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1. 发明申请

WO2011065788A2 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2011065788A2
公开(公告)日：2011-06-03
申请号：PCT/KR2010008469
申请日：2010-11-26
申请人： LG INNOTEK CO LTD , KIM JIN SU , KIM DUK NAM , AHN JAE HYUN , LEE SANG MYUNG , SEO YEONG UK , AHN CHI HEE , YOON SUNG WOON , NAM MYOUNG HWA
发明人： KIM JIN SU , KIM DUK NAM , AHN JAE HYUN , LEE SANG MYUNG , SEO YEONG UK , AHN CHI HEE , YOON SUNG WOON , NAM MYOUNG HWA
IPC分类号： H05K3/46 , H05K3/18 , H05K3/40
CPC分类号： H05K3/4658 , H05K3/205 , H05K3/4007 , H05K3/4647 , H05K2203/0108 , Y10T29/49155
摘要： A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate.
摘要翻译：提供一种印刷电路板的结构及其制造方法。该制造方法包括：在第一电路图案上形成至少一个连接凸块并形成第一绝缘层以形成内部电路板的第一步骤;使用模具处理其上形成有金属晶种层的第二绝缘层的第二步骤以形成第二电路图案以构成外部电路板，以及将内部电路板和外部电路板彼此对准并层压内部电路板和外部电路板的第三步骤。因此，可以提供具有嵌入在绝缘层中的电路的高密度高可靠性印刷电路板的结构。可以通过使用与种子层结合的绝缘层来去除用于形成最外层电路的籽晶层形成工艺。此外，形成连接凸块形式的导电结构，因此不需要形成通孔并且用导电材料填充通孔的复杂工艺。此外，去除了填充的导电材料的表面的研磨过程，以显着降低电路错误率。

2. 发明申请

WO2011065757A3 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2011065757A3
公开(公告)日：2011-09-29
申请号：PCT/KR2010008372
申请日：2010-11-25
申请人： LG INNOTEK CO LTD , SEO YEONG UK , YOON SUNG WOON , KIM JIN SU , NAM MYOUNG HWA , LEE SANG MYUNG , AHN CHI HEE
发明人： SEO YEONG UK , YOON SUNG WOON , KIM JIN SU , NAM MYOUNG HWA , LEE SANG MYUNG , AHN CHI HEE
IPC分类号： H05K3/20 , H05K3/06
CPC分类号： H05K3/101 , H05K1/02 , H05K1/0353 , H05K1/092 , H05K3/02 , H05K3/108 , H05K3/20 , H05K2201/0376 , H05K2203/0278
摘要： The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.
摘要翻译：本发明提供一种印刷电路板的结构及其制造方法。该方法包括：（a）在其中形成种子层的绝缘层上形成电路图案; （b）通过压制方法将电路图案嵌入绝缘层中; 和（c）去除种子层。根据本发明，通过在绝缘层上直接形成电路图案，可以形成精细图案而不会出现对准问题，并且可以通过执行将突出电路嵌入绝缘层的工艺来增加形成的精细图案的可靠性。另外，通过在去除种子层的蚀刻工艺期间执行将电路层过度蚀刻为低于绝缘层的表面，可以减少由于相邻电路之间的离子迁移而发生的劣化电路的可能性。

3. 发明申请

WO2011043537A3 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2011043537A3
公开(公告)日：2011-07-07
申请号：PCT/KR2010005124
申请日：2010-08-05
申请人： LG INNOTEK CO LTD , KIM JIN SU , NAM MYOUNG HWA , SEO YEONG UK , AHN CHI HEE
发明人： KIM JIN SU , NAM MYOUNG HWA , SEO YEONG UK , AHN CHI HEE
IPC分类号： H05K3/18 , H05K3/20
CPC分类号： H05K3/205 , H05K3/107 , H05K3/108 , H05K3/465 , H05K3/4658 , H05K2201/0355 , H05K2203/0108 , Y10T156/10
摘要： An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.
摘要翻译：提供一种嵌入式印刷电路板及其制造方法。该制造方法包括：形成第一绝缘层的第一步骤，该第一绝缘层具有形成在其一侧上的晶种层以及嵌入其中的至少一个金属图案;以及第二步骤，将第一绝缘层和基础衬底层叠成具有内部电路，介于第一绝缘层和基底之间的第二绝缘层。因此，提供了具有嵌入绝缘层中的电路的印刷电路板，从而可以实现高密度和高可靠性的印刷电路板。此外，由于使用模具制造印刷电路板，所以省略了用于嵌入的电路制造工艺，用于形成种子层的工艺以及诸如平面磨削的复杂工艺，以简化制造工艺。

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