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    • 8. 发明申请
    • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • 印刷电路板及其制造方法
    • WO2011065788A2
    • 2011-06-03
    • PCT/KR2010008469
    • 2010-11-26
    • LG INNOTEK CO LTDKIM JIN SUKIM DUK NAMAHN JAE HYUNLEE SANG MYUNGSEO YEONG UKAHN CHI HEEYOON SUNG WOONNAM MYOUNG HWA
    • KIM JIN SUKIM DUK NAMAHN JAE HYUNLEE SANG MYUNGSEO YEONG UKAHN CHI HEEYOON SUNG WOONNAM MYOUNG HWA
    • H05K3/46H05K3/18H05K3/40
    • H05K3/4658H05K3/205H05K3/4007H05K3/4647H05K2203/0108Y10T29/49155
    • A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate.
    • 提供一种印刷电路板的结构及其制造方法。 该制造方法包括:在第一电路图案上形成至少一个连接凸块并形成第一绝缘层以形成内部电路板的第一步骤;使用模具处理其上形成有金属晶种层的第二绝缘层的第二步骤 以形成第二电路图案以构成外部电路板,以及将内部电路板和外部电路板彼此对准并层压内部电路板和外部电路板的第三步骤。 因此,可以提供具有嵌入在绝缘层中的电路的高密度高可靠性印刷电路板的结构。 可以通过使用与种子层结合的绝缘层来去除用于形成最外层电路的籽晶层形成工艺。 此外,形成连接凸块形式的导电结构,因此不需要形成通孔并且用导电材料填充通孔的复杂工艺。 此外,去除了填充的导电材料的表面的研磨过程,以显着降低电路错误率。
    • 10. 发明申请
    • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • 印刷电路板及其制造方法
    • WO2011043537A3
    • 2011-07-07
    • PCT/KR2010005124
    • 2010-08-05
    • LG INNOTEK CO LTDKIM JIN SUNAM MYOUNG HWASEO YEONG UKAHN CHI HEE
    • KIM JIN SUNAM MYOUNG HWASEO YEONG UKAHN CHI HEE
    • H05K3/18H05K3/20
    • H05K3/205H05K3/107H05K3/108H05K3/465H05K3/4658H05K2201/0355H05K2203/0108Y10T156/10
    • An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.
    • 提供一种嵌入式印刷电路板及其制造方法。 该制造方法包括:形成第一绝缘层的第一步骤,该第一绝缘层具有形成在其一侧上的晶种层以及嵌入其中的至少一个金属图案;以及第二步骤,将第一绝缘层和基础衬底层叠成具有内部电路, 介于第一绝缘层和基底之间的第二绝缘层。 因此,提供了具有嵌入绝缘层中的电路的印刷电路板,从而可以实现高密度和高可靠性的印刷电路板。 此外,由于使用模具制造印刷电路板,所以省略了用于嵌入的电路制造工艺,用于形成种子层的工艺以及诸如平面磨削的复杂工艺,以简化制造工艺。