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1. 发明申请

US20080166856A1 Methods of Forming Recessed Access Devices Associated With Semiconductor Constructions 有权
标题翻译：形成与半导体结构相关的嵌入式接入设备的方法
公开(公告)号：US20080166856A1
公开(公告)日：2008-07-10
申请号：US12051620
申请日：2008-03-19
申请人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
发明人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
IPC分类号： H01L21/76
CPC分类号： H01L27/10876 , H01L27/10823
摘要： The invention includes methods of forming recessed access devices. A substrate is provided to have recessed access device trenches therein. A pair of the recessed access device trenches are adjacent one another. Electrically conductive material is formed within the recessed access device trenches, and source/drain regions are formed proximate the electrically conductive material. The electrically conductive material and source/drain regions together are incorporated into a pair of adjacent recessed access devices. After the recessed access device trenches are formed within the substrate, an isolation region trench is formed between the adjacent recessed access devices and filled with electrically insulative material to form a trenched isolation region.
摘要翻译：本发明包括形成凹入进入装置的方法。提供基板以在其中具有凹入的接入装置沟槽。一对凹进的接入设备沟槽彼此相邻。导电材料形成在凹进的存取装置沟槽内，源极/漏极区域靠近导电材料形成。导电材料和源极/漏极区域一起被并入一对相邻的凹进入器件中。在凹陷的访问设备沟槽形成在衬底内之后，在相邻的凹进的访问设备之间形成隔离区沟槽，并且填充有电绝缘材料以形成沟槽隔离区域。

2. 发明授权

US07384849B2 Methods of forming recessed access devices associated with semiconductor constructions 有权
标题翻译：形成与半导体结构相关联的凹陷接入设备的方法
公开(公告)号：US07384849B2
公开(公告)日：2008-06-10
申请号：US11090529
申请日：2005-03-25
申请人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
发明人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
IPC分类号： H01L21/336
CPC分类号： H01L27/10876 , H01L27/10823
摘要： The invention includes methods of forming recessed access devices. A substrate is provided to have recessed access device trenches therein. A pair of the recessed access device trenches are adjacent one another. Electrically conductive material is formed within the recessed access device trenches, and source/drain regions are formed proximate the electrically conductive material. The electrically conductive material and source/drain regions together are incorporated into a pair of adjacent recessed access devices. After the recessed access device trenches are formed within the substrate, an isolation region trench is formed between the adjacent recessed access devices and filled with electrically insulative material to form a trenched isolation region.
摘要翻译：本发明包括形成凹入进入装置的方法。提供基板以在其中具有凹入的接入装置沟槽。一对凹进的接入设备沟槽彼此相邻。导电材料形成在凹进的存取装置沟槽内，源极/漏极区域靠近导电材料形成。导电材料和源极/漏极区域一起被并入一对相邻的凹进入器件中。在凹陷的访问设备沟槽形成在衬底内之后，在相邻的凹进的访问设备之间形成隔离区沟槽，并且填充有电绝缘材料以形成沟槽隔离区域。

3. 发明申请

US20110117725A1 Methods of Forming Recessed Access Devices Associated with Semiconductor Constructions 有权
标题翻译：形成与半导体结构相关的嵌入式接入设备的方法
公开(公告)号：US20110117725A1
公开(公告)日：2011-05-19
申请号：US13012675
申请日：2011-01-24
申请人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
发明人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
IPC分类号： H01L21/76
CPC分类号： H01L27/10876 , H01L27/10823
摘要： The invention includes methods of forming recessed access devices. A substrate is provided to have recessed access device trenches therein. A pair of the recessed access device trenches are adjacent one another. Electrically conductive material is formed within the recessed access device trenches, and source/drain regions are formed proximate the electrically conductive material. The electrically conductive material and source/drain regions together are incorporated into a pair of adjacent recessed access devices. After the recessed access device trenches are formed within the substrate, an isolation region trench is formed between the adjacent recessed access devices and filled with electrically insulative material to form a trenched isolation region.
摘要翻译：本发明包括形成凹入进入装置的方法。提供基板以在其中具有凹入的接入装置沟槽。一对凹进的接入设备沟槽彼此相邻。导电材料形成在凹进的存取装置沟槽内，源极/漏极区域靠近导电材料形成。导电材料和源极/漏极区域一起被并入一对相邻的凹进入器件中。在凹陷的访问设备沟槽形成在衬底内之后，在相邻的凹进的访问设备之间形成隔离区沟槽，并且填充有电绝缘材料以形成沟槽隔离区域。

