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1. 发明授权

US06849824B2 Multibeam laser drilling apparatus 有权
标题翻译：多波束激光钻孔设备
公开(公告)号：US06849824B2
公开(公告)日：2005-02-01
申请号：US10740817
申请日：2003-12-22
申请人： Kunio Arai , Kenji Suzuki
发明人： Kunio Arai , Kenji Suzuki
IPC分类号： G02B26/10 , B23K26/00 , B23K26/04 , B23K26/06 , B23K26/067 , B23K101/42 , H05K3/00 , B23K26/38
CPC分类号： B23K26/0673 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/067 , B23K26/082 , B23K26/382 , B23K2103/50 , H05K3/0026
摘要： Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fθ lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fθ lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.
摘要翻译：本发明提供一种多光束激光钻孔装置，用于在远心误差被抑制的同时位于两个位置的同时进行钻孔，其中将检流计镜用于第一激光束的常规光学系统和电流计镜系统位于靠近ftheta镜头，以防止发生远心错误。已经被第二电流计反射镜系统偏转的第二激光束透射通过偏振光束混合器并且入射到第一电流计反射镜系统和透镜上，因此在两个位置上同时钻出工件使用第一和第二激光束。

2. 发明授权

US08366903B2 Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method 有权
标题翻译：用于制造方法的印刷线路板和电解蚀刻溶液的制造方法
公开(公告)号：US08366903B2
公开(公告)日：2013-02-05
申请号：US12222995
申请日：2008-08-21
申请人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
发明人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
IPC分类号： H05K3/07
CPC分类号： H05K3/07 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K2201/0112 , H05K2203/0315 , H05K2203/0346
摘要： In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.
摘要翻译：在制造印刷电路板的方法中，通孔从多层板的表面铜层到内层铜层到达，铜层和绝缘层交替层叠。接线板由激光加工，加工通孔的工序包括在设置在多层板的表面上的铜层的表面上形成激光吸收层。对激光进行照射，依次进行激光吸收层的电解蚀刻和去除。

3. 发明申请

US20110036493A1 SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FOR PRINTED WIRING BOARD 审中-公开
标题翻译：用于印刷线路板的铜和表面处理方法的表面处理方法
公开(公告)号：US20110036493A1
公开(公告)日：2011-02-17
申请号：US12921656
申请日：2009-02-25
申请人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
发明人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
IPC分类号： B29C65/16 , C25D11/34
CPC分类号： H05K3/0038 , C25D7/0614 , C25D11/34 , H05K3/4652 , H05K2201/0112 , H05K2203/0315
摘要： The present invention provides a surface treatment method for a printed wiring board to form cupric oxide on a surface of an outer layer of copper foil of a laminated board formed by laminating copper foils to base resin layers the cupric oxide being formed to have thickness 0.6 μm to 3.0 μm by performing electrolytic anodizing in an alkaline aqueous solution containing copper oxide ions at a concentration of more than 0.001 mol/l but not more than the saturation point, under the conditions that the electrolytic solution contains sodium hydroxide or potassium hydroxide of 2 mol/l to 6 mol/l and liquid temperature is 50° C. to 90° C.
摘要翻译：本发明提供一种印刷线路板的表面处理方法，该印刷线路板在层压板的铜箔的外层的表面上形成氧化铜，所述层压板通过将铜箔层叠到形成为厚度为0.6μm的氧化铜的基础树脂层而形成通过在浓度大于0.001mol / l且不大于饱和点的含有氧化铜离子的碱性水溶液中，在电解液含有2mol的氢氧化钠或氢氧化钾的条件下进行电解阳极氧化至3.0μm / l至6mol / l，液体温度为50℃至90℃

4. 发明申请

US20080283491A1 Fabrication method of printed circuit board and printed circuit board machining apparatus 有权
标题翻译：印刷电路板和印刷电路板加工设备的制造方法
公开(公告)号：US20080283491A1
公开(公告)日：2008-11-20
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H01B13/00
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译：提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射导体图案的部分从绝缘层的表面出来。

5. 发明授权

US07205501B2 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US07205501B2
公开(公告)日：2007-04-17
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

6. 发明申请

US20050155958A1 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20050155958A1
公开(公告)日：2005-07-21
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/04 , B23K26/06 , B23K26/073 , B23K101/40 , B23K101/42 , H05K3/00 , B23K26/40
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

