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1. 发明申请

US20080251932A1 Method of forming through-silicon vias with stress buffer collars and resulting devices 审中-公开
标题翻译：用应力缓冲圈和结果装置形成通硅通孔的方法
公开(公告)号：US20080251932A1
公开(公告)日：2008-10-16
申请号：US12157806
申请日：2008-06-12
申请人： Leonel R. Arana , Devendra Natekar , Michael Newman , Charan K. Gurumurthy
发明人： Leonel R. Arana , Devendra Natekar , Michael Newman , Charan K. Gurumurthy
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.
摘要翻译：一种形成具有应力缓冲套环的通孔的方法，其中所述应力缓冲环可以吸收由周围材料的热膨胀系数不匹配引起的应力。描述和要求保护其他实施例。

2. 发明授权

US07402515B2 Method of forming through-silicon vias with stress buffer collars and resulting devices 有权
公开(公告)号：US07402515B2
公开(公告)日：2008-07-22
申请号：US11169595
申请日：2005-06-28
申请人： Leonel R. Arana , Devendra Natekar , Michael Newman , Charan K. Gurumurthy
发明人： Leonel R. Arana , Devendra Natekar , Michael Newman , Charan K. Gurumurthy
IPC分类号： H01L21/4763 , H01L21/44
CPC分类号： H01L21/76898 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.

3. 发明申请

US20070001266A1 Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion 有权
标题翻译：集成电路管芯包含具有减少的热膨胀的颗粒填充的通过硅的金属通孔
公开(公告)号：US20070001266A1
公开(公告)日：2007-01-04
申请号：US11174125
申请日：2005-06-30
申请人： Leonel Arana , Michael Newman , Devendra Natekar
发明人： Leonel Arana , Michael Newman , Devendra Natekar
IPC分类号： H01L29/40 , H01L21/44
CPC分类号： H01L21/76898 , H01L21/2885 , H01L23/481 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/11 , H01L2224/11424 , H01L2224/11462 , H01L2224/1147 , H01L2224/13009 , H01L2224/13216 , H01L2224/13224 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13284 , H01L2224/13384 , H01L2224/13386 , H01L2924/00014 , H01L2924/0002 , H01L2924/01322 , H01L2924/12033 , H01L2924/14 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
摘要翻译：一种具有导电通孔通孔的方法，装置和系统，其具有形成连续相的基质的复合材料的导电通孔，并且具有与基质不同的材料性质的嵌入的颗粒，形成分散相，所得复合材料具有不同的材料属性比矩阵。

4. 发明申请

US20100193952A1 Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion 审中-公开
标题翻译：集成电路芯片包含具有减少的热膨胀的部分填充的通过硅的金属通孔
公开(公告)号：US20100193952A1
公开(公告)日：2010-08-05
申请号：US12386238
申请日：2009-04-14
申请人： Leonel Arana , Michael Newman , Devendra Natekar
发明人： Leonel Arana , Michael Newman , Devendra Natekar
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L21/2885 , H01L23/481 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/11 , H01L2224/11424 , H01L2224/11462 , H01L2224/1147 , H01L2224/13009 , H01L2224/13216 , H01L2224/13224 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13284 , H01L2224/13384 , H01L2224/13386 , H01L2924/00014 , H01L2924/0002 , H01L2924/01322 , H01L2924/12033 , H01L2924/14 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
摘要翻译：一种具有导电通孔通孔的方法，装置和系统，其具有形成连续相的基质的复合材料的导电通孔，并且具有与基质不同的材料性质的嵌入的颗粒，形成分散相，所得复合材料具有不同的材料属性比矩阵。

5. 发明申请

US20060290002A1 Method of forming through-silicon vias with stress buffer collars and resulting devices 有权
标题翻译：用应力缓冲圈和结果装置形成通硅通孔的方法
公开(公告)号：US20060290002A1
公开(公告)日：2006-12-28
申请号：US11169595
申请日：2005-06-28
申请人： Leonel Arana , Devendra Natekar , Michael Newman , Charan Gurumurthy
发明人： Leonel Arana , Devendra Natekar , Michael Newman , Charan Gurumurthy
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L21/76898 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.
摘要翻译：一种形成具有应力缓冲套环的通孔的方法，其中所述应力缓冲环可以吸收由周围材料的热膨胀系数不匹配引起的应力。描述和要求保护其他实施例。

6. 发明授权

US07528006B2 Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion 有权
标题翻译：集成电路管芯包含具有减少的热膨胀的颗粒填充的通过硅的金属通孔
公开(公告)号：US07528006B2
公开(公告)日：2009-05-05
申请号：US11174125
申请日：2005-06-30
申请人： Leonel Arana , Michael Newman , Devendra Natekar
发明人： Leonel Arana , Michael Newman , Devendra Natekar
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L21/2885 , H01L23/481 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/11 , H01L2224/11424 , H01L2224/11462 , H01L2224/1147 , H01L2224/13009 , H01L2224/13216 , H01L2224/13224 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13284 , H01L2224/13384 , H01L2224/13386 , H01L2924/00014 , H01L2924/0002 , H01L2924/01322 , H01L2924/12033 , H01L2924/14 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
摘要翻译：一种具有导电通孔通孔的方法，装置和系统，其具有形成连续相的基质的复合材料的导电通孔，并且具有与基质不同的材料性质的嵌入的颗粒，形成分散相，所得复合材料具有不同的材料属性比矩阵。

