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4. 发明授权

US5131859A Quick disconnect system for circuit board modules 失效
标题翻译：电路板模块快速断开系统
公开(公告)号：US5131859A
公开(公告)日：1992-07-21
申请号：US666356
申请日：1991-03-08
申请人： Stephen A. Bowen , Melvin C. August , Stephen Cermak, III , David R. Collins , Steven J. Dean , Perry D. Franz , Max C. Logan
发明人： Stephen A. Bowen , Melvin C. August , Stephen Cermak, III , David R. Collins , Steven J. Dean , Perry D. Franz , Max C. Logan
IPC分类号： H01R12/82 , H01R13/00
CPC分类号： H01R12/82 , H01R13/005
摘要： A circuit board module for a supercomputer includes quick connections for power, ground, coolant quick connects, and circuit quick connects. The quick connections provide for insertion of modules with substantial savings in time and effort. The electrical power and ground connections and the liquid coolant connections engage and disengage automatically upon insertion and removal of the modules. The circuit quick connects require only insertion of a camming tool for connection and disconnection. The modules require no bolting or unbolting of clamps or hoses for the various connections.
摘要翻译：用于超级计算机的电路板模块包括电源，接地，冷却剂快速连接和电路快速连接的快速连接。快速连接可以大大节省时间和精力来插入模块。在插入和拆卸模块时，电源和接地连接以及液体冷却液连接自动接合和脱离。电路快速连接仅需要插入凸轮工具进行连接和断开连接。模块不需要用于各种连接的夹具或软管的螺栓连接或拆卸。

5. 发明授权

US4939624A Interconnected multiple circuit module 失效
标题翻译：互连多电路模块
公开(公告)号：US4939624A
公开(公告)日：1990-07-03
申请号：US284912
申请日：1988-12-14
申请人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
发明人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
IPC分类号： H01R12/52 , H05K9/00
CPC分类号： H01R12/523
摘要： An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.
摘要翻译：用于电子设备的改进的多电路模块包括夹在电路板对之间的多个冷板，用于从电路板上取走多余的热量。每个板都设有开放空间，允许电路板与其他冷板之间的电路板通信。电路板之间的电气连接是通过一排金属针来实现的。销被容纳在沿着冷板的深度延伸的穿孔针头中，并且与其他电路板连通的销延伸到连接器块中，该连接器块被放置在一对针头之间。在两个连接器块和针头中设置屏蔽，以防止在其中设置的引脚之间的电子串扰。在一个实施例中，利用了减少安装和断开摩擦的新型销。

6. 发明授权

US4884168A Cooling plate with interboard connector apertures for circuit board assemblies 失效
标题翻译：冷却板，带有电路板组件的板间连接孔
公开(公告)号：US4884168A
公开(公告)日：1989-11-28
申请号：US284992
申请日：1988-12-14
申请人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
发明人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
IPC分类号： H05K7/20
CPC分类号： H05K7/20254
摘要： A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.
摘要翻译：用于散热的冷却板特别适用于印刷电路板堆叠内。冷却板包括流体入口歧管，含有多个散热翅片的流体通道和流体出口歧管。在外部，冷却板具有与附接到冷却板的印刷电路板上的装置的图案基本相同的导热焊盘的图案。冷却板包括用于z轴连接器组件的孔和安装元件，使得附接到冷却板的任一侧的印刷电路板可以电互连。

