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    • 10. 发明授权
    • Laser-based material processing apparatus and methods
    • 激光材料加工设备及方法
    • US09321126B2
    • 2016-04-26
    • US13037614
    • 2011-03-01
    • Jingzhou XuJin Young SohnGyu Cheon ChoLawrence Shah
    • Jingzhou XuJin Young SohnGyu Cheon ChoLawrence Shah
    • B23K26/00
    • B23K26/00Y02P40/57
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.
    • 各种实施例可以用于对工件的目标材料进行基于激光的修改,同时有利地实现处理生产量和/或质量的改善。 一种处理方法的实施例可以包括将激光脉冲聚焦并且以足够短的脉冲宽度将激光脉冲引导到工件的区域,使得通过来自该区域的非线性光学吸收和一定数量的热影响区域和 区域内的材料,邻近区域或两者都相对于使用具有较长脉冲的激光可获得的量减少。 在至少一个实施例中,超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在复合材料上或复合材料内的切割,切割,划线和成形特征中的至少一个。