专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08321876B2 System and method of dynamically loading and executing module devices using inter-core-communication channel in multicore system environment 有权
标题翻译：在多核系统环境中使用核心间通信通道动态加载和执行模块设备的系统和方法
公开(公告)号：US08321876B2
公开(公告)日：2012-11-27
申请号：US12142714
申请日：2008-06-19
申请人： Kwang Yong Lee , Dong Hwan Kim , Dong Wook Kang , Jae Myoung Kim
发明人： Kwang Yong Lee , Dong Hwan Kim , Dong Wook Kang , Jae Myoung Kim
IPC分类号： G06F9/44
CPC分类号： G06F9/546 , G06F9/5044 , G06F9/505
摘要： Provided are a system and method for allocating a specific job or application to a specific slave core by using an inter-core-communication (ICC) channel and executing the job or application in a multicore system environment including the master core and a plurality of slave cores. The method of a master core, includes: initializing message transmission times; generating an event for processing a instruction received from an application program and generating a channel event message from the event; checking a process for transmitting the generated channel event message, and if a channel event message queue corresponding to an event transmitting request is not “FULL” of a previously-stored channel event message, transmitting the channel event message to a specific slave core to request for storing the channel event message; and returning a response of processing status to the request for storing the channel event message to the application program.
摘要翻译：提供了一种用于通过使用核心间通信（ICC）信道将特定作业或应用分配给特定作业或应用的系统和方法，并且在包括主核和多个从属单元的多核系统环境中执行作业或应用核心。主核心的方法包括：初始化消息传输时间; 生成用于处理从应用程序接收的指令并从所述事件生成频道事件消息的事件; 检查用于发送所生成的信道事件消息的过程，并且如果与事件发送请求相对应的信道事件消息队列不是先前存储的信道事件消息的FULL，则将信道事件消息发送到特定从属核心以请求存储频道事件消息; 以及将处理状态的响应返回到所述应用程序的存储所述信道事件消息的请求。

2. 发明授权

US08324522B2 Reflow apparatus, reflow method, and package apparatus 有权
标题翻译：回流装置，回流方法和包装装置
公开(公告)号：US08324522B2
公开(公告)日：2012-12-04
申请号：US12591821
申请日：2009-12-02
申请人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
发明人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
IPC分类号： B23K3/00 , B23K26/00
CPC分类号： B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K3/0475 , B23K3/087 , B23K2101/42 , H01L24/75 , H01L24/81 , H05K3/3494 , H05K2203/101 , H05K2203/1509
摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
摘要翻译：提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。回流装置可以包括线圈，支撑构件和移动构件。线圈可以从电源接收电流，以使用感应加热方法加热焊球。支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

3. 发明申请

US20100181293A1 Reflow apparatus, Reflow method, and package apparatus 有权
标题翻译：回流装置，回流法和包装装置
公开(公告)号：US20100181293A1
公开(公告)日：2010-07-22
申请号：US12591821
申请日：2009-12-02
申请人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
发明人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
IPC分类号： B23K1/00
CPC分类号： B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K3/0475 , B23K3/087 , B23K2101/42 , H01L24/75 , H01L24/81 , H05K3/3494 , H05K2203/101 , H05K2203/1509
摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
摘要翻译：提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。回流装置可以包括线圈，支撑构件和移动构件。线圈可以从电源接收电流，以使用感应加热方法加热焊球。支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

4. 发明授权

US08015835B2 Internal cooling apparatus for automobiles 有权
标题翻译：汽车内部冷却装置
公开(公告)号：US08015835B2
公开(公告)日：2011-09-13
申请号：US12261481
申请日：2008-10-30
申请人： Kwang Yong Lee , Young Jo Park , Dong Han Kim , Jung Yong Park , Jae Ho Jeong
发明人： Kwang Yong Lee , Young Jo Park , Dong Han Kim , Jung Yong Park , Jae Ho Jeong
IPC分类号： F25B5/00 , B60H1/32 , A47C7/74
CPC分类号： B60H1/00285 , B60H1/323 , B60H2001/00307 , B60H2001/00942
摘要： An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.
摘要翻译：用于汽车的内部冷却装置包括：第一膨胀阀，用于通过高压管将冷却剂喷射到主蒸发器;压缩机，其通过低压管接收在主蒸发器中蒸发的冷却剂;冷凝器，接收压缩在压缩机和多个副蒸发器，其各自安装在座椅内部以接触汽车乘客。每个副蒸发器的一端与高压管连通，另一端与低压管连通，使得通过第一膨胀阀喷射的冷却剂的一部分通过副蒸发器。

