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    • 9. 发明授权
    • Real-time control of chemical-mechanical polishing processing by monitoring ionization current
    • 通过监测电离电流实时控制化学机械抛光加工
    • US06251784B1
    • 2001-06-26
    • US09206892
    • 1998-12-08
    • Leping LiJames Albert GilhoolyClifford Owen MorganCong Wei
    • Leping LiJames Albert GilhoolyClifford Owen MorganCong Wei
    • H01L21302
    • B24B37/013B24B49/10H01L21/31053
    • A method and apparatus are described for detecting an endpoint of a film removal process in which a target film overlying a stopping film is removed. A chemical reaction product is generated from at least one of the target film and the stopping film; this chemical reaction product is converted to a separate product. The separate product is exposed to ionizing radiation. The ionization current generated by the radiation is monitored as the target film is removed. A change in the ionization current corresponds to a change in concentration of the separate product, thereby indicating the endpoint of the film removal process. In the particular case of removal of a silicon dioxide film overlying a silicon nitride film by chemical-mechanical polishing, the reaction product is ammonia extracted from the polishing slurry. The ammonia is converted to ammonium chloride by a reaction with hydrogen chloride vapor. As the ammonium chloride, entrained in a carrier gas, is pumped through a detection unit, a change in the concentration thereof is detected by monitoring a change in the ionization current generated by a source of alpha particles.
    • 描述了一种用于检测其中去除覆盖停止膜的目标膜的膜去除过程的端点的方法和装置。 从目标膜和停止膜中的至少一个产生化学反应产物; 该化学反应产物转化为单独的产物。 单独的产品暴露于电离辐射。 当去除靶膜时,监测由辐射产生的电离电流。 电离电流的变化对应于分离产物的浓度变化,从而表明膜去除过程的终点。 在通过化学机械抛光去除覆盖氮化硅膜的二氧化硅膜的特定情况下,反应产物是从抛光浆中提取的氨。 通过与氯化氢蒸气反应将氨转化成氯化铵。 由于夹带在载气中的氯化铵被泵送通过检测单元,通过监测由α粒子源产生的电离电流的变化来检测浓度的变化。