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1. 发明授权

US07724988B2 Opto-electronic board 有权
标题翻译：光电板
公开(公告)号：US07724988B2
公开(公告)日：2010-05-25
申请号：US11927589
申请日：2007-10-29
申请人： Laurent A. Dellmann , Michel Despont , Bert J. Offrein , David J. Webb
发明人： Laurent A. Dellmann , Michel Despont , Bert J. Offrein , David J. Webb
IPC分类号： G02B6/12 , H01L21/00
CPC分类号： G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译：一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。

2. 发明申请

US20080247706A1 OPTO-ELECTRONIC BOARD 有权
标题翻译： OPTO电子板
公开(公告)号：US20080247706A1
公开(公告)日：2008-10-09
申请号：US11927589
申请日：2007-10-29
申请人： Laurent A. DELLMANN , Michel Despont , Bert J. Offrein , David J. Webb
发明人： Laurent A. DELLMANN , Michel Despont , Bert J. Offrein , David J. Webb
IPC分类号： G02B6/12
CPC分类号： G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译：一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。

3. 发明授权

US07336864B2 Opto-electronic board 有权
标题翻译：光电板
公开(公告)号：US07336864B2
公开(公告)日：2008-02-26
申请号：US11615838
申请日：2006-12-22
申请人： Laurent A. Dellmann , Michel Despont , Bert J. Offrein , David J. Webb
发明人： Laurent A. Dellmann , Michel Despont , Bert J. Offrein , David J. Webb
IPC分类号： G02B6/12
CPC分类号： G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译：一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。

4. 发明授权

US07486847B1 Chip carrier package with optical vias 失效
标题翻译：带光通孔的芯片载体封装
公开(公告)号：US07486847B1
公开(公告)日：2009-02-03
申请号：US12059858
申请日：2008-03-31
申请人： Laurent A. Dellmann , Folkert Horst , Bert J. Offrein
发明人： Laurent A. Dellmann , Folkert Horst , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： G02B6/421 , G02B6/43 , H01L2224/16225 , H01L2924/15311 , H05K1/0274 , H05K1/141 , H05K2201/10121
摘要： Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.
摘要翻译：通过将芯片载体的下表面配置为包括专门设计用于接收耦合光纤的多个孔来提供相当大的制造效率和灵活性。通过适当地定位这些孔，耦合光纤可以与由芯片载体承载的光电芯片的必要光学元件对准。类似地，纤维的相对端可以被适当地构造和定位成耦合到可嵌入印刷电路板中的波导结构或光纤结构。通过利用适当配置的芯片载体和相关的光纤，实现了有效地桥接芯片载体和相关印刷电路板之间的间隙的信号传输结构。

5. 发明授权

US07480426B1 Method of forming a three-dimensional stacked optical device 有权
标题翻译：形成三维堆叠光学器件的方法
公开(公告)号：US07480426B1
公开(公告)日：2009-01-20
申请号：US12054754
申请日：2008-03-25
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.
摘要翻译：一种形成三维层叠光学器件的方法包括：将至少一个光学器件安装到透明衬底上，通过所述至少一个光学器件制造多个通孔，以及用导电材料部件填充多个通孔，所述导电材料部件形成在所述至少一个光学装置上的多个背面触点。该方法还需要将电子芯片安装到至少一个光学器件上的多个背面触点中，在电子芯片中制造多个通孔，用另一个导电材料构件填充电子芯片中的多个通孔中的每一个，以及在形成在电子芯片中的多个通孔中的每一个上沉积背面接触。每个背面接触件电连接到位于形成在电子芯片中的多个通孔中的相应一个通孔中的另一个导电材料构件的相应的一个。

6. 发明申请

US20090245722A1 THREE-DIMENSIONAL STACKED OPTICAL DEVICE 审中-公开
标题翻译：三维堆叠光学器件
公开(公告)号：US20090245722A1
公开(公告)日：2009-10-01
申请号：US12355081
申请日：2009-01-16
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.
摘要翻译：三维层叠光学器件包括透明衬底和安装在透明衬底上的主体的光学器件。光学器件包括延伸到主体中并且不延伸到透明衬底中的多个通孔。导电构件设置在多个通孔中的每一个中以形成背侧触点。包括多个通孔的电子芯片安装在光学器件上的背面触点上。在电子芯片中形成的多个通孔中的每一个中沉积另一导电构件。另一导电构件在电子芯片上形成附加的背面接触。

