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1. 发明申请

US20070008050A1 Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor 失效
标题翻译：包括具有凹坑的共振部分的体声波谐振器及其制造方法
公开(公告)号：US20070008050A1
公开(公告)日：2007-01-11
申请号：US11397704
申请日：2006-04-05
申请人： Kyu-dong Jung , Jong-oh Kwon , Woon-bae Kim , In-sang Song
发明人： Kyu-dong Jung , Jong-oh Kwon , Woon-bae Kim , In-sang Song
IPC分类号： H03H9/54
CPC分类号： H03H9/173 , H03H3/02 , H03H9/174 , H03H2003/021 , H03H2003/023
摘要： A bulk acoustic resonance and a method for fabricating the bulk acoustic resonator, the bulk acoustic resonator including: a substrate including an upper surface defining a predetermined area including a cavity; a resonance part positioned above the cavity and including a surface comprising a dimple; and an anchor part connecting the resonance part to the substrate. The resonance part includes: a lower electrode including a lower surface including a predetermined dimpled area and an upper surface opposite to the predetermined dimpled area; a piezoelectric layer stacked on the upper surface of the lower electrode; and an upper electrode stacked on the piezoelectric layer. Because direction of the vibration of the resonator is adjustable by adjusting position, area, and the number of the dimples, process freedom can be improved.
摘要翻译：一种体声共振和一种用于制造体声波谐振器的方法，所述体声波谐振器包括：基板，包括限定包括空腔的预定区域的上表面; 谐振部分，其位于空腔上方并包括包括凹坑的表面; 以及将共振部分连接到基板的锚固部分。共振部包括：下电极，其包括具有预定凹坑区域的下表面和与预定凹坑区域相对的上表面; 压电层，堆叠在下电极的上表面上; 以及堆叠在压电层上的上电极。由于通过调节位置，面积和凹坑的数量来调节谐振器的振动方向，可以提高工艺自由度。

2. 发明授权

US07456709B2 Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor 失效
标题翻译：包括具有凹坑的共振部分的体声波谐振器及其制造方法
公开(公告)号：US07456709B2
公开(公告)日：2008-11-25
申请号：US11397704
申请日：2006-04-05
申请人： Kyu-dong Jung , Jong-oh Kwon , Woon-bae Kim , In-sang Song
发明人： Kyu-dong Jung , Jong-oh Kwon , Woon-bae Kim , In-sang Song
IPC分类号： H03H9/15 , H03H9/54
CPC分类号： H03H9/173 , H03H3/02 , H03H9/174 , H03H2003/021 , H03H2003/023
摘要： A bulk acoustic resonance and a method for fabricating the bulk acoustic resonator, the bulk acoustic resonator including: a substrate including an upper surface defining a predetermined area including a cavity; a resonance part positioned above the cavity and including a surface comprising a dimple; and an anchor part connecting the resonance part to the substrate. The resonance part includes: a lower electrode including a lower surface including a predetermined dimpled area and an upper surface opposite to the predetermined dimpled area; a piezoelectric layer stacked on the upper surface of the lower electrode; and an upper electrode stacked on the piezoelectric layer. Because direction of the vibration of the resonator is adjustable by adjusting position, area, and the number of the dimples, process freedom can be improved.
摘要翻译：一种体声共振和一种用于制造体声波谐振器的方法，所述体声波谐振器包括：基板，包括限定包括空腔的预定区域的上表面; 谐振部分，其位于空腔上方并包括包括凹坑的表面; 以及将共振部分连接到基板的锚固部分。共振部包括：下电极，其包括具有预定凹坑区域的下表面和与预定凹坑区域相对的上表面; 压电层，堆叠在下电极的上表面上; 以及堆叠在压电层上的上电极。由于通过调节位置，面积和凹坑的数量来调节谐振器的振动方向，可以提高工艺自由度。

3. 发明授权

US07374972B2 Micro-package, multi-stack micro-package, and manufacturing method therefor 有权
标题翻译：微封装，多堆微型封装及其制造方法
公开(公告)号：US07374972B2
公开(公告)日：2008-05-20
申请号：US11782404
申请日：2007-07-24
申请人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
摘要翻译：提供微型封装，多堆叠微型封装及其制造方法。根据本发明的微型封装包括用于安装器件的器件基板，作为电路模块; 保护装置的保护帽; 通过在器件基板上的预定区域上图案化而形成的结合物质将器件基板和保护盖接合; 形成在器件基板的一部分上的层和粘合物质的保护盖的一部分和外侧; 通过蚀刻掉保护盖的另一部分并且通过接合物质电连接到器件基板的上表面而形成的通孔; 在通孔上形成的阻挡金属（UBM）; 以及形成在UBM上的作为外部信号的连接端子的焊料保险杠。如上所述，本发明具有保证气密密封的优点，因为上述层防止从外部吸湿，同时降低了对包装内部装置的损坏的可能性，因为处理温度在晶片接合后下降到150°以下涉及使用聚合物物质作为结合物质。

4. 发明授权

US07285865B2 Micro-package, multi-stack micro-package, and manufacturing method therefor 有权
公开(公告)号：US07285865B2
公开(公告)日：2007-10-23
申请号：US11396544
申请日：2006-04-04
申请人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.