7. 发明授权

US08898065B2 Configurable speech recognition system using multiple recognizers 有权
标题翻译：可配置的语音识别系统使用多个识别器
公开(公告)号：US08898065B2
公开(公告)日：2014-11-25
申请号：US13345265
申请日：2012-01-06
申请人： Michael Newman , Anthony Gillet , David Mark Krowitz , Michael D. Edgington
发明人： Michael Newman , Anthony Gillet , David Mark Krowitz , Michael D. Edgington
IPC分类号： G10L15/00
CPC分类号： G10L15/30 , G10L15/22 , G10L15/32 , G10L17/005
摘要： Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture.
摘要翻译：在分布式语音识别架构中组合多个识别器的结果的技术。输入到客户端设备的语音数据由本地和远程地由不同的识别器进行编码和处理，该识别器被配置为精通不同语音识别任务。客户端/服务器体系结构是可配置的，以使网络提供商能够指定针对在减少用户感知的识别延迟和使用网络资源之间进行权衡的策略。本地和远程语音识别引擎的结果至少部分地基于由客户端/服务器架构的一个或多个组件存储的逻辑。

8. 发明授权

US08333087B2 Cross-flow spiral heat transfer system 有权
标题翻译：交叉螺旋传热系统
公开(公告)号：US08333087B2
公开(公告)日：2012-12-18
申请号：US12184386
申请日：2008-08-01
申请人： Stephen A. McCormick , Michael Newman , Robert Muscato
发明人： Stephen A. McCormick , Michael Newman , Robert Muscato
IPC分类号： F25D25/02 , F25D13/06
CPC分类号： F25D13/067 , A21B1/26 , A21B1/48
摘要： A heat transfer system for refrigeration and/or heating of products includes a housing having an internal chamber, a baffle, a spiral pathway around the baffle, a gas flow pathway and a blower to circulate gas along the gas flow pathway. The baffle separates the chamber into upper and lower portions. The spiral pathway includes an upper spiral pathway within the upper portion, and a lower spiral pathway within the lower portion. The gas flow pathway includes an upper gas flow pathway across the upper spiral pathway and a lower gas flow pathway across the lower spiral pathway in which gas flow in the upper and lower gas flow pathways defines a circulation loop. The width of the upper gas flow pathway and upper spiral pathway are similar, and the width of the lower gas flow pathway and lower spiral pathway are similar.
摘要翻译：用于制冷和/或加热产品的传热系统包括具有内室，挡板，围绕挡板的螺旋路径的壳体，气流通道和鼓风机，以沿气体流路循环气体。挡板将腔室分成上部和下部。螺旋通道包括在上部内的上螺旋通路，下部包括下螺旋通路。气流通道包括穿过上螺旋通路的上气流通道和穿过下螺旋路径的下气流通道，其中上，下气流通道中的气流限定循环回路。上部气体流路和上部螺旋路径的宽度相似，下部气体流路和下部螺旋路径的宽度相似。

9. 发明申请

US20120179457A1 CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS 有权
公开(公告)号：US20120179457A1
公开(公告)日：2012-07-12
申请号：US13345219
申请日：2012-01-06
申请人： Michael Newman , Anthony Gillet , David Mark Krowitz , Michael D. Edgington
发明人： Michael Newman , Anthony Gillet , David Mark Krowitz , Michael D. Edgington
IPC分类号： G10L19/00 , G10L15/00
CPC分类号： G10L15/30 , G10L15/22 , G10L15/32 , G10L17/005
摘要： Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture.

10. 发明申请

US20110094498A1 Drainback Solar Water Heater 审中-公开
标题翻译：排水太阳能热水器
公开(公告)号：US20110094498A1
公开(公告)日：2011-04-28
申请号：US12911135
申请日：2010-10-25
申请人： Michael Newman , Glen Newman
发明人： Michael Newman , Glen Newman
IPC分类号： F24J2/40 , F24J2/04
CPC分类号： F24S50/00 , F24D11/003 , F24D2200/14 , F24S40/60 , Y02B10/20 , Y02E10/40
摘要： A solar water heater includes a drainback unit with a drainback reservoir and an anti-airlock conduit for assuring that working fluid in the solar collectors is consistently drained from the solar collectors into a drainback reservoir once circulation the working fluid in the solar collectors has stopped. The drainback unit also provides rapid startup by positioning the heat exchanger outside of the drainback reservoir and by positioning the inlet and outlet of drainback reservoir in close proximity to each other.
摘要翻译：太阳能热水器包括具有排水储存器和防气锁导管的排水装置，用于确保太阳能收集器中的工作流体一旦从太阳能收集器排出到排水储存器中，一旦太阳能收集器中的工作流体循环停止。排水装置还通过将热交换器定位在排水储存器的外部并且通过将排水储存器的入口和出口彼此靠近地定位来提供快速启动。

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