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1. 发明申请

WO2010074510A3 STRUCTURE FOR MULTI-ROW LEADFRAME AND SEMICONDUCTOR PACKAGE THEREOF AND MANUFACTURE METHOD THEREOF 审中-公开
标题翻译：多引线框架结构及其半导体封装及其制造方法
公开(公告)号：WO2010074510A3
公开(公告)日：2010-09-10
申请号：PCT/KR2009007724
申请日：2009-12-23
申请人： LG INNOTEK CO LTD , CHUN HYUN A , CHOI JAE BONG , LEE SUNG WON , RYU SUNG WUK , LEE HYUK SOO , EOM SAI RAN
发明人： CHUN HYUN A , CHOI JAE BONG , LEE SUNG WON , RYU SUNG WUK , LEE HYUK SOO , EOM SAI RAN
IPC分类号： H01L23/495
CPC分类号： H01L21/4832 , H01L23/49582 , H01L24/29 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
摘要翻译：本发明涉及一种用于半导体封装的多列引线框，其特征在于：在引线框架材料上形成电镀图案（第一步骤）; 在电镀图案上形成保护图案（第二工序）; 并且通过使用保护图案作为掩模形成纳米图案（第三步骤），由此在电镀图案的上表面上形成保护图案，以通过防止由蚀刻溶液导致的镀层损伤而提高产品的可靠性引线框架的图案形成，从而解决了使用镀层作为蚀刻掩模的问题。

2. 发明申请

WO2010050773A3 EMBEDDED CAPACITOR AND METHOD FOR FABRICATING SAME 审中-公开
标题翻译：嵌入式电容器及其制造方法
公开(公告)号：WO2010050773A3
公开(公告)日：2010-08-05
申请号：PCT/KR2009006341
申请日：2009-10-30
申请人： LG INNOTEK CO LTD , CHOI JAE BONG , NAM SANG HYEOK
发明人： CHOI JAE BONG , NAM SANG HYEOK
IPC分类号： H01G9/045
CPC分类号： H05K1/162 , H01G4/005 , H01G4/10 , H01G4/33 , H05K3/4608 , H05K2201/09509 , H05K2203/0315 , H05K2203/1142
摘要： A capacitor according to an embodiment includes: a metal substrate; a metal oxide film formed on the metal substrate; a first electrode layer formed on a first surface of the metal oxide film; and a second electrode layer formed on a second surface of the metal oxide film.
摘要翻译：根据实施例的电容器包括：金属基板; 在金属基板上形成的金属氧化物膜; 形成在所述金属氧化物膜的第一表面上的第一电极层; 以及形成在金属氧化物膜的第二表面上的第二电极层。

3. 发明申请

WO2008147155A3 LANGUAGE TRAINING CONTENTS PROVIDING SYSTEM 审中-公开
标题翻译：语言培训内容提供系统
公开(公告)号：WO2008147155A3
公开(公告)日：2009-02-19
申请号：PCT/KR2008003080
申请日：2008-06-02
申请人： CHOI JAE BONG
发明人： CHOI JAE BONG
IPC分类号： G06Q10/00
CPC分类号： G09B5/06 , G09B19/06
摘要： A language learning content providing system is disclosed. The language learning content providing system includes learning-target words and images for the respective learning-target words, combines an associative image corresponding to an impression of a first letter constituting each of the learning-target words with any one of the learning-target word and an image for the learning- target word, and then provides the combination results to one or more user terminals connected over network. Further, the language learning content providing system enables each of the learning-target words to be mastered using the impression through the image for the learning-target word corresponding to the first letter constituting the learning-target word.
摘要翻译：公开了一种语言学习内容提供系统。语言学习内容提供系统包括针对各个学习目标词的学习目标词和图像，将与构成每个学习目标词的第一个字母的印象对应的关联图像与学习目标词中的任一个相结合以及用于学习目标词的图像，然后将组合结果提供给通过网络连接的一个或多个用户终端。此外，语言学习内容提供系统使得能够通过用于与构成学习目标词的第一个字母相对应的学习目标词的图像的印象来掌握学习目标词中的每一个。

4. 发明申请

WO2009069987A3 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND PANEL FOR MANUFACTURING THE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板及其制造方法以及制造印刷电路板的面板
公开(公告)号：WO2009069987A3
公开(公告)日：2009-08-20
申请号：PCT/KR2008007088
申请日：2008-12-01
申请人： LG ELECTRONICS INC , LEE KWANG TAE , LEE SUNG GUE , CHOI JAE BONG
发明人： LEE KWANG TAE , LEE SUNG GUE , CHOI JAE BONG
IPC分类号： H05K1/02
CPC分类号： H05K3/0097 , H05K1/0271 , H05K3/0052 , H05K2201/09354 , H05K2201/09736 , H05K2201/09781 , H05K2201/2009 , H05K2203/0169
摘要： Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
摘要翻译：公开了一种印刷电路板，包括：绝缘部件，其上限定有第一区域和第二区域;形成在第一区域上的电路图案;以及形成在第二区域上的支撑部件。

5. 发明申请

WO2009108030A3 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2009108030A3
公开(公告)日：2009-11-26
申请号：PCT/KR2009001010
申请日：2009-03-02
申请人： LG MICRON LTD , YOON HYE SUN , CHOI JAE BONG , LEE EUN JUNG , HWANG JUNG HO , HAN JOON WOOK
发明人： YOON HYE SUN , CHOI JAE BONG , LEE EUN JUNG , HWANG JUNG HO , HAN JOON WOOK
IPC分类号： H05K3/22 , H05K1/02
CPC分类号： H05K3/0097 , H05K1/036 , H05K1/0366 , H05K3/0052 , H05K3/06 , H05K3/107 , H05K3/244 , H05K3/3452 , H05K2201/0209 , H05K2201/0355 , H05K2201/068 , H05K2203/0278 , H05K2203/0315 , H05K2203/1536
摘要： Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.
摘要翻译：提供一种制造印刷电路板的方法，包括：在分离部件的两侧设置第一绝缘部件和第二绝缘部件以及第一导电膜和第二导电膜，对第一绝缘部件和第二绝缘部件进行热压接，在所述分离构件的两侧上形成膜，以将所述第一构件与所述分隔构件连接在所述第二构件上，并将所述第一绝缘构件附接到所述第一导电膜，并且将所述第二绝缘构件附接到所述第二导电膜，去除第一和第二导电膜以形成第一和第二电路图案，以及切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案与分离构件分离。

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