7. 发明授权

US4700996A ZIE edge connector 失效
标题翻译： ZIE边缘连接器
公开(公告)号：US4700996A
公开(公告)日：1987-10-20
申请号：US916509
申请日：1986-10-08
申请人： Melvin C. August , Stephen A. Bowen , John T. Williams
发明人： Melvin C. August , Stephen A. Bowen , John T. Williams
IPC分类号： H01R24/00 , H01R12/18 , H01R13/193 , H01R13/62
CPC分类号： H01R13/193
摘要： An electrical edge connector (14) of the zero insertion force type includes a pair of opposing blocks (30, 32) defining a longitudinal guideway (34) therebetween. Opposite corresonding pairs of female contacts (52, 54) are disposed in transverse holes in the blocks (30, 32), and male contacts (60) are slidably supported in the female contacts in one block for selective actuation into or out of sliding engagement with the female contacts in the other block responsive to insertion of a slider (36).
摘要翻译：零插入力类型的电边缘连接器（14）包括在其间限定纵向导轨（34）的一对相对的块（30,32）。相对的相对对的阴触头对（52,54）设置在块（30,32）中的横向孔中，并且阳触头（60）可滑动地支撑在一个块中的阴触头中，用于选择性地致动进入或流出滑动接合其中响应于插入滑块（36）的另一块中的阴接触件。

8. 发明授权

US4984993A Two-piece edge ZIF connector with sliding block 失效
标题翻译：带滑块的两片边缘ZIF连接器
公开(公告)号：US4984993A
公开(公告)日：1991-01-15
申请号：US351871
申请日：1989-05-12
申请人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen
发明人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen
IPC分类号： H01R12/89 , H01R13/193
CPC分类号： H01R12/89 , H01R13/193
摘要： An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).
摘要翻译：零插入力型的电端连接器（10）包括一对相对的块（21,40），其中一个块可滑动地安装在壳体（22）中。相对的相对的阴插座（34）和阳销（31）相对地配合安装在相对的块（21,40）上。椅子（22）具有通过纵向端部形成的两组相对设置的窗口。一个块（40）具有穿过其形成的通道，使得块（40）在插入凸轮状滑块装置（70）时被横向推动，从而选择性地接合或分离阳销（31）和阴插座（43））。

9. 发明授权

US5211567A Metallized connector block 失效
标题翻译：金属化连接器块
公开(公告)号：US5211567A
公开(公告)日：1993-05-18
申请号：US725007
申请日：1991-07-02
申请人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen , Gregory W. Pautsch
发明人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen , Gregory W. Pautsch
IPC分类号： H01R43/16
CPC分类号： H01R12/523 , Y10S439/908 , Y10T29/49165 , Y10T29/4922
摘要： A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
摘要翻译：一种完全屏蔽的金属化连接器块，用于电子设备的多个电路模块。电路板之间的电气连接通过穿过块的金属引脚阵列来实现。非导电块上的金属化可以保持在接地或恒定电位，以增加引脚之间的屏蔽，以及将电压和接地层保持在整个模块中的恒定水平。金属化通过插入块中的孔中的非导电衬套与销和电路板绝缘。在一个实施例中，金属化由铜和焊料镀层组成，并且块由液晶聚合物构成。

10. 发明授权

US4628407A Circuit module with enhanced heat transfer and distribution 失效
标题翻译：具有增强传热和分配功能的电路模块
公开(公告)号：US4628407A
公开(公告)日：1986-12-09
申请号：US599688
申请日：1984-04-17
申请人： Melvin C. August , John T. Williams
发明人： Melvin C. August , John T. Williams
IPC分类号： H01L23/36 , H05K1/02 , H05K3/34 , H05K3/42 , H05K7/20
CPC分类号： H05K1/0206 , H01L23/36 , H01L2924/0002 , H05K2201/09054 , H05K2201/09572 , H05K2201/10416 , H05K2201/10689 , H05K2201/10969 , H05K3/341 , H05K3/429
摘要： A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.
摘要翻译：一种具有增强的传热和分布特性的电路模块（10），其特别适用于高速电子数字计算机。电路模块（10）包括具有安装在电路板（28）上的诸如集成电路的多个电子器件（26）的电路板组件（12）。电路板（28）包括导电焊盘（42和44）和电镀通孔（46），其形成从每个电子器件（26）到电路板的相对侧的导热流动路径，用于更有效地传热模块（10）。热垫（42和44）和电镀通孔（46）优选地与电路板（28）的接地平面层（36）连接，以便更好地分配热量。

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