4. 发明授权

US07897460B2 Methods of forming recessed access devices associated with semiconductor constructions 有权
公开(公告)号：US07897460B2
公开(公告)日：2011-03-01
申请号：US12051620
申请日：2008-03-19
申请人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
发明人： Kunal R. Parekh , Suraj Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
IPC分类号： H01L21/336
CPC分类号： H01L27/10876 , H01L27/10823
摘要： The invention includes methods of forming recessed access devices. A substrate is provided to have recessed access device trenches therein. A pair of the recessed access device trenches are adjacent one another. Electrically conductive material is formed within the recessed access device trenches, and source/drain regions are formed proximate the electrically conductive material. The electrically conductive material and source/drain regions together are incorporated into a pair of adjacent recessed access devices. After the recessed access device trenches are formed within the substrate, an isolation region trench is formed between the adjacent recessed access devices and filled with electrically insulative material to form a trenched isolation region.

5. 发明授权

US08067286B2 Methods of forming recessed access devices associated with semiconductor constructions 有权
标题翻译：形成与半导体结构相关联的凹陷接入设备的方法
公开(公告)号：US08067286B2
公开(公告)日：2011-11-29
申请号：US13012675
申请日：2011-01-24
申请人： Kunal R. Parekh , Suraj J. Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
发明人： Kunal R. Parekh , Suraj J. Mathew , Jigish D. Trivedi , John K. Zahurak , Sanh D. Tang
IPC分类号： H01L21/336
CPC分类号： H01L27/10876 , H01L27/10823
摘要： The invention includes methods of forming recessed access devices. A substrate is provided to have recessed access device trenches therein. A pair of the recessed access device trenches are adjacent one another. Electrically conductive material is formed within the recessed access device trenches, and source/drain regions are formed proximate the electrically conductive material. The electrically conductive material and source/drain regions together are incorporated into a pair of adjacent recessed access devices. After the recessed access device trenches are formed within the substrate, an isolation region trench is formed between the adjacent recessed access devices and filled with electrically insulative material to form a trenched isolation region.
摘要翻译：本发明包括形成凹入进入装置的方法。提供基板以在其中具有凹入的接入装置沟槽。一对凹进的接入设备沟槽彼此相邻。导电材料形成在凹进的存取装置沟槽内，源极/漏极区域靠近导电材料形成。导电材料和源极/漏极区域一起被并入一对相邻的凹进入器件中。在凹陷的访问设备沟槽形成在衬底内之后，在相邻的凹进的访问设备之间形成隔离区沟槽，并且填充有电绝缘材料以形成沟槽隔离区域。

6. 发明申请

US20090273051A1 METHODS OF FORMING ISOLATED ACTIVE AREAS, TRENCHES, AND CONDUCTIVE LINES IN SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUCTURES INCLUDING THE SAME 有权
标题翻译：在半导体结构中形成分离的活性区，导电层和导电线的方法和包括它们的半导体结构
公开(公告)号：US20090273051A1
公开(公告)日：2009-11-05
申请号：US12114932
申请日：2008-05-05
申请人： Kunal R. Parekh , John K. Zahurak
发明人： Kunal R. Parekh , John K. Zahurak
IPC分类号： H01L29/00 , H01L21/76
CPC分类号： H01L29/0653 , H01L21/2815 , H01L21/3086 , H01L21/3088 , H01L27/0207 , H01L27/0886 , H01L27/108 , H01L27/10876 , H01L27/10891 , H01L29/0649 , H01L29/4236 , H01L29/66621 , H01L29/66795
摘要： Methods of pitch doubling of asymmetric features and semiconductor structures including the same are disclosed. In one embodiment, a single photolithography mask may be used to pitch double three features, for example, of a DRAM array. In one embodiment, two wordlines and a grounded gate over field may be pitch doubled. Semiconductor structures including such features are also disclosed.
摘要翻译：公开了不对称特征和包括其的半导体结构的间距倍增方法。在一个实施例中，可以使用单个光刻掩模来扩展例如DRAM阵列的三重特征。在一个实施例中，两个字线和接地栅极可以是倍频。还公开了包括这些特征的半导体结构。

