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1. 发明申请

WO2004100213A3 LED-BASED LIGHT BULB 审中-公开
标题翻译： LED基灯泡
公开(公告)号：WO2004100213A3
公开(公告)日：2005-06-30
申请号：PCT/US2004014414
申请日：2004-05-05
申请人： GELCORE LLC , BOHLER CHRISTOPHER L , KOLODIN BORIS , RADKOV EMIL , AANEGOLA SRINATH K , WEAVER STANTON E JR , PETROSKI JAMES T , BROWN ZENA
发明人： BOHLER CHRISTOPHER L , KOLODIN BORIS , RADKOV EMIL , AANEGOLA SRINATH K , WEAVER STANTON E JR , PETROSKI JAMES T , BROWN ZENA
IPC分类号： F21K99/00 , F21V5/00 , F21V1/00 , H01L21/00 , H01L21/48
CPC分类号： B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V29/02 , F21V29/58 , F21V29/63 , F21V29/70 , F21Y2105/00 , F21Y2115/10
摘要： A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要翻译：光源（10）包括光引擎（16），基座（24），电源转换电路（30）和外壳（22）。光引擎（16）包括设置在平台（14）上的至少一个LED（12）。平台（14）适于与基座（24）直接配合，该基座（24）是标准的白炽灯泡灯座。荧光体（44）接收由至少一个LED（12）产生的光并将其转换成可见光。外壳（22）具有标准白炽灯的形状。

2. 发明申请

WO2005106926A3 LIGHT EMITTING DIODE COMPONENT 审中-公开
标题翻译：发光二极管组件
公开(公告)号：WO2005106926A3
公开(公告)日：2006-06-01
申请号：PCT/US2005014043
申请日：2005-04-25
申请人： GELCORE LLC , AANEGOLA SRINATH K , PETROSKI JAMES T , RADKOV EMIL , WEAVER STANTON E JR
发明人： AANEGOLA SRINATH K , PETROSKI JAMES T , RADKOV EMIL , WEAVER STANTON E JR
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要： A light emitting package (8, 8', 8", 208, 408) includes a printed circuit board (10, 10', 10", 210, 410) supporting at least one light emitting die (12, 12", 14, 16, 212, 412). A light transmissive cover (60, 60', 60", 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62', 62", 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70", 270, 470) containing the at least one light emitting die. An encapsulant (76, 76", 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译：发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，14“，”）的印刷电路板（10,10'，10“，210,410）透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。所述盖具有限定与所述印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端，所述盖与所述印刷电路板一起的内表面限定内部容积（70,70 “，270,470），其包含至少一个发光管芯。密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

3. 发明申请

WO2008030508A3 LIGHT EMITTING PACKAGES AND METHODS OF MAKING SAME 审中-公开
标题翻译：发光包及其制作方法
公开(公告)号：WO2008030508A3
公开(公告)日：2008-10-02
申请号：PCT/US2007019425
申请日：2007-09-06
申请人： LUMINATION LLC , REGINELLI JAMES , AANEGOLA SRINATH K , RADKOV EMIL
发明人： REGINELLI JAMES , AANEGOLA SRINATH K , RADKOV EMIL
IPC分类号： H01L33/50 , H01L33/54 , H01L33/58 , H01L33/64
CPC分类号： H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).
摘要翻译：在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。透光的大致保形的壳体（40）设置在密封剂上方并且具有由空气间隙（G）与密封剂的外表面（34）间隔开并且大体上与外壳表面（34）间隔开的内表面（44）。至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。设置在大致保形壳（40）中的导热填料有效地将复合壳材料的导热性提高到高于0.3W /（m.K）的值。

