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1. 发明授权

US06176765B1 Accumulator for slurry sampling 有权
标题翻译：用于泥浆取样的蓄能器
公开(公告)号：US06176765B1
公开(公告)日：2001-01-23
申请号：US09250308
申请日：1999-02-16
申请人： Leping Li , James A. Gilhooly , Robert B. Lipori , Clifford O. Morgan, III , William J. Surovic , Cong Wei
发明人： Leping Li , James A. Gilhooly , Robert B. Lipori , Clifford O. Morgan, III , William J. Surovic , Cong Wei
IPC分类号： B24B2900
CPC分类号： B24B37/04 , B24B57/02
摘要： A fluid collection apparatus having an accumulator for contacting a polishing surface of a polishing pad and collecting fluid from the polishing pad, a reservoir for receiving fluid from the accumulator, and a volume maintainer for maintaining a set volume of fluid in the reservoir.
摘要翻译：一种流体收集装置，其具有用于接触抛光垫的抛光表面并从抛光垫收集流体的储存器，用于从储存器接收流体的储存器以及用于在储存器中保持一定体积的流体的体积维持器。

2. 发明授权

US06254453B1 Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system 有权
标题翻译：通过使用CLD系统检测氧化物/氮化物界面来优化化学机械过程
公开(公告)号：US06254453B1
公开(公告)日：2001-07-03
申请号：US09409243
申请日：1999-09-30
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
IPC分类号： B26B100
CPC分类号： G01N21/76
摘要： A method is provided to optimize the chemical mechanical planarization process of wafers having a target removal layer and a stop layer. A slurry is added to a polishing table which includes a polishing pad and a platen adapted for rotation; a portion of the slurry is allowed to engage an interface between the polishing pad and the wafer. A gaseous sample is continuously extracted from the slurry; the gaseous sample includes a reactant product created when the polishing pad engages the stop layer. The gaseous sample is introduced into a reactant product detector. A first time is determined, corresponding to an initial detection of the reactant product in the slurry, thereby creating a first reference point. A second time is determined, corresponding to the detection of a maximum volume of the reactant in said slurry, thereby creating a second reference point. The first and second reference points are then processed to obtain a signal, wherein the signal reflects the uniformity of removal of the layer containing the reactant product.
摘要翻译：提供了一种用于优化具有目标去除层和停止层的晶片的化学机械平坦化处理的方法。将浆料添加到包括抛光垫和适于旋转的压板的抛光台上; 允许一部分浆料与抛光垫和晶片之间的界面接合。从浆料中连续提取气态样品; 气态样品包括当抛光垫接合停止层时产生的反应物产物。将气态样品引入反应物产物检测器。确定第一次，对应于浆料中反应物产物的初始检测，从而产生第一参考点。确定第二次，对应于所述浆料中反应物的最大体积的检测，从而产生第二参考点。然后处理第一和第二参考点以获得信号，其中信号反映了含有反应物产物的层的去除的均匀性。

3. 发明授权

US06506341B2 Chemiluminescence detection apparatus 失效
标题翻译：化学发光检测仪
公开(公告)号：US06506341B2
公开(公告)日：2003-01-14
申请号：US09129003
申请日：1998-08-04
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei , Werner Moser , Matthias Kutter , Joseph Knee , Walter Imfeld , Bruno Greuter , Heinz Stuenzi
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei , Werner Moser , Matthias Kutter , Joseph Knee , Walter Imfeld , Bruno Greuter , Heinz Stuenzi
IPC分类号： H01L21302
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： An apparatus is described for detecting the presence of a gaseous chemical produced during a chemical-mechanical polishing operation. The apparatus includes a catalytic converter, a reaction chamber and a light sensor. The catalytic converter, heated to about 800° C. converts the chemical to a different chemical product. The reaction chamber produces an excited species; the pressure in the reaction chamber is maintained sufficiently low to substantially avoid collisional deactivation of the excited species, so as to permit real-time detection of the chemical. A light signal from the excited species is input to the light sensor. An output from the light sensor corresponds to the real-time detection of the chemical, thereby permitting real-time control of the chemical-mechanical polishing operation.
摘要翻译：描述了一种用于检测在化学机械抛光操作期间产生的气态化学品的存在的装置。该装置包括催化转化器，反应室和光传感器。加热至约800℃的催化转化器将化学品转化为不同的化学产品。反应室产生激发物质; 反应室中的压力保持足够低以基本上避免激发物质的碰撞失活，从而允许化学品的实时检测。来自激发物种的光信号被输入到光传感器。来自光传感器的输出对应于化学品的实时检测，从而允许化学机械抛光操作的实时控制。