5. 发明申请

US20070012655A1 Micro-package, multi-stack micro-package, and manufacturing method therefor 有权
标题翻译：微封装，多堆微型封装及其制造方法
公开(公告)号：US20070012655A1
公开(公告)日：2007-01-18
申请号：US11396544
申请日：2006-04-04
申请人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01B13/00 , H01L21/30 , H01L21/00 , H01L23/52
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
摘要翻译：提供微型封装，多堆叠微型封装及其制造方法。根据本发明的微型封装包括用于安装器件的器件基板，作为电路模块; 保护装置的保护帽; 通过在器件基板上的预定区域上图案化而形成的结合物质将器件基板和保护盖接合; 形成在器件基板的一部分上的层和粘合物质的保护盖的一部分和外侧; 通过蚀刻掉保护盖的另一部分并且通过接合物质电连接到器件基板的上表面而形成的通孔; 在通孔上形成的阻挡金属（UBM）; 以及形成在UBM上的作为外部信号的连接端子的焊料保险杠。如上所述，本发明具有保证气密密封的优点，因为上述层防止从外部吸湿，同时降低了对包装内部装置的损坏的可能性，因为处理温度在晶片接合后下降到150°以下涉及使用聚合物物质作为结合物质。

6. 发明申请

US20090142050A1 MICRO SHUTTER HAVING IRIS FUNCTION, METHOD FOR MANUFACTURING THE SAME, AND MICRO CAMERA MODULE HAVING THE SAME 有权
标题翻译：具有IRIS功能的MICRO SHUTTER，其制造方法和具有该功能的微型相机模块
公开(公告)号：US20090142050A1
公开(公告)日：2009-06-04
申请号：US12134324
申请日：2008-06-06
申请人： Che-heung KIM , Woon-bae Kim , Jong-oh Kwon , Kyu-dong Jung
发明人： Che-heung KIM , Woon-bae Kim , Jong-oh Kwon , Kyu-dong Jung
IPC分类号： G03B9/28 , B05D5/12
CPC分类号： G03B9/28
摘要： A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.
摘要翻译：具有虹膜功能的微型快门包括：底板，其具有与允许光通过的图像传感器相对应的圆形形状的透明部分; 多个汇集叶片，其将光线布置在基板上的透明部分的圆周上的正多边形以覆盖透明部分，并且多个汇总叶片中的每一个具有固定到基板的固定部分以及朝向固定部分卷起的移动部分; 以及与所述基板和所述多个汇总叶片电连接的控制器，其控制所述多个汇总叶片的展开度。

7. 发明授权

US08147150B2 Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same 有权
标题翻译：具有虹膜功能的微型快门及其制造方法以及具有该功能的微型相机模块
公开(公告)号：US08147150B2
公开(公告)日：2012-04-03
申请号：US13270723
申请日：2011-10-11
申请人： Che-heung Kim , Woon-bae Kim , Jong-oh Kwon , Kyu-Dong Jung
发明人： Che-heung Kim , Woon-bae Kim , Jong-oh Kwon , Kyu-Dong Jung
IPC分类号： G03B9/34
CPC分类号： G03B9/28
摘要： A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.
摘要翻译：具有虹膜功能的微型快门包括：底板，其具有与允许光通过的图像传感器相对应的圆形形状的透明部分; 多个汇集叶片，其将光线布置在基板上的透明部分的圆周上的正多边形以覆盖透明部分，并且多个汇总叶片中的每一个具有固定到基板的固定部分以及朝向固定部分卷起的移动部分; 以及与所述基板和所述多个汇总叶片电连接的控制器，其控制所述多个汇总叶片的展开度。