5. 发明申请

US20090193827A1 INTERNAL COOLING APPARATUS FOR AUTOMOBILES 有权
标题翻译：汽车内部冷却装置
公开(公告)号：US20090193827A1
公开(公告)日：2009-08-06
申请号：US12261481
申请日：2008-10-30
申请人： Kwang Yong Lee , Young Jo Park , Dong Han Kim , Jung Yong Park , Jae Ho Jeong
发明人： Kwang Yong Lee , Young Jo Park , Dong Han Kim , Jung Yong Park , Jae Ho Jeong
IPC分类号： B60H1/32 , F25B5/02 , F25B49/02
CPC分类号： B60H1/00285 , B60H1/323 , B60H2001/00307 , B60H2001/00942
摘要： An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.
摘要翻译：用于汽车的内部冷却装置包括：第一膨胀阀，用于通过高压管将冷却剂喷射到主蒸发器;压缩机，其通过低压管接收在主蒸发器中蒸发的冷却剂;冷凝器，接收压缩在压缩机和多个副蒸发器，其各自安装在座椅内部以接触汽车乘客。每个副蒸发器的一端与高压管连通，另一端与低压管连通，使得通过第一膨胀阀喷射的冷却剂的一部分通过副蒸发器。

6. 发明申请

US20100129695A1 MOLDING MATERIAL FOR FUEL CELL SEPARATOR 审中-公开
标题翻译：燃料电池分离器成型材料
公开(公告)号：US20100129695A1
公开(公告)日：2010-05-27
申请号：US12494205
申请日：2009-06-29
申请人： Nam Ik Im , Kwang Yong Lee , Jeong Heon Kim , Ho Sub Lee , Sung Hun Ryu
发明人： Nam Ik Im , Kwang Yong Lee , Jeong Heon Kim , Ho Sub Lee , Sung Hun Ryu
IPC分类号： H01M2/02 , C08K3/04
CPC分类号： H01M8/0221 , H01M8/0213 , H01M8/0226
摘要： The present invention relates to a molding material for a fuel cell separator including a graphite complex having a mixture of expandable graphite and non-expandable graphite; at least one of the conductive fillers selected from the group consisting of carbon black, carbon fiber and carbon nanotube; and at least one resin selected from a thermoplastic resin and thermosetting resin. With the present invention, both the mechanical strength and electrical conductivity of the fuel cell separator can be simultaneously improved.
摘要翻译：本发明涉及一种用于燃料电池隔板的模塑材料，其包括具有可膨胀石墨和不可膨胀石墨混合物的石墨复合物; 至少一种选自碳黑，碳纤维和碳纳米管的导电填料; 和选自热塑性树脂和热固性树脂中的至少一种树脂。通过本发明，可以同时提高燃料电池隔板的机械强度和电导率。

7. 发明授权

US08420989B2 Coil and semiconductor apparatus having the same 有权
标题翻译：具有相同的线圈和半导体装置
公开(公告)号：US08420989B2
公开(公告)日：2013-04-16
申请号：US12615507
申请日：2009-11-10
申请人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong , Hyun jeong Woo
发明人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong , Hyun jeong Woo
IPC分类号： H05B6/10
CPC分类号： H05B6/36 , B23K1/0016 , B23K1/002 , B23K2101/40 , H01L24/81 , H01L2224/81222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H05K3/3436 , H05K3/3494 , H05K2203/101
摘要： An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.
摘要翻译：封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。第一和第二主体相对于设置在它们之间的垂直平面是对称的。第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。