4. 发明授权

US06261851B1 Optimization of CMP process by detecting of oxide/nitride interface using IR system 有权
标题翻译：通过使用IR系统检测氧化物/氮化物界面来优化CMP工艺
公开(公告)号：US06261851B1
公开(公告)日：2001-07-17
申请号：US09410265
申请日：1999-09-30
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
IPC分类号： H01L2100
CPC分类号： B24B37/0056 , B24B37/013 , B24B49/04 , B24B49/12 , H01L21/31053 , H01L22/12 , H01L22/26
摘要： In a chemical mechanical planarization assembly directed for the removal of oxide layers, which stop on films containing silicon nitride, a conventional polishing table is provided with a gas extraction unit which transmits a gas sample to an infrared spectrometer. The presence of ammonia in the slurry, which is generated when a stop layer containing silicon nitride is abraded under high pH conditions, can be detected using infrared spectroscopy and accordingly provides for an in situ endpoint detection method.
摘要翻译：在用于去除在含有氮化硅的膜上停止的氧化物层的化学机械平面化组件中，传统的抛光台具有将气体样品透射到红外光谱仪的气体提取单元。可以使用红外光谱法检测在高pH条件下磨损含有氮化硅的停止层时产生的浆料中的氨的存在，从而提供原位终点检测方法。

5. 发明授权

US06276987B1 Chemical mechanical polishing endpoint process control 有权
标题翻译：化学机械抛光终点过程控制
公开(公告)号：US06276987B1
公开(公告)日：2001-08-21
申请号：US09129103
申请日：1998-08-04
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B37/042
摘要： Determination of an endpoint for removing a film from a wafer, by determining a first reference point removal time indicating when a breakthrough of the film has occurred, determining a second reference point removal time indicating when the film has been polished almost to completion, determining an additional removal time indicating an overpolishing interval, and adding the second reference point removal time with the additional removal time to get a total removal time to the endpoint.
摘要翻译：通过确定指示膜的突破何时发生的第一参考点去除时间确定指示胶片何时被抛光几乎完成的第二参考点去除时间来确定用于从晶片去除胶片的端点，确定额外的移除时间指示过度抛光间隔，并且将第二参考点去除时间与额外的移除时间相加以获得到端点的总移除时间。

6. 发明授权

US6021679A Probe for slurry gas sampling 有权
标题翻译：探测浆液采样
公开(公告)号：US6021679A
公开(公告)日：2000-02-08
申请号：US129102
申请日：1998-08-04
申请人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei , Werner Moser , Matthias Kutter , Joseph Knee , Walter Imfeld , Bruno Greuter , Heinz Stuenzi
发明人： Leping Li , James A. Gilhooly , Clifford O. Morgan, III , Cong Wei , Werner Moser , Matthias Kutter , Joseph Knee , Walter Imfeld , Bruno Greuter , Heinz Stuenzi
IPC分类号： G01N1/22 , G01N1/32 , G01N7/18 , G01N1/00
CPC分类号： G01N1/22 , G01N1/32 , G01N7/18
摘要： Device for in-situ collection of a gaseous reaction product from a polishing slurry as a workpiece, such as a semiconductor wafer, is being polished with the slurry, including a probe capable of being placed in contact with the slurry, the probe having a channel for transmitting the gaseous reaction product to an analyzer, a first hydrophobic membrane for allowing passage of the gaseous reaction product from the slurry to the channel, and means for directing a carrier gas through the channel.
摘要翻译：用于将诸如半导体晶片的作为工件的抛光浆料的气态反应产物原位收集的装置用浆料抛光，包括能够与浆料接触的探针，探针具有通道用于将气态反应产物传输到分析器，用于允许气态反应产物从浆料通过通道的第一疏水膜，以及用于引导载气通过通道的装置。

