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    • 4. 发明申请
    • MODULAR ASSEMBLY OF A BEVERAGE PREPARATION MACHINE
    • 饮料制备机组的模块化组装
    • US20110041696A1
    • 2011-02-24
    • US12989072
    • 2009-03-23
    • Steve AemiseggerLeo BühlerStefan EtterUrs GaudenzGilles GavilletThomas HodelAlexandre KollepMarkus LangMichael MeierPeter MöriRenzo MoserPeter PreisigRudolf SchenkRobin Schwab
    • Steve AemiseggerLeo BühlerStefan EtterUrs GaudenzGilles GavilletThomas HodelAlexandre KollepMarkus LangMichael MeierPeter MöriRenzo MoserPeter PreisigRudolf SchenkRobin Schwab
    • A47J31/047A47J31/44A47J31/00
    • A47J31/3676A47J31/3623A47J31/4403A47J2201/00Y10T29/49904
    • A process for manufacturing a beverage preparation machine by providing a group of components a) to f), with the components including a brewing unit for receiving an ingredient of the beverage and for guiding an incoming flow of liquid, through the ingredient to a beverage outlet; b) an in-line heater for heating the flow of liquid to be supplied to the brewing unit; c) a pump for pumping the liquid through the heater; d) one or more fluid connecting members for guiding the liquid from a source of liquid to the beverage outlet; e) an electric control unit for receiving instructions from a user via an interface and for controlling the heater and pump; and f) one or more electric sensors for sensing at least one operational characteristic of the brewing unit, the heater, the pump, a liquid reservoir, an ingredient collector, a flow of the liquid, a pressure of the liquid and a temperature of the liquid, and for communicating the characteristic(s) to the control unit. Components a) to f) for assembling the beverage machine are connected by pre-assembling at least two or three modules, with each module being fully automatically assembled from at least two of components a) to f), wherein the components of the fully automatically preassembled modules are configured to be automatically seizable, orientable, positionable and fully connectable to each other in one or more automatic assembly steps.
    • 一种通过提供一组组件a)至f)来制造饮料制备机器的方法,所述组件包括用于接收饮料成分并用于引导流入的液体的冲泡单元通过所述成分到饮料出口 ; b)用于加热要供应到冲泡单元的液体流的在线加热器; c)用于泵送液体通过加热器的泵; d)用于将液体从液体源引导到饮料出口的一个或多个流体连接构件; e)电控单元,用于通过接口从用户接收指令并控制加热器和泵; 以及f)一个或多个电传感器,用于感测冲泡单元,加热器,泵,液体储存器,成分收集器,液体流动,液体压​​力和液体的温度的至少一个操作特性 液体,并用于将特性传送到控制单元。 用于组装饮料机的组件a)至f)通过预组装至少两个或三个模块来连接,每个模块从组件a)至f)中的至少两个完全自动组装,其中完全自动地组件 预组装的模块被配置为在一个或多个自动组装步骤中可自动检测,定向,可定位和完全可连接。
    • 10. 发明授权
    • Nanoimprint resist
    • 纳米抗蚀剂
    • US07431858B2
    • 2008-10-07
    • US10511402
    • 2003-04-09
    • Walter SpiessFumio KitaMichael MeierAndreas GierMartin MennigPeter W OliveiraHelmut Schmidt
    • Walter SpiessFumio KitaMichael MeierAndreas GierMartin MennigPeter W OliveiraHelmut Schmidt
    • B44C1/22C03C15/00C03C25/68C23F1/00
    • G03F7/0757B82Y10/00B82Y40/00G03F7/0002G03F7/0017G03F7/0047
    • The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.
    • 本发明涉及一种用于微结构化电子部件的方法,其以良好的纵横比产生高分辨率(<= 200nm),同时显着地低于光刻方法。 本发明的方法包括以下步骤:i)制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii)制备由底涂层(b)和载体(c)组成的靶基材; iii)在步骤i)中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii)中获得的底涂层(b) iv)涂覆的溶胶膜材料硬化; v)分离转印压花印模,由此获得作为顶涂层(a)的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤:vi)纳米复合溶胶膜的剩余层被等离子体蚀刻,优选地具有CHF 3 O 2 / O 2等离子体 ; vii)底涂层被等离子体蚀刻,优选为O 2等离子体; viii)蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。