7. 发明申请

US20090245721A1 THREE-DIMENSIONAL STACKED OPTICAL DEVICE 审中-公开
标题翻译：三维堆叠光学器件
公开(公告)号：US20090245721A1
公开(公告)日：2009-10-01
申请号：US12352055
申请日：2009-01-12
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L2224/18 , H01L2924/0002 , H01S5/02248 , H01S5/02288 , H04B10/801 , H05K1/186 , H01L2924/00
摘要： A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.
摘要翻译：三维层叠光学器件包括具有至少一个互连构件的透明衬底和安装在透明衬底上的至少一个互连构件的光学器件。光学装置包括耦合到至少一个互连构件的第一表面，其通过中间部分延伸到第二表面。绝缘层封装光学器件。绝缘层包括延伸到第二表面的第一表面。第一表面邻接透明基底。通信路径在光学器件的第一表面和绝缘层的第二表面之间延伸。电子芯片安装在绝缘层的第二表面上。电子芯片包括第一表面和第二表面。第一表面耦合到通信路径，以形成三维堆叠光学装置。

8. 发明授权

US07477811B1 Method of forming a three-dimensional stacked optical device 有权
标题翻译：形成三维堆叠光学器件的方法
公开(公告)号：US07477811B1
公开(公告)日：2009-01-13
申请号：US12054784
申请日：2008-03-25
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L2224/18 , H01L2924/0002 , H01S5/02248 , H01S5/02288 , H04B10/801 , H05K1/186 , H01L2924/00
摘要： A method of forming a three-dimensional stacked optical device includes forming a communication path on a transparent substrate and mounting at least one optical device to the communication path. The optical device includes a first surface, coupled to the transparent substrate that extends to a second surface. The method further includes embedding the at least one optical device in an insulating layer including a first surface, abutting the transparent substrate, extending to a second surface, and forming a communication path between the first surface of the optical device and the second surface of the insulating layer. The method also includes mounting an electronic chip to the second surface of the insulating layer. The electronic chip is coupled to the communication path so as to form a three-dimensional stacked optical device.
摘要翻译：形成三维层叠光学装置的方法包括在透明基板上形成连通路径，并将至少一个光学装置安装在通信路径上。光学装置包括第一表面，其连接到透明基底，延伸到第二表面。该方法还包括将至少一个光学器件嵌入包括第一表面的绝缘层，邻接透明衬底延伸到第二表面，并且在光学器件的第一表面和第二表面之间形成连通路径绝缘层。该方法还包括将电子芯片安装到绝缘层的第二表面上。电子芯片耦合到通信路径，以形成三维堆叠光学装置。

9. 发明授权

US07650693B2 Method of assembling electronic components of an electronic system, and system thus obtained 失效
标题翻译：电子系统的电子部件的组装方法以及由此获得的系统
公开(公告)号：US07650693B2
公开(公告)日：2010-01-26
申请号：US12137164
申请日：2008-06-11
申请人： Bert J. Offrein , Stefano S. Oggioni , Mauro Spreafico
发明人： Bert J. Offrein , Stefano S. Oggioni , Mauro Spreafico
IPC分类号： H05K3/34
CPC分类号： H01L23/66 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/522 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/86 , H01L25/0655 , H01L25/167 , H01L2224/0401 , H01L2224/05553 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/81143 , H01L2224/81203 , H01L2224/81205 , H01L2224/81224 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12043 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/222 , H05K3/3436 , H05K2201/045 , H05K2201/10121 , H05K2201/1053 , H05K2201/10674 , Y10T29/49144 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要翻译：一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械地连接在第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。电耦合包括在第一和第二电子部件之间的特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

10. 发明申请

US20080274587A1 Method of Assembling Electronic Components of an Electronic System, and System Thus Obtained 失效
标题翻译：组装电子系统电子元件的方法，以及如此获得的系统
公开(公告)号：US20080274587A1
公开(公告)日：2008-11-06
申请号：US12137164
申请日：2008-06-11
申请人： Bert J. Offrein , Stefano S. Oggioni , Mauro Spreafico
发明人： Bert J. Offrein , Stefano S. Oggioni , Mauro Spreafico
IPC分类号： H01L21/58
CPC分类号： H01L23/66 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/522 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/86 , H01L25/0655 , H01L25/167 , H01L2224/0401 , H01L2224/05553 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/81143 , H01L2224/81203 , H01L2224/81205 , H01L2224/81224 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12043 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/222 , H05K3/3436 , H05K2201/045 , H05K2201/10121 , H05K2201/1053 , H05K2201/10674 , Y10T29/49144 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要翻译：一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械地连接在第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。电耦合包括在第一和第二电子部件之间的特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

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