7. 发明授权

US6043453A Apparatus for laser processing with a mechanical cutter 失效
标题翻译：用机械切割机进行激光加工的设备
公开(公告)号：US6043453A
公开(公告)日：2000-03-28
申请号：US41005
申请日：1998-03-12
申请人： Kunio Arai
发明人： Kunio Arai
IPC分类号： B23K26/02 , B23K26/06 , B23K26/067 , B23K26/073 , B23K26/28 , H01L21/48 , B23K26/00
CPC分类号： B23K26/0738 , B23K26/037 , B23K26/066 , B23K26/067 , B23K26/28 , H01L21/4803 , H01L21/4864 , H05K2203/0228 , H05K2203/056
摘要： The apparatus is for spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a remaining part thereof, to a position just above the inner-layer conductor. The remaining part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender (elongated) shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, it is easy to control thermal influence on the portion of the circuit board to be processed by the laser beam, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.
摘要翻译：该装置用于曝光嵌入在印刷电路板的绝缘体中的内层导体的面对。点对面通过机械切割器将除了其余部分之外的整个绝缘体移除到刚好在内层导体上方的位置。绝缘体的剩余部分的厚度小于由机械切割器去除的绝缘体。然后，通过用激光束扫描该部分来去除绝缘体的剩余部分以暴露内层导体。激光束呈细长（细长）的形状，几乎垂直于激光束的扫描方向，沿着细长形状具有几乎均匀的能量密度。切割机处理足以在内层导体之前进行，并且不用担心损坏内层导体。此外，由于激光束的能量密度几乎均匀，因此易于控制由激光束处理的电路板的部分的热影响。因此，根据加工的产品产量提高。

8. 发明授权

US4872787A Method of drilling printed circuit board 失效
标题翻译：印刷电路板钻孔方法
公开(公告)号：US4872787A
公开(公告)日：1989-10-10
申请号：US106439
申请日：1987-10-09
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.
摘要翻译：在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率在通过印刷电路板钻孔时进给，以提高孔所在的精度。一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。这可以防止堆叠的印刷电路板移动并增加孔所在的精度。

9. 发明申请

US20120031147A1 Method and Apparatus for Machining Thin-Film Layer of Workpiece 审中-公开
标题翻译：加工薄膜薄膜层的方法与装置
公开(公告)号：US20120031147A1
公开(公告)日：2012-02-09
申请号：US13254155
申请日：2010-02-24
申请人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
发明人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
IPC分类号： C03B35/24 , C03B23/02
CPC分类号： B23K37/0408 , B23K26/0006 , B23K26/0853 , B23K26/146 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/16 , B23K2103/172 , B65G49/064 , B65G2249/045 , H01L21/6838 , H01L31/18
摘要： An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.
摘要翻译：作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括：工件下侧支撑机构，用于将工件沿垂直方向支撑，空气浮起机构和抽吸机构，用于夹持工件以沿着工件的垂直方向移动的夹紧装置，以及用激光束加工薄膜层的加工头。加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。进一步包括喷嘴，在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。

10. 发明授权

US07335296B2 System and device for processing supercritical and subcritical fluid 失效
标题翻译：用于处理超临界和亚临界流体的系统和装置
公开(公告)号：US07335296B2
公开(公告)日：2008-02-26
申请号：US10486907
申请日：2002-10-09
申请人： Kunio Arai , Hiroshi Inomata , Richard Lee Smith, Jr.
发明人： Kunio Arai , Hiroshi Inomata , Richard Lee Smith, Jr.
IPC分类号： B01D17/12
CPC分类号： B01J3/008 , B01J3/006 , B01J19/004 , B01J2219/00038 , B01J2219/00162 , B01J2219/00171 , Y02P20/544
摘要： A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).
摘要翻译：一种用于处理超临界和亚临界流体的系统，其能够使形成在流动通道中的至少一个处理容器（1）的内部进入超临界或亚临界高压场，其中施加热操作以处理流体以将热膨胀施加到流体以在处理容器（1）和外部之间产生压力差，从而可以在处理容器（1）中提供适合于处理超临界或亚临界流体的特定温度和高压场。

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