/0031 , F28F1/30 , F28F1/32 , F28F2009/228 , G06F1/20 , G06F2200/201 , H01L23/3672 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49359 , Y10T29/49377 , Y10T29/49378 , Y10T29/4938 , H01L2924/00
摘要： A method of fabricating a heat exchanger which includes: obtaining multiple coolant-carrying conduit sections, each having a non-circular cross-section, and first and second main surfaces; providing multiple primary folded fins secured to the conduit sections. Each folded fin includes a solid fin surface with multiple bends defining alternating, U-shaped air-passage channels, and a base surface and a top surface. Each folded fin is secured at the base or top surface to a main surface of a conduit section, and the folded fins have leading and trailing edges relative to airflow direction. The method includes forming a plurality of sets of secondary fins, each set extending from the leading or trailing edge of a respective folded fin at an angle other than 0. At least one conduit section has a first folded fin secured to its first main surface, and a second folded fin secured to its second main surface thereof.
摘要翻译：一种制造热交换器的方法，包括：获得多个具有非圆形横截面的冷却剂承载管段，以及第一和第二主表面; 提供固定到导管部分的多个主折叠翼片。每个折叠翅片包括具有限定交替的U形通气通道的多个弯曲的固体翅片表面，以及基部表面和顶部表面。每个折叠的翅片在基部或顶部表面固定到导管部分的主表面，并且折叠的翅片具有相对于气流方向的前缘和后缘。该方法包括形成多组辅助散热片，每组二次散热片各自以相应的折叠翅片的前缘或后缘以不同于0的角度延伸。至少一个导管段具有固定到其第一主表面上的第一折叠翅片，以及固定到其第二主表面的第二折叠翅片。

7. 发明授权

US07948757B2 Multi-fluid cooling of an electronic device 失效
标题翻译：电子设备的多流体冷却
公开(公告)号：US07948757B2
公开(公告)日：2011-05-24
申请号：US12850099
申请日：2010-08-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01B9/06 , F25D23/12 , B05B7/06
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , Y10S165/908 , Y10T29/49002 , H01L2924/00
摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.
摘要翻译：提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

8. 发明授权

US07518871B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07518871B2
公开(公告)日：2009-04-14
申请号：US12168267
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂供给管分配到冷板以除去由各自的电子元件。

9. 发明申请

US20080310104A1 LIQUID-BASED COOLING APPARATUS FOR AN ELECTRONICS RACK 审中-公开
标题翻译：一种用于电子机架的基于液体的冷却装置
公开(公告)号：US20080310104A1
公开(公告)日：2008-12-18
申请号：US12174826
申请日：2008-07-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20781 , F28F9/0275 , H05K7/20772 , Y10T29/5313
摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.
摘要翻译：提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。该装置包括构造成用于安装到电子机架的双折门组件。门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。单独的连接与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

10. 发明授权

US07420808B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07420808B2
公开(公告)日：2008-09-02
申请号：US11539910
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由各自的电子元件。

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