会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • 柔性印刷电路板及其制造方法
    • WO2011010889A2
    • 2011-01-27
    • PCT/KR2010/004837
    • 2010-07-23
    • LG INNOTEK CO., LTD.LEE, SungwonKIM, JaebeumKIM, Hwajin
    • LEE, SungwonKIM, JaebeumKIM, Hwajin
    • H05K3/06H05K3/18
    • H05K3/108H05K2201/0154H05K2201/0355H05K2203/0353H05K2203/0369
    • The present invention relates to a flexible printed circuit board and a method for manufacturing the same, the method characterized by: (a) performing a half etching to reduce the thickness of a metal layer formed on at least one surface of an insulation substrate; (b) attaching a plate resist thin film on the metal layer; (c) exposing and developing the plate resist thin film and exposing a part of the metal layer; (d) plating the part of the exposed metal layer; (e) exfoliating the plate resist thin film; and (f) performing a flash etching to remove the metal layer of (a) step exposed by exfoliating plate resist thin film, whereby a printed circuit board having an excellent bendibility can be manufactured, whereby a printed wiring substrate having a fine pattern and an excellent bendability can be manufactured at low cost by using existing processing lines.
    • 本发明涉及一种柔性印刷电路板及其制造方法,所述方法的特征在于:(a)执行半蚀刻以减小形成在至少一个金属层上的金属层的厚度 绝缘基板的一个表面; (b)在金属层上附着抗蚀剂薄膜; (c)将所述抗蚀剂薄膜曝光并显影并暴露所述金属层的一部分; (d)电镀部分暴露的金属层; (e)剥离平板抗蚀剂薄膜; 和(f)进行快速蚀刻以去除通过剥离平板抗蚀剂薄膜而暴露的(a)步骤的金属层,由此可以制造具有优良的可弯曲性的印刷电路板,从而制造具有精细图案和 通过使用现有的生产线,可以低成本制造出色的弯曲性。