4. 发明申请

WO2008033563A3 SUPPORT FOR FLIP-CHIP BONDING A LIGHT EMITTING CHIP 审中-公开
标题翻译：支持薄膜键合发光芯片
公开(公告)号：WO2008033563A3
公开(公告)日：2008-06-26
申请号：PCT/US2007020194
申请日：2007-09-14
申请人： LUMINATION LLC , KOLODIN BORIS , HSING MICHAEL , WEAVER STANTON EARL JR , ELIASHEVICH IVAN , AANEGOLA SRINATH K
发明人： KOLODIN BORIS , HSING MICHAEL , WEAVER STANTON EARL JR , ELIASHEVICH IVAN , AANEGOLA SRINATH K
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10', 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
摘要翻译：在发光器件中，发光芯片（12,112）包括半导体层（14）的堆叠和设置在半导体层堆叠上的电极（24,141,142）。支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。导电芯片连接材料（40,41,141,142）凹入支撑件的大致平坦的表面中，使得连接材料不会基本上突出到支撑件的大致平坦的表面上方。附接材料提供发光芯片的电极与支撑件的导电路径（36,36'）之间的电连通。可选地，至少半导体层堆叠和发光芯片的电极也凹进支架的大致平坦的表面中。

5. 发明申请

WO2008030587A3 SMALL FOOTPRINT HIGH POWER LIGHT EMITTING PACKAGE WITH PLURALITY OF LIGHT EMITTING DIODE CHIPS 审中-公开
标题翻译：小功率发光二极管灯泡的大功率发光包
公开(公告)号：WO2008030587A3
公开(公告)日：2008-08-14
申请号：PCT/US2007019591
申请日：2007-09-07
申请人： LUMINATION LLC , SACKRISON MICHAEL , GAO XIANG , AANEGOLA SRINATH K , VENUGOPALAN HARI S
发明人： SACKRISON MICHAEL , GAO XIANG , AANEGOLA SRINATH K , VENUGOPALAN HARI S
IPC分类号： H01L25/075 , H01L33/00
CPC分类号： H01L25/0756 , H01L25/0753 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).
摘要翻译：发光包装包括限定支撑表面（14）的支撑件（12,112,212）。第一发光二极管芯片（20,120,220）固定到支撑表面并且被配置为发射具有第一光谱分布的光。第二发光二极管芯片（22,122,123,222）固定到第一发光二极管芯片。第二发光二极管芯片被配置为发射具有与第一光谱分布不同的第二光谱分布的光。可选地，第三发光二极管芯片（223）设置在第二发光二极管芯片（222）上。

6. 发明专利

AU2005226630A1 Parallel/series LED strip 未知
公开(公告)号：AU2005226630A1
公开(公告)日：2005-10-06
申请号：AU2005226630
申请日：2005-03-10
申请人： GELCORE LLC
发明人： MRAKOVICH MATTHEW , AANEGOLA SRINATH K , SOMMERS MATHEW , MCCOY MICHAEL , BOHLER CHRISTOPHER
IPC分类号： F21S2/00 , F21S4/00 , F21V21/002
摘要： An LED light engine includes a flexible electrical cable and a plurality of LEDs. The flexible electrical cable includes first, second and third electrical conductors and an electrically insulating covering for the electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the first electrical conductor and a second lead of the first LED electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second electrical conductor and a second lead electrically connected to the third electrical conductor. A third LED includes first and second leads electrically connected to the second conductor. The third LED is interposed between the first LED and the second LED.

7. 发明专利

AU2005239406B2 Light emitting diode component 未知
公开(公告)号：AU2005239406B2
公开(公告)日：2011-10-06
申请号：AU2005239406
申请日：2005-04-25
申请人： GELCORE LLC
发明人： AANEGOLA SRINATH K , PETROSKI JAMES T , EMIL RADKOV , WEAVER STANTON E JR
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58
摘要： A light emitting package (8, 8', 8", 208, 408) includes a printed circuit board (10, 10', 10", 210, 410) supporting at least one light emitting die (12, 12", 14, 16, 212, 412). A light transmissive cover (60, 60', 60", 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62', 62", 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70", 270, 470) containing the at least one light emitting die. An encapsulant (76, 76", 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