8. 发明授权

US08061910B2 Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same 有权
标题翻译：具有虹膜功能的微型快门及其制造方法以及具有该功能的微型相机模块
公开(公告)号：US08061910B2
公开(公告)日：2011-11-22
申请号：US12134324
申请日：2008-06-06
申请人： Che-heung Kim , Woon-bae Kim , Jong-oh Kwon , Kyu-dong Jung
发明人： Che-heung Kim , Woon-bae Kim , Jong-oh Kwon , Kyu-dong Jung
IPC分类号： G03B9/34
CPC分类号： G03B9/28
摘要： A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.
摘要翻译：具有虹膜功能的微型快门包括：底板，其具有与允许光通过的图像传感器相对应的圆形形状的透明部分; 多个汇集叶片，其将光线布置在基板上的透明部分的圆周上的正多边形以覆盖透明部分，并且多个汇总叶片中的每一个具有固定到基板的固定部分以及朝向固定部分卷起的移动部分; 以及与所述基板和所述多个汇总叶片电连接的控制器，其控制所述多个汇总叶片的展开度。

9. 发明授权

US07663083B2 Image sensor module having electric component and fabrication method thereof 有权
标题翻译：具有电子部件的图像传感器模块及其制造方法
公开(公告)号：US07663083B2
公开(公告)日：2010-02-16
申请号：US12185910
申请日：2008-08-05
申请人： Jong-oh Kwon , Yoon-chul Son , Kyu-dong Jung , Woon-bae Kim
发明人： Jong-oh Kwon , Yoon-chul Son , Kyu-dong Jung , Woon-bae Kim
IPC分类号： H01L23/52
CPC分类号： G01J1/02 , G01J1/0204 , G01J1/0219 , G01J1/0271 , G01J1/04 , G01J1/0411 , H01L27/14618 , H01L27/14625 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00
摘要： An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.
摘要翻译：公开了能够促进电气部件的电气和机械连接及其制造的图像传感器模块。图像传感器模块包括传感器芯片; 设置在所述传感器芯片上方的至少一个透镜; 相对于所述至少一个透镜布置的至少一个电气部件，以调节所述至少一个透镜的光学特性; 容纳和封闭传感器芯片的壳体，所述至少一个透镜和所述至少一个电气部件，并且具有用于将所述至少一个透镜暴露于其外部的开口; 以及纵向设置在所述壳体的内表面上的布线部分，并且包括至少一个导线，其具有暴露于所述壳体的外部的第一连接端子，以允许所述至少一根导线电连接所述壳体的端子垫至少一个具有外部电子设备的电气部件和连接到所述至少一个电气部件的端子焊盘的第二连接端子。

10. 发明申请

US20080292814A1 IMAGE FORMING ELEMENT AND FABRICATING METHOD THEREOF, AND IMAGE FORMING APPARATUS 审中-公开
标题翻译：图像形成元件及其制作方法和图像形成装置
公开(公告)号：US20080292814A1
公开(公告)日：2008-11-27
申请号：US12014975
申请日：2008-01-16
申请人： Woon-bae KIM , Jong-oh Kwon , Seung-tae Choi , Chang-youl Moon , Soon-cheol Kwon , Ki-hwan Kwon
发明人： Woon-bae KIM , Jong-oh Kwon , Seung-tae Choi , Chang-youl Moon , Soon-cheol Kwon , Ki-hwan Kwon
IPC分类号： C23C26/00 , G03G15/00
CPC分类号： G03G5/105 , G03G5/0205 , G03G15/05 , G03G15/348 , G03G2217/0075
摘要： An image forming element, a fabricating method of the image forming element, and an image forming apparatus having the image forming element is provided. The image forming element includes a drum body, a driving circuit mounted within the drum body, a support plate which penetrates through the drum body longitudinally along the drum body, the support plate being coupled to the driving circuit, an insulating layer formed on at least one portion of an outer circumference of the drum body, a conductive polymer layer formed on the insulating layer, the conductive polymer layer including one or more conductive areas and one or more insulating areas, which are aligned in an alternating pattern, and a protective layer formed on the conductive polymer layer, wherein the conductive areas on the conductive polymer layer are electrically connected to the driving circuit. Therefore, an image forming element can be provided in which a conductive layer is formed so that conductive areas and insulating areas are patterned without stepped portions therebetween, simplifying the fabricating process and improving the precision.
摘要翻译：提供了图像形成元件，图像形成元件的制造方法和具有图像形成元件的图像形成装置。图像形成元件包括鼓本体，安装在鼓本体内的驱动电路，沿着鼓体纵向穿过鼓体的支撑板，支撑板与驱动电路连接，至少形成绝缘层所述滚筒主体的外周的一部分，形成在所述绝缘层上的导电聚合物层，所述导电聚合物层包括以交替图案排列的一个或多个导电区域和一个或多个绝缘区域以及保护层形成在导电聚合物层上，其中导电聚合物层上的导电区域电连接到驱动电路。因此，可以提供一种图像形成元件，其中形成导电层，使得导电区域和绝缘区域被图案化而没有其间的阶梯部分，简化了制造工艺并提高了精度。

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