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1. 发明申请

US20050007711A1 Power adapter interface circuitry for protecting a battery operated system 有权
标题翻译：用于保护电池供电系统的电源适配器接口电路
公开(公告)号：US20050007711A1
公开(公告)日：2005-01-13
申请号：US10615458
申请日：2003-07-08
申请人： Kwang Liu , Sorin Negru , George Hsieh , Jacky Chen , Frank Shih , Scott Wu
发明人： Kwang Liu , Sorin Negru , George Hsieh , Jacky Chen , Frank Shih , Scott Wu
IPC分类号： H02H3/20 , H02H11/00
CPC分类号： H02H3/202 , H02H3/207 , H02H11/002
摘要： An integrated circuit (IC) has logic and timing circuits that are coupled to discrete circuitry to provide protection and indications whenever an AC adapter that is faulty or has improper voltage levels or polarity are plugged into a system. In particular, the IC device provides over-voltage, under-voltage, and reversed-polarity protections to an electronic system to keep the electronic system from being damaged by an alternating current (AC) adapter having an improper voltage range or voltage polarity. It also provides a protection that prevents an adapter from powering a host system that has a short-circuit fault.
摘要翻译：集成电路（IC）具有耦合到分立电路的逻辑和定时电路，以便每当故障或具有不正确的电压电平或极性的AC适配器插入系统时提供保护和指示。特别地，IC器件向电子系统提供过电压，欠压和反向极性保护，以保持电子系统不被具有不正确的电压范围或电压极性的交流（AC）适配器损坏。它还提供防止适配器为具有短路故障的主机系统供电的保护。

2. 发明授权

US07106566B2 Power adapter interface circuitry for protecting a battery operated system 有权
标题翻译：用于保护电池供电系统的电源适配器接口电路
公开(公告)号：US07106566B2
公开(公告)日：2006-09-12
申请号：US10615458
申请日：2003-07-08
申请人： Kwang H. Liu , Sorin Negru , George Hsieh , Jacky Chen , Frank Shih , Scott Wu
发明人： Kwang H. Liu , Sorin Negru , George Hsieh , Jacky Chen , Frank Shih , Scott Wu
IPC分类号： H02H3/00
CPC分类号： H02H3/202 , H02H3/207 , H02H11/002
摘要： An integrated circuit (IC) has logic and timing circuits that are coupled to discrete circuitry to provide protection and indications whenever an AC adapter that is faulty or has improper voltage levels or polarity are plugged into a system. In particular, the IC device provides over-voltage, under-voltage, and reversed-polarity protections to an electronic system to keep the electronic system from being damaged by an alternating current (AC) adapter having an improper voltage range or voltage polarity. It also provides a protection that prevents an adapter from powering a host system that has a short-circuit fault.
摘要翻译：集成电路（IC）具有耦合到分立电路的逻辑和定时电路，以便每当故障或具有不正确的电压电平或极性的AC适配器插入系统时提供保护和指示。特别地，IC器件向电子系统提供过电压，欠压和反向极性保护，以保持电子系统不被具有不正确的电压范围或电压极性的交流（AC）适配器损坏。它还提供防止适配器为具有短路故障的主机系统供电的保护。

3. 发明授权

US12066134B2 Valve connector for a high pressure air pump 有权
公开(公告)号：US12066134B2
公开(公告)日：2024-08-20
申请号：US17890422
申请日：2022-08-18
申请人： Scott Wu
发明人： Scott Wu
IPC分类号： F16K15/20 , F16L37/10
CPC分类号： F16L37/101 , F16K15/20 , Y10T137/3724
摘要： A valve connector for a high pressure air pump includes an outer sleeve having opposite first and second ends. The outer sleeve includes a coupling hole extending along a rotating axis and a receiving space intercommunicating with the coupling hole and located adjacent to the first end of the outer sleeve. An abutting member includes an abutting end received in the receiving space and a connecting end opposite to the abutting end. The abutting member includes an inlet passageway intercommunicating with the abutting end and the connecting end. An outer periphery of an airtight member about the rotating axis slidably abuts and is in airtight contact with an inner periphery of the receiving space. The airtight member is movable toward the first end or the second end. The airtight end face is configured to be biased toward the first end by air current entering from the inlet passageway.