8. 发明专利

AU2005239406A1 Light emitting diode component 未知
公开(公告)号：AU2005239406A1
公开(公告)日：2005-11-10
申请号：AU2005239406
申请日：2005-04-25
申请人： GELCORE LLC
发明人： AANEGOLA SRINATH K , PETROSKI JAMES T , RADKOV EMIL , WEAVER STANTON E JR
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58
摘要： A light emitting package ( 8, 8', 8'', 208, 408 ) includes a printed circuit board ( 10, 10', 10'', 210, 410 ) supporting at least one light emitting die ( 12, 12'', 14, 16, 212, 412 ). A light transmissive cover ( 60, 60', 60'', 260, 460 ) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter ( 62, 62', 62'', 262, 462 ) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume ( 70, 70'', 270, 470 ) containing the at least one light emitting die. An encapsulant ( 76, 76'', 276, 278, 476 ) is disposed in the interior volume and covers at least the light emitting die.

9. 发明公开

EP1730437A4 PARALLEL/SERIES LED STRIP 有权
标题翻译： PARALLEL- / REIHEN-LED-STREIFEN
公开(公告)号：EP1730437A4
公开(公告)日：2007-05-16
申请号：EP05725168
申请日：2005-03-10
申请人： GELCORE LLC
发明人： AANEGOLA SRINATH K , SOMMERS MATHEW , MRAKOVICH MATTHEW , BOHLER CHRISTOPHER , MCCOY MICHAEL
IPC分类号： F21S2/00 , F21S4/00 , F21V21/002
CPC分类号： F21V21/002 , F21S4/10 , F21Y2115/10
摘要： An LED light engine (10) includes a flexible electrical cable (12) and a plurality of LEDs (16). The flexible electrical cable (12) includes first conductor (22), second conductor (24) and third conductor (26) and electrically insulating covering (28) for electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second conductor and a second lead electrically connected to the third conductor. The third LED is interposed between the first and the second LED.
摘要翻译： LED光引擎包括柔性电缆和多个LED。柔性电缆包括第一，第二和第三电导体和电导体的电绝缘覆盖物。导体彼此基本平行地布置，其间具有绝缘材料。包括第一引线的第一LED电连接到第一电导体，并且第一LED的第二引线电连接到第二导体。第二LED包括电连接到第二电导体的第一引线和电连接到第三电导体的第二引线。第三LED包括电连接到第二导体的第一和第二引线。第三LED被置于第一LED和第二LED之间。

10. 发明申请

WO2005091973A2 PARALLEL/SERIES LED STRIP 审中-公开
标题翻译：并联/系列LED条
公开(公告)号：WO2005091973A2
公开(公告)日：2005-10-06
申请号：PCT/US2005007836
申请日：2005-03-10
申请人： GELCORE LLC
发明人： AANEGOLA SRINATH K , SOMMERS MATHEW , MRAKOVICH MATTHEW , BOHLER CHRISTOPHER , MCCOY MICHAEL
IPC分类号： F21S2/00 , F21S4/00 , F21V21/002
CPC分类号： F21V21/002 , F21S4/10 , F21Y2115/10
摘要： An LED light engine includes a flexible electrical cable and a plurality of LEDs. The flexible electrical cable includes first, second and third electrical conductors and an electrically insulating covering for the electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the first electrical conductor and a second lead of the first LED electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second electrical conductor and a second lead electrically connected to the third electrical conductor. A third LED includes first and second leads electrically connected to the second conductor. The third LED is interposed between the first LED and the second LED.
摘要翻译： LED光引擎包括柔性电缆和多个LED。柔性电缆包括第一，第二和第三电导体和电导体的电绝缘覆盖物。导体彼此基本平行地布置，其间具有绝缘材料。包括第一引线的第一LED电连接到第一电导体，并且第一LED的第二引线电连接到第二导体。第二LED包括电连接到第二电导体的第一引线和电连接到第三电导体的第二引线。第三LED包括电连接到第二导体的第一和第二引线。第三LED插在第一LED和第二LED之间。

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