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    • 4. 发明授权
    • Dual contact beam assembly for an IC test fixture
    • 用于IC测试夹具的双接触梁组件
    • US5175496A
    • 1992-12-29
    • US575935
    • 1990-08-31
    • David R. CollinsMary A. NebelBruce A. Strangfeld
    • David R. CollinsMary A. NebelBruce A. Strangfeld
    • G01R1/073G01R31/26
    • H01R12/714G01R1/07357
    • A method and apparatus for real-time testing of a Tape Automated Bonded integrated circuit is described. The apparatus is inserted between a test board and a TAB tape integrated circuit. The beams of the assembly are arranged in a pattern similar to the pattern of the electrical contact pads on the test board and the TAB tape. When axial pressure is applied to the test board, the apparatus and the TAB tape, the beams compress and deform, thereby providing a scrubbing contact between the ends of the beams and the contact pads of the TAB tape and the test board. The beams are short in length thereby providing an electrical connection of virtually no impedance interface between the TAB tape and the test board, thereby allowing the intergrated circuit to be tested at AC speed.
    • 描述了一种用于磁带自动绑定集成电路的实时测试的方法和装置。 该装置插入在测试板和TAB带集成电路之间。 组件的梁以与测试板和TAB带上的电接触垫的图案相似的图案布置。 当对测试板,设备和TAB带施加轴向压力时,梁被压缩和变形,从而在梁的端部与TAB带和测试板的接触垫之间提供擦洗接触。 梁的长度很短,从而在TAB带和测试板之间提供实际上没有阻抗接口的电连接,从而允许集成电路以交流速度进行测试。