4. 发明公开

US20230152176A1 Pressure Gauge for Air Pump 审中-公开
公开(公告)号：US20230152176A1
公开(公告)日：2023-05-18
申请号：US17524805
申请日：2021-11-12
申请人： Scott Wu
发明人： Scott Wu
IPC分类号： G01L19/10 , G01L19/14
CPC分类号： G01L19/10 , G01L19/143
摘要： A pressure gauge adapted to be mounted in a containing recess of an air pump includes a housing arranged in the containing recess, a driving member movably arranged in the housing, a biasing member biasing the driving member toward the housing, a driven member configured to be driven to rotate by the driving member, a pointer needle connected with the driven member, a scale plate disposed between the driven member and the pointer needle, and a guiding member arranged between the housing and the driving member. The guiding member is configured to contact at least one of the housing and the driving member to remain the driving member moving relative to the housing in a straight direction.

5. 发明申请

US20180266408A1 Air Pump including Storage Tank Including Outlet Port Adapted to be Opened/closed Automatically 审中-公开
公开(公告)号：US20180266408A1
公开(公告)日：2018-09-20
申请号：US15461763
申请日：2017-03-17
申请人： Scott Wu
发明人： Scott Wu
IPC分类号： F04B39/10 , F04B33/00 , F04B41/02
CPC分类号： F04B39/10 , F04B33/00 , F04B33/005 , F04B39/1006 , F04B39/1013 , F04B39/123 , F04B41/02 , F04B49/22 , Y10T137/86035
摘要： An air pump includes a pumping system, a storage tank, a discharge passage, and a valve. The discharge passage includes a first section and a second section wider than the first section. The valve is movable in the discharge passage. The valve, disposed in a first position, includes a first seal end disposed in the first section and abutting a periphery thereof and includes a second seal end disposed in the second section and abutting a periphery thereof. The valve, disposed in a second position, includes the first seal end disengaging from the first section and not abutting the periphery thereof and includes the second seal end disposed in the second section and abutting the periphery thereof. The first and second seal ends respectively have first and second cross-sectional areas. The ratio of the second cross-sectional area to the first cross-sectional area is at least 2 to 1.

6. 发明申请

US20180058617A1 Pump Head of Air Pump 审中-公开
公开(公告)号：US20180058617A1
公开(公告)日：2018-03-01
申请号：US15245228
申请日：2016-08-24
申请人： Scott Wu
发明人： Scott Wu
IPC分类号： F16L37/18 , F16L37/20
CPC分类号： B60C23/00 , F04B33/00 , F04B39/121 , F16L37/18 , F16L37/20 , Y10T137/3724
摘要： A pump head of an air pump includes a head including an outer body, a handle, and an end cap. The outer body includes a compartment extending therein. The handle is connected to a first end of the outer body. The end cap is connected to a second end of the outer body. A retaining device is received by the compartment and includes a seat actuated by the handle. An air seal ring is received by the compartment and is selectively compressed by the seat. The seat includes a cavity extending therein, at least one slot extending radially from the cavity and through the seat, and at least one retaining arm extending between two sides of the at least one slot and resiliently swingable. The air seal ring has an outer periphery section curved radially inwardly with respect to other periphery sections along a longitudinal length thereof.

