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1. 发明申请

WO2008030587A3 SMALL FOOTPRINT HIGH POWER LIGHT EMITTING PACKAGE WITH PLURALITY OF LIGHT EMITTING DIODE CHIPS 审中-公开
标题翻译：小功率发光二极管灯泡的大功率发光包
公开(公告)号：WO2008030587A3
公开(公告)日：2008-08-14
申请号：PCT/US2007019591
申请日：2007-09-07
申请人： LUMINATION LLC , SACKRISON MICHAEL , GAO XIANG , AANEGOLA SRINATH K , VENUGOPALAN HARI S
发明人： SACKRISON MICHAEL , GAO XIANG , AANEGOLA SRINATH K , VENUGOPALAN HARI S
IPC分类号： H01L25/075 , H01L33/00
CPC分类号： H01L25/0756 , H01L25/0753 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).
摘要翻译：发光包装包括限定支撑表面（14）的支撑件（12,112,212）。第一发光二极管芯片（20,120,220）固定到支撑表面并且被配置为发射具有第一光谱分布的光。第二发光二极管芯片（22,122,123,222）固定到第一发光二极管芯片。第二发光二极管芯片被配置为发射具有与第一光谱分布不同的第二光谱分布的光。可选地，第三发光二极管芯片（223）设置在第二发光二极管芯片（222）上。

2. 发明申请

WO2008030508A3 LIGHT EMITTING PACKAGES AND METHODS OF MAKING SAME 审中-公开
标题翻译：发光包及其制作方法
公开(公告)号：WO2008030508A3
公开(公告)日：2008-10-02
申请号：PCT/US2007019425
申请日：2007-09-06
申请人： LUMINATION LLC , REGINELLI JAMES , AANEGOLA SRINATH K , RADKOV EMIL
发明人： REGINELLI JAMES , AANEGOLA SRINATH K , RADKOV EMIL
IPC分类号： H01L33/50 , H01L33/54 , H01L33/58 , H01L33/64
CPC分类号： H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).
摘要翻译：在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。透光的大致保形的壳体（40）设置在密封剂上方并且具有由空气间隙（G）与密封剂的外表面（34）间隔开并且大体上与外壳表面（34）间隔开的内表面（44）。至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。设置在大致保形壳（40）中的导热填料有效地将复合壳材料的导热性提高到高于0.3W /（m.K）的值。

3. 发明申请

WO2008033563A3 SUPPORT FOR FLIP-CHIP BONDING A LIGHT EMITTING CHIP 审中-公开
标题翻译：支持薄膜键合发光芯片
公开(公告)号：WO2008033563A3
公开(公告)日：2008-06-26
申请号：PCT/US2007020194
申请日：2007-09-14
申请人： LUMINATION LLC , KOLODIN BORIS , HSING MICHAEL , WEAVER STANTON EARL JR , ELIASHEVICH IVAN , AANEGOLA SRINATH K
发明人： KOLODIN BORIS , HSING MICHAEL , WEAVER STANTON EARL JR , ELIASHEVICH IVAN , AANEGOLA SRINATH K
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10', 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
摘要翻译：在发光器件中，发光芯片（12,112）包括半导体层（14）的堆叠和设置在半导体层堆叠上的电极（24,141,142）。支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。导电芯片连接材料（40,41,141,142）凹入支撑件的大致平坦的表面中，使得连接材料不会基本上突出到支撑件的大致平坦的表面上方。附接材料提供发光芯片的电极与支撑件的导电路径（36,36'）之间的电连通。可选地，至少半导体层堆叠和发光芯片的电极也凹进支架的大致平坦的表面中。

4. 发明申请

WO2004100213A3 LED-BASED LIGHT BULB 审中-公开
标题翻译： LED基灯泡
公开(公告)号：WO2004100213A3
公开(公告)日：2005-06-30
申请号：PCT/US2004014414
申请日：2004-05-05
申请人： GELCORE LLC , BOHLER CHRISTOPHER L , KOLODIN BORIS , RADKOV EMIL , AANEGOLA SRINATH K , WEAVER STANTON E JR , PETROSKI JAMES T , BROWN ZENA
发明人： BOHLER CHRISTOPHER L , KOLODIN BORIS , RADKOV EMIL , AANEGOLA SRINATH K , WEAVER STANTON E JR , PETROSKI JAMES T , BROWN ZENA
IPC分类号： F21K99/00 , F21V5/00 , F21V1/00 , H01L21/00 , H01L21/48
CPC分类号： B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V29/02 , F21V29/58 , F21V29/63 , F21V29/70 , F21Y2105/00 , F21Y2115/10
摘要： A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要翻译：光源（10）包括光引擎（16），基座（24），电源转换电路（30）和外壳（22）。光引擎（16）包括设置在平台（14）上的至少一个LED（12）。平台（14）适于与基座（24）直接配合，该基座（24）是标准的白炽灯泡灯座。荧光体（44）接收由至少一个LED（12）产生的光并将其转换成可见光。外壳（22）具有标准白炽灯的形状。

