专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06440263B1 Indirect endpoint detection by chemical reaction and chemiluminescence 失效
标题翻译：通过化学反应和化学发光进行间接终点检测
公开(公告)号：US06440263B1
公开(公告)日：2002-08-27
申请号：US09641175
申请日：2000-08-17
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
摘要翻译：通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜时，通过以下步骤之一来检测用于去除覆盖停止膜的目标膜的终点：停止膜和靶膜，将化学反应产物转化成单独的产物，从分离的产物产生激发的分子，并监测当去除靶膜时从激发的分子发射的光的水平。

2. 发明授权

US06251784B1 Real-time control of chemical-mechanical polishing processing by monitoring ionization current 失效
标题翻译：通过监测电离电流实时控制化学机械抛光加工
公开(公告)号：US06251784B1
公开(公告)日：2001-06-26
申请号：US09206892
申请日：1998-12-08
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan , Cong Wei
IPC分类号： H01L21302
CPC分类号： B24B37/013 , B24B49/10 , H01L21/31053
摘要： A method and apparatus are described for detecting an endpoint of a film removal process in which a target film overlying a stopping film is removed. A chemical reaction product is generated from at least one of the target film and the stopping film; this chemical reaction product is converted to a separate product. The separate product is exposed to ionizing radiation. The ionization current generated by the radiation is monitored as the target film is removed. A change in the ionization current corresponds to a change in concentration of the separate product, thereby indicating the endpoint of the film removal process. In the particular case of removal of a silicon dioxide film overlying a silicon nitride film by chemical-mechanical polishing, the reaction product is ammonia extracted from the polishing slurry. The ammonia is converted to ammonium chloride by a reaction with hydrogen chloride vapor. As the ammonium chloride, entrained in a carrier gas, is pumped through a detection unit, a change in the concentration thereof is detected by monitoring a change in the ionization current generated by a source of alpha particles.
摘要翻译：描述了一种用于检测其中去除覆盖停止膜的目标膜的膜去除过程的端点的方法和装置。从目标膜和停止膜中的至少一个产生化学反应产物; 该化学反应产物转化为单独的产物。单独的产品暴露于电离辐射。当去除靶膜时，监测由辐射产生的电离电流。电离电流的变化对应于分离产物的浓度变化，从而表明膜去除过程的终点。在通过化学机械抛光去除覆盖氮化硅膜的二氧化硅膜的特定情况下，反应产物是从抛光浆中提取的氨。通过与氯化氢蒸气反应将氨转化成氯化铵。由于夹带在载气中的氯化铵被泵送通过检测单元，通过监测由α粒子源产生的电离电流的变化来检测浓度的变化。

3. 发明授权

US06194230B1 Endpoint detection by chemical reaction and light scattering 失效
标题翻译：通过化学反应和光散射进行端点检测
公开(公告)号：US06194230B1
公开(公告)日：2001-02-27
申请号：US09073601
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei
IPC分类号： H01L2100
CPC分类号： B24B37/013 , B24B49/12 , H01L22/26
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively produces a gaseous chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, mixing the gaseous chemical reaction product present with a separate gas to form solid particles, and monitoring the amount of the solid particles as the target film is removed. Also, detection of a substance at very low concentrations in a liquid, by extracting the substance present as a gas from the liquid, mixing the gas with another substance to form solid particles, and monitoring the amount of the solid particles to detect the substance.
摘要翻译：通过用选择性地产生气体化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜时，检测用于去除停止膜的目标膜的终点的停止膜和目标膜，将存在的气态化学反应产物与单独的气体混合以形成固体颗粒，并且在去除目标膜时监测固体颗粒的量。此外，通过从液体中提取作为气体存在的物质，将气体与另一物质混合以形成固体颗粒，并监测固体颗粒的量以检测物质，检测液体中浓度非常低的物质。

4. 发明授权

US06180422B2 Endpoint detection by chemical reaction 失效
标题翻译：通过化学反应进行端点检测
公开(公告)号：US06180422B2
公开(公告)日：2001-01-30
申请号：US09073602
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
IPC分类号： H01L2100
CPC分类号： B24B37/30 , B24B37/013 , H01L21/31053
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. Also, detection of a substance at very low concentrations in a liquid, by extracting the substance present as a gas from the liquid and monitoring the gas to detect the substance.
摘要翻译：通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜，检测用于去除覆盖停止膜的目标膜的终点，目标或停止胶片，以及当去除靶膜时监测化学反应产物的含量。此外，通过从液体中提取作为气体存在的物质并监测气体以检测物质，检测液体中浓度非常低的物质。

5. 发明授权

US6066564A Indirect endpoint detection by chemical reaction 失效
标题翻译：通过化学反应进行间接终点检测
公开(公告)号：US6066564A
公开(公告)日：2000-05-23
申请号：US73605
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
IPC分类号： B24B37/013 , H01L21/302 , H01L21/3105
CPC分类号： B24B37/013 , H01L21/31053
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, and monitoring the level of the separate product as the target film is removed.
摘要翻译：通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜时，通过以下步骤之一来检测用于去除覆盖停止膜的目标膜的终点：停止膜和靶膜，将化学反应产物转化为单独的产物，并且在去除靶膜时监测分离产物的水平。