7. 发明授权

US06899784B1 Apparatus for detecting CMP endpoint in acidic slurries 失效
标题翻译：用于在酸性浆料中检测CMP终点的装置
公开(公告)号：US06899784B1
公开(公告)日：2005-05-31
申请号：US10185823
申请日：2002-06-27
申请人： Leping Li , Steven G. Barbee , Scott R. Cline , James A. Gilhooly , Walter Imfeld , Werner Moser , Adrian Siegrist , Heinz Stunzi , Xinhui Wang , Cong Wei
发明人： Leping Li , Steven G. Barbee , Scott R. Cline , James A. Gilhooly , Walter Imfeld , Werner Moser , Adrian Siegrist , Heinz Stunzi , Xinhui Wang , Cong Wei
IPC分类号： B26B1/00
CPC分类号： B24B37/042 , B24B37/0056 , B24B37/013 , H01L22/26
摘要： An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
摘要翻译：一种利用酸性CMP浆料在正在进行的化学机械抛光（CMP）循环中测量氨气浓度的装置，具有以下组分：a。用于收集酸性CMP浆料样品的转移装置; b。 A转化装置将酸性CMP浆料转化为碱性浆料; C。用于测量碱性浆料中存在的氨气的测量装置; d。检测装置，用于指示正在进行的CMP周期的结束。

8. 发明授权

US06878629B1 Method for detecting CMP endpoint in acidic slurries 失效
标题翻译：在酸性浆液中检测CMP终点的方法
公开(公告)号：US06878629B1
公开(公告)日：2005-04-12
申请号：US10185818
申请日：2002-06-27
申请人： Leping Li , Steven G. Barbee , Scott R. Cline , James A. Gilhooly , Xinhui Wang , Cong Wei
发明人： Leping Li , Steven G. Barbee , Scott R. Cline , James A. Gilhooly , Xinhui Wang , Cong Wei
IPC分类号： B24B37/005 , B24B37/013 , H01L21/302 , H01L21/304 , H01L21/3105
CPC分类号： B24B37/013 , B24B37/0056 , H01L21/31053
摘要： An apparatus for measuring ammonia gas concentration in an ongoing mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
摘要翻译：一种利用酸性CMP浆料在正在进行的机械抛光（CMP）循环中测量氨气浓度的装置，具有以下组分：a。用于收集酸性CMP浆料样品的转移装置; b。 A转化装置将酸性CMP浆料转化成碱性浆料; c。测量基本浆料中存在的氨气的测量方法; d。检测装置，用于指示正在进行的CMP周期的结束。

9. 发明授权

US5663637A Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool 失效
标题翻译：用于西化工具的化学机械抛光终点检测的旋转信号耦合
公开(公告)号：US5663637A
公开(公告)日：1997-09-02
申请号：US620720
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Gary Richard Doyle , Arnold Halperin , Kevin L. Holland , Francis Walter Kazak , Robert B. Lipori , Anne Elizabeth McGuire , Rock Nadeau , William Joseph Surovic
发明人： Leping Li , Steven George Barbee , Gary Richard Doyle , Arnold Halperin , Kevin L. Holland , Francis Walter Kazak , Robert B. Lipori , Anne Elizabeth McGuire , Rock Nadeau , William Joseph Surovic
IPC分类号： B24B37/04 , B24B49/00 , H01L21/66 , G01R27/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/00 , H01L22/26 , H01L2924/0002
摘要： Rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process. A sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process is coupled to a bottom half of a rotary transformer fixed to a rotating portion of the polisher. A top half of the rotary transformer, coupled to the bottom half of the rotary transformer, is fixed to a stationary portion of the polisher. The signal from the sensor is thus coupled through the rotary transformer to a process monitor.
摘要翻译：旋转信号耦合在原位监测化学机械抛光过程。固定到可旋转晶片载体上的用于产生响应于化学机械抛光工艺的信号的传感器耦合到固定到抛光机旋转部分的旋转变压器的下半部分。旋转变压器的上半部分，连接到旋转变压器的下半部分，固定在抛光机的静止部分。因此，来自传感器的信号通过旋转变压器耦合到过程监视器。

10. 发明授权

US06440263B1 Indirect endpoint detection by chemical reaction and chemiluminescence 失效
标题翻译：通过化学反应和化学发光进行间接终点检测
公开(公告)号：US06440263B1
公开(公告)日：2002-08-27
申请号：US09641175
申请日：2000-08-17
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
摘要翻译：通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜时，通过以下步骤之一来检测用于去除覆盖停止膜的目标膜的终点：停止膜和靶膜，将化学反应产物转化成单独的产物，从分离的产物产生激发的分子，并监测当去除靶膜时从激发的分子发射的光的水平。

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