8. 发明授权

US08225142B2 Method and system for tracepoint-based fault diagnosis and recovery 有权
标题翻译：基于跟踪点故障诊断和恢复的方法和系统
公开(公告)号：US08225142B2
公开(公告)日：2012-07-17
申请号：US12787086
申请日：2010-05-25
申请人： Kwang Yong Lee , Su-min Park
发明人： Kwang Yong Lee , Su-min Park
IPC分类号： G06F11/00
CPC分类号： G06F11/079
摘要： A system for tracepoint-based fault diagnosis and recovery includes: a system state tracing model unit for storing state tracing models which are obtained by a modeling technique and are required for fault diagnosis and recovery; a state diagnosis unit for determining whether or not an action event is executable with reference to the state tracing models when the action event is received from a specific tracepoint among multiple tracepoints which exist in each of components within an operating system of the system, and generating a fault recovery command when it is determined that the action is not executable, that is, a fault has occurred; and a fault recovery unit for performing a fault recovery processing based on the state tracing models in response to the generated fault recovery command.
摘要翻译：用于基于跟踪点的故障诊断和恢复系统包括：用于存储通过建模技术获得并且是故障诊断和恢复所需的状态跟踪模型的系统状态跟踪模型单元; 状态诊断单元，用于当从所述系统的操作系统中的每个组件中存在的多个跟踪点中的特定跟踪点接收到所述动作事件时，参考所述状态跟踪模型来确定动作事件是否可执行，并且生成确定动作不可执行的故障恢复命令，即已发生故障; 以及故障恢复单元，用于响应于所生成的故障恢复命令，基于状态跟踪模型执行故障恢复处理。

9. 发明授权

US08106554B2 Blower motor assembly for vehicle 有权
标题翻译：汽车用鼓风机电机总成
公开(公告)号：US08106554B2
公开(公告)日：2012-01-31
申请号：US12255848
申请日：2008-10-22
申请人： Kwang Yong Lee , Dong Han Kim
发明人： Kwang Yong Lee , Dong Han Kim
IPC分类号： H02K15/14 , B60H1/00
CPC分类号： F04D29/40
摘要： Disclosed herein is a blower motor assembly for a vehicle. The blower motor assembly comprises an armature assembly, a motor body, a magnet, an upper case, and a lower case. The armature assembly comprises a rotatable armature shaft with an armature. The motor body is an open cylinder that houses the armature assembly. The magnet is installed between the motor body and the armature assembly. The upper case has a through-hole which permits the armature shaft to projects outward through. The lower case is coupled to the upper case. The motor body is installed in an internal space defined by the coupled upper and lower cases. The motor body is fixed in a correspondingly-shaped hollow portion defined by a wall of a motor body fixing portion formed in the lower case. The magnet is fixed to a magnet fixing portion formed in the lower case.
摘要翻译：这里公开了一种用于车辆的鼓风机马达组件。鼓风机马达组件包括电枢组件，马达主体，磁体，上壳体和下壳体。电枢组件包括具有电枢的可旋转电枢轴。电机主体是容纳电枢组件的开放式气缸。磁体安装在电机主体和电枢组件之间。上壳体具有允许电枢轴向外突出的通孔。下壳体联接到上壳体。电动机体安装在由上下壳体限定的内部空间中。马达主体固定在形成在下壳体中的电动机主体固定部分的壁限定的相应形状的中空部分中。磁体固定在形成在下壳体中的磁铁固定部分。

10. 发明申请

US20100096754A1 Semiconductor package, semiconductor module, and method for fabricating the semiconductor package 审中-公开
标题翻译：半导体封装，半导体模块和用于制造半导体封装的方法
公开(公告)号：US20100096754A1
公开(公告)日：2010-04-22
申请号：US12588477
申请日：2009-10-16
申请人： Jonggi Lee , SunWon Kang , Young Lyong Kim , Jongho Lee , Chul-Yong Jang , Minill Kim , Eunchul Ahn , Kwang Yong Lee , Seungduk Baek , Ji-Seok Hong
发明人： Jonggi Lee , SunWon Kang , Young Lyong Kim , Jongho Lee , Chul-Yong Jang , Minill Kim , Eunchul Ahn , Kwang Yong Lee , Seungduk Baek , Ji-Seok Hong
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/13 , H01L21/568 , H01L23/3114 , H01L23/525 , H01L24/06 , H01L24/11 , H01L2224/0231 , H01L2224/02313 , H01L2224/0233 , H01L2224/0239 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/111 , H01L2224/11334 , H01L2224/1191 , H01L2224/13012 , H01L2224/13014 , H01L2224/13022 , H01L2224/13099 , H01L2224/13147 , H01L2224/13155 , H01L2224/13609 , H01L2224/13611 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/01083 , H01L2924/00012 , H01L2924/00
摘要： Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line.
摘要翻译：提供半导体封装，半导体模块和制造半导体封装的方法。该方法提供了包括接合焊盘的衬底。该方法形成用于使衬底上的焊盘露出的介电层。该方法形成在电介质层上电连接到接合焊盘的再分配线。该方法形成外部端子，该外部端子电连接到接合焊盘，而不使用在再分配线上限制外部端子的位置的焊接掩模。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式