5. 发明申请

WO2005106926A3 LIGHT EMITTING DIODE COMPONENT 审中-公开
标题翻译：发光二极管组件
公开(公告)号：WO2005106926A3
公开(公告)日：2006-06-01
申请号：PCT/US2005014043
申请日：2005-04-25
申请人： GELCORE LLC , AANEGOLA SRINATH K , PETROSKI JAMES T , RADKOV EMIL , WEAVER STANTON E JR
发明人： AANEGOLA SRINATH K , PETROSKI JAMES T , RADKOV EMIL , WEAVER STANTON E JR
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要： A light emitting package (8, 8', 8", 208, 408) includes a printed circuit board (10, 10', 10", 210, 410) supporting at least one light emitting die (12, 12", 14, 16, 212, 412). A light transmissive cover (60, 60', 60", 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62', 62", 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70", 270, 470) containing the at least one light emitting die. An encapsulant (76, 76", 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译：发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，14“，”）的印刷电路板（10,10'，10“，210,410）透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。所述盖具有限定与所述印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端，所述盖与所述印刷电路板一起的内表面限定内部容积（70,70 “，270,470），其包含至少一个发光管芯。密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

6. 发明专利

JP2011165675A Led-based light bulb 有权
标题翻译： LED基灯泡
公开(公告)号：JP2011165675A
公开(公告)日：2011-08-25
申请号：JP2011110613
申请日：2011-05-17
申请人： Lumination Llc , ルミネイションリミテッドライアビリティカンパニーLumination LLC
发明人： BOHLER CHRISTOPHER L , KOLODIN BORIS , RADKOV EMIL , AANEGOLA SRINATH K , WEAVER STANTON E JR , PETROSKI JAMES T , BROWN ZENA
IPC分类号： F21S2/00 , F21K99/00 , F21V9/16 , F21V29/00 , F21Y101/02
CPC分类号： B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V29/02 , F21V29/58 , F21V29/63 , F21V29/70 , F21Y2105/00 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a new LED light (lamp) that includes a common light engine used in various light-bulb platforms and is formed by adaptable and scalable (expandable/contractible) LED-light design. SOLUTION: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) has at least one LED (12) provided on a platform (14). The platform (14) is configured so as to be directly connected to the base (24) being a standard incandescent-lamp base. A phosphor (44) receives the light generated by the at least one LED (12) and converts it into visible light. The enclosure (22) has a shape of a standard incandescent lamp. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种新的LED灯（灯），其包括在各种灯泡平台中使用的普通光引擎，并且通过适应性和可扩展性（可扩展/收缩）LED灯设计形成。解决方案：光源（10）包括光引擎（16），基座（24），电源转换电路（30）和外壳（22）。光引擎（16）具有设置在平台（14）上的至少一个LED（12）。平台（14）构造成直接连接到作为标准白炽灯基座的基座（24）。荧光体（44）接收由至少一个LED（12）产生的光并将其转换成可见光。外壳（22）具有标准白炽灯的形状。版权所有（C）2011，JPO＆INPIT

7. 发明专利

DE60232074D1 未知
公开(公告)号：DE60232074D1
公开(公告)日：2009-06-04
申请号：DE60232074
申请日：2002-05-24
申请人： LUMINATION LLC
发明人： SOUTHARD PAUL W , AANEGOLA SRINATH K , PETROSKI JAMES T , BOHLER CHRISTOPHER L
IPC分类号： G09F13/20 , G09F13/22 , F21V21/002 , G09F9/33 , G09F13/04 , H01L33/00
摘要： There is provided a flexible lighting strip comprising: a flexible cable including an electrically insulating sheath which contains positive and negative conductors electrically isolated from one another, the sheath providing a spacing between the positive and negative conductors; and a plurality of light emitting diode (LED) devices spaced apart from one another on the cable, each of the LED devices having an LED including positive and negative leads mounted on a connector which mechanically secures the LED device to a portion of the flexible cable and electrically connects the positive and negative LED leads to the positive and negative conductors through positive and negative conductive piercing members which pierce the sheath to make electrical contact with the respective conductors; wherein the positive and negative conductors within the insulating sheath define a cable plane, the LED emitting light substantially directed parallel to the cable plane, the flexible electrical cable being flexible in a direction out of the cable plane and the cable being sufficiently flexible to be capable of defining a letter shape.

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