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    • 4. 发明申请
    • FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • 柔性印刷电路板及其制造方法
    • WO2011010889A2
    • 2011-01-27
    • PCT/KR2010/004837
    • 2010-07-23
    • LG INNOTEK CO., LTD.LEE, SungwonKIM, JaebeumKIM, Hwajin
    • LEE, SungwonKIM, JaebeumKIM, Hwajin
    • H05K3/06H05K3/18
    • H05K3/108H05K2201/0154H05K2201/0355H05K2203/0353H05K2203/0369
    • The present invention relates to a flexible printed circuit board and a method for manufacturing the same, the method characterized by: (a) performing a half etching to reduce the thickness of a metal layer formed on at least one surface of an insulation substrate; (b) attaching a plate resist thin film on the metal layer; (c) exposing and developing the plate resist thin film and exposing a part of the metal layer; (d) plating the part of the exposed metal layer; (e) exfoliating the plate resist thin film; and (f) performing a flash etching to remove the metal layer of (a) step exposed by exfoliating plate resist thin film, whereby a printed circuit board having an excellent bendibility can be manufactured, whereby a printed wiring substrate having a fine pattern and an excellent bendability can be manufactured at low cost by using existing processing lines.
    • 本发明涉及一种柔性印刷电路板及其制造方法,所述方法的特征在于:(a)执行半蚀刻以减小形成在至少一个金属层上的金属层的厚度 绝缘基板的一个表面; (b)在金属层上附着抗蚀剂薄膜; (c)将所述抗蚀剂薄膜曝光并显影并暴露所述金属层的一部分; (d)电镀部分暴露的金属层; (e)剥离平板抗蚀剂薄膜; 和(f)进行快速蚀刻以去除通过剥离平板抗蚀剂薄膜而暴露的(a)步骤的金属层,由此可以制造具有优良的可弯曲性的印刷电路板,从而制造具有精细图案和 通过使用现有的生产线,可以低成本制造出色的弯曲性。
    • 7. 发明申请
    • FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • 柔性印刷电路板及其制造方法
    • WO2011010889A3
    • 2011-06-30
    • PCT/KR2010004837
    • 2010-07-23
    • LG INNOTEK CO LTDLEE SUNGWONKIM JAEBEUMKIM HWAJIN
    • LEE SUNGWONKIM JAEBEUMKIM HWAJIN
    • H05K3/06H05K3/18
    • H05K3/108H05K2201/0154H05K2201/0355H05K2203/0353H05K2203/0369
    • The present invention relates to a flexible printed circuit board and a method for manufacturing the same, the method characterized by: (a) performing a half etching to reduce the thickness of a metal layer formed on at least one surface of an insulation substrate; (b) attaching a plate resist thin film on the metal layer; (c) exposing and developing the plate resist thin film and exposing a part of the metal layer; (d) plating the part of the exposed metal layer; (e) exfoliating the plate resist thin film; and (f) performing a flash etching to remove the metal layer of (a) step exposed by exfoliating plate resist thin film, whereby a printed circuit board having an excellent bendibility can be manufactured, whereby a printed wiring substrate having a fine pattern and an excellent bendability can be manufactured at low cost by using existing processing lines.
    • 柔性印刷电路板及其制造方法技术领域本发明涉及柔性印刷电路板及其制造方法,该方法的特征在于:(a)进行半蚀刻以减少形成在绝缘基板的至少一个表面上的金属层的厚度; (b)在所述金属层上附着平板抗蚀剂薄膜; (c)曝光和显影所述抗蚀剂薄膜并暴露所述金属层的一部分; (d)电镀暴露的金属层的一部分; (e)剥离抗蚀剂薄膜; 和(f)进行闪光蚀刻以除去由剥离抗蚀剂薄膜暴露的(a)步骤的金属层,从而可以制造具有优异弯曲性的印刷电路板,由此可以制造具有精细图案和 可以通过使用现有的加工生产线以低成本制造优异的弯曲性。