7. 发明申请

US20160169423A1 Shock Pump Adapter 审中-公开
标题翻译：冲击泵适配器
公开(公告)号：US20160169423A1
公开(公告)日：2016-06-16
申请号：US14565464
申请日：2014-12-10
申请人： Scott Wu
发明人： Scott Wu
IPC分类号： F16L15/08 , F16F9/43 , F16L29/00
CPC分类号： F16F9/43 , Y10T137/3724
摘要： A shock pump adapter includes a communication device configured to include an inner tube and an outer tube. The inner and outer tubes are rotatable with respect to one another. A valve insert fixes to one of two ends of and is rotatable with the inner tube and includes a first channel fluidly connecting to a hollow of the inner tube. An air inlet joint fixes to the other of the two ends of and is rotatable with the inner tube. The air inlet joint includes a second channel fluidly connecting to the hollow of the inner tube and a one-way valve disposed in the second channel. An air outlet joint connects to and is disposed at the other of the two ends of the communication device. The air outlet joint fixes to and is rotatable with the outer tube.
摘要翻译：冲击泵适配器包括构造成包括内管和外管的通信装置。内管和外管可相对于彼此旋转。阀插入件固定到内管的两端之一并且可与内管一起旋转，并且包括流体连接到内管的中空部的第一通道。空气入口接头固定到两个端部中的另一端并且可与内管一起旋转。空气入口接头包括流体连接到内管的中空部的第二通道和设置在第二通道中的单向阀。空气出口接头连接到并设置在通信设备的两端的另一端。空气出口接头固定在外管上并且可与外管一起旋转。

8. 发明授权

US09257410B2 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate 有权
标题翻译：包含半导体衬底的封装组件，其中半导体衬底的表面的第一部分相对于半导体衬底的表面的第二部分凹陷，以在半导体衬底中形成凹陷区域
公开(公告)号：US09257410B2
公开(公告)日：2016-02-09
申请号：US13012644
申请日：2011-01-24
申请人： Albert Wu , Roawen Chen , Chung Chyung Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
发明人： Albert Wu , Roawen Chen , Chung Chyung Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L25/04 , H01L21/48 , H01L23/13 , H01L23/14 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/00 , H01L23/367 , H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供了一种装置，包括具有第一表面的半导体衬底，与第一表面相对设置的第二表面，其中第一表面的至少一部分被凹入以形成半导体衬底的凹陷区域，以及形成在半导体衬底的凹陷区域中以在半导体衬底的第一表面和第二表面之间提供电或热路径的一个或多个通孔，以及耦合到半导体衬底的管芯，该管芯电耦合到形成在半导体衬底的凹陷区域中的一个或多个通孔。可以描述和/或要求保护其他实施例。

9. 发明授权

US09034730B2 Recessed semiconductor substrates and associated techniques 有权
标题翻译：嵌入式半导体衬底及相关技术
公开(公告)号：US09034730B2
公开(公告)日：2015-05-19
申请号：US13015988
申请日：2011-01-28
申请人： Albert Wu , Roawen Chen , Chung Chyung Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
发明人： Albert Wu , Roawen Chen , Chung Chyung Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L21/762 , H01L25/04 , H01L21/48 , H01L23/13 , H01L23/14 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/00 , H01L23/367 , H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供一种方法，包括提供半导体衬底，其具有（i）第一表面和（ii）与第一表面相对设置的第二表面，在半导体衬底的第一表面中形成一个或多个通孔一个或多个通孔最初仅通过半导体衬底的一部分而不到达第二表面，在半导体衬底的第一表面上形成电介质膜，在电介质膜上形成再分布层，再分配层电耦合连接到所述一个或多个通孔，将一个或多个管芯耦合到所述再分布层，形成模制化合物以封装所述一个或多个管芯的至少一部分，以及使所述半导体衬底的所述第二表面凹陷以暴露所述一个或多个通孔。可以描述和/或要求保护其他实施例。

10. 发明授权

US08618654B2 Structures embedded within core material and methods of manufacturing thereof 有权
公开(公告)号：US08618654B2
公开(公告)日：2013-12-31
申请号：US13184304
申请日：2011-07-15
申请人： Sehat Sutardja , Albert Wu , Scott Wu
发明人： Sehat Sutardja , Albert Wu , Scott Wu
IPC分类号： H01L23/34
CPC分类号： H01L25/50 , H01L23/12 , H01L23/3114 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/24051 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2224/92224 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.

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