6. 发明授权

US06228769B1 Endpoint detection by chemical reaction and photoionization 失效
标题翻译：通过化学反应和光电离终点检测
公开(公告)号：US06228769B1
公开(公告)日：2001-05-08
申请号：US09073606
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
IPC分类号： H01L21302
CPC分类号： B24B37/013 , B24B49/00 , H01L21/30625
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product by threshold photoionization mass spectroscopy as the target film is removed.
摘要翻译：通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜，检测用于去除覆盖停止膜的目标膜的终点，目标或停止胶片，并在去除靶膜时通过阈值光电离质谱监测化学反应产物的含量。

7. 发明授权

US06228280B1 Endpoint detection by chemical reaction and reagent 失效
标题翻译：通过化学反应和试剂进行端点检测
公开(公告)号：US06228280B1
公开(公告)日：2001-05-08
申请号：US09073607
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei
IPC分类号： H01L21304
CPC分类号： H01L21/31053 , B24B37/013 , B24B49/00
摘要： A method for detecting the endpoint for removal of a target film overlying a stopping film by chemical-mechanical polishing using a slurry, by removing the target film with a polishing process that generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) in the slurry, adding to the slurry a reagent which produces a characteristic result upon reacting with the chemical reaction product, and monitoring the slurry for the characteristic result as the target film is removed.
摘要翻译：一种用于通过使用浆料的化学机械抛光来检测用于去除覆盖停止膜的目标膜的终点的方法，通过用产生化学反应产物的抛光工艺除去目标膜（例如当用在浆液中含有KOH的浆料中的氮化物膜），向浆料中添加与化学反应产物反应产生特征结果的试剂，并且在去除目标膜时监测浆料的特征结果。

8. 发明授权

US06419785B1 Endpoint detection by chemical reaction 有权
标题翻译：通过化学反应进行端点检测
公开(公告)号：US06419785B1
公开(公告)日：2002-07-16
申请号：US09678633
申请日：2000-10-03
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , Cong Wei , Chienfan Yu
IPC分类号： C23F102
CPC分类号： B24B37/30 , B24B37/013 , H01L21/31053
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example, ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. The reaction product is extracted as a gas from the slurry and monitored using a threshold photoionization mass spectrometer.
摘要翻译：通过用选择性地产生化学反应产物的方法（例如，用含有KOH的浆料中的氮化物膜研磨晶片的氨），通过用任一种方法选择性地生成化学反应产物的方法（例如，氨）目标或停止膜，并且在去除靶膜时监测化学反应产物的水平。反应产物从浆液中提取为气体，并使用阈值光电离质谱仪进行监测。

9. 发明授权

US6126848A Indirect endpoint detection by chemical reaction and chemiluminescence 失效
公开(公告)号：US6126848A
公开(公告)日：2000-10-03
申请号：US073604
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
IPC分类号： B24B37/013 , B24B49/12 , G01N21/76 , H01L21/306 , G01N21/00
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.

10. 发明授权

US06254453B1 Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system 有权
标题翻译：通过使用CLD系统检测氧化物/氮化物界面来优化化学机械过程
公开(公告)号：US06254453B1
公开(公告)日：2001-07-03
申请号：US09409243
申请日：1999-09-30
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
IPC分类号： B26B100
CPC分类号： G01N21/76
摘要： A method is provided to optimize the chemical mechanical planarization process of wafers having a target removal layer and a stop layer. A slurry is added to a polishing table which includes a polishing pad and a platen adapted for rotation; a portion of the slurry is allowed to engage an interface between the polishing pad and the wafer. A gaseous sample is continuously extracted from the slurry; the gaseous sample includes a reactant product created when the polishing pad engages the stop layer. The gaseous sample is introduced into a reactant product detector. A first time is determined, corresponding to an initial detection of the reactant product in the slurry, thereby creating a first reference point. A second time is determined, corresponding to the detection of a maximum volume of the reactant in said slurry, thereby creating a second reference point. The first and second reference points are then processed to obtain a signal, wherein the signal reflects the uniformity of removal of the layer containing the reactant product.
摘要翻译：提供了一种用于优化具有目标去除层和停止层的晶片的化学机械平坦化处理的方法。将浆料添加到包括抛光垫和适于旋转的压板的抛光台上; 允许一部分浆料与抛光垫和晶片之间的界面接合。从浆料中连续提取气态样品; 气态样品包括当抛光垫接合停止层时产生的反应物产物。将气态样品引入反应物产物检测器。确定第一次，对应于浆料中反应物产物的初始检测，从而产生第一参考点。确定第二次，对应于所述浆料中反应物的最大体积的检测，从而产生第二参考点。然后处理第一和第二参考点以获得信号，其中信号反映了含有反应物产物的层的去除的均匀性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式