7. 发明授权

US07276433B2 Methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors 有权
标题翻译：形成集成电路的方法，形成存储器电路的方法以及形成场效应晶体管的方法
公开(公告)号：US07276433B2
公开(公告)日：2007-10-02
申请号：US11003275
申请日：2004-12-03
申请人： Kunal R. Parekh , John K. Zahurak
发明人： Kunal R. Parekh , John K. Zahurak
IPC分类号： H01L21/00
CPC分类号： H01L21/823468 , H01L21/823418 , H01L21/823425 , H01L27/105 , H01L27/11526 , H01L27/11534
摘要： The invention includes methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors. In one implementation, conductive metal silicide is formed on some areas of a substrate and not on others. In one implementation, conductive metal silicide is formed on a transistor source/drain region and which is spaced from an anisotropically etched sidewall spacer proximate a gate of the transistor.
摘要翻译：本发明包括形成集成电路的方法，形成存储器电路的方法以及形成场效应晶体管的方法。在一个实施方案中，导电金属硅化物形成在衬底的一些区域上而不是其它区域上。在一个实施方案中，导电金属硅化物形成在晶体管源极/漏极区上，并且与靠近晶体管的栅极的各向异性蚀刻的侧壁间隔开。

8. 发明授权

US06864138B2 Methods of forming capacitor structures and DRAM arrays 失效
标题翻译：形成电容器结构和DRAM阵列的方法
公开(公告)号：US06864138B2
公开(公告)日：2005-03-08
申请号：US10310723
申请日：2002-12-04
申请人： Kunal R. Parekh , John K. Zahurak
发明人： Kunal R. Parekh , John K. Zahurak
IPC分类号： H01L21/02 , H01L21/768 , H01L21/8242 , H01L27/108
CPC分类号： H01L27/10888 , H01L21/76895 , H01L27/10811 , H01L27/10855 , H01L28/84 , Y10S438/964
摘要： The invention encompasses DRAM constructions, capacitor constructions, integrated circuitry, and methods of forming DRAM constructions, integrated circuitry and capacitor constructions. The invention encompasses a method of forming a capacitor wherein: a) a first layer is formed; b) a semiconductive material masking layer is formed over the first layer; c) an opening is etched through the masking layer and first layer to a node; d) a storage node layer is formed within the opening and in electrical connection with the masking layer; e) a capacitor storage node is formed from the masking layer and the storage node layer; and f) a capacitor dielectric layer and outer capacitor plate are formed operatively proximate the capacitor storage node.
摘要翻译：本发明包括DRAM结构，电容器结构，集成电路以及形成DRAM结构，集成电路和电容器结构的方法。本发明包括形成电容器的方法，其中：a）形成第一层; b）在第一层上形成半导体材料掩蔽层; c）通过掩模层和第一层将一个开口蚀刻到一个节点上; d）存储节点层形成在所述开口内并与所述掩蔽层电连接; e）从掩蔽层和存储节点层形成电容器存储节点; 以及f）在电容器存储节点处可操作地形成电容器介电层和外部电容器板。

9. 发明授权

US06825095B2 Methods of forming capacitors 失效
标题翻译：形成电容器的方法
公开(公告)号：US06825095B2
公开(公告)日：2004-11-30
申请号：US09955632
申请日：2001-09-18
申请人： Kunal R. Parekh , John K. Zahurak , Phillip G. Wald
发明人： Kunal R. Parekh , John K. Zahurak , Phillip G. Wald
IPC分类号： H01L2120
CPC分类号： H01L27/10888 , H01L27/10852 , H01L27/10855 , H01L28/82 , H01L28/84 , H01L28/90 , H01L29/94 , Y10S438/964
摘要： The invention includes a number of methods and structures pertaining to semiconductor circuit technology, including: methods of forming DRAM memory cell constructions; methods of forming capacitor constructions; DRAM memory cell constructions; capacitor constructions; and monolithic integrated circuitry. The invention includes a method of forming a capacitor comprising the following steps: a) forming a mass of silicon material over a node location, the mass comprising exposed doped silicon and exposed undoped silicon; b) substantially selectively forming rugged polysilicon from the exposed undoped silicon and not from the exposed doped silicon; and c) forming a capacitor dielectric layer and a complementary capacitor plate proximate the rugged polysilicon and doped silicon. The invention also includes a capacitor comprising: a) a first capacitor plate; b) a second capacitor plate; c) a capacitor dielectric layer intermediate the first and second capacitor plates; and d) at least one of the first and second capacitor plates comprising a surface against the capacitor dielectric layer and wherein said surface comprises both doped rugged polysilicon and doped non-rugged polysilicon.
摘要翻译：本发明包括许多与半导体电路技术有关的方法和结构，包括：形成DRAM存储单元结构的方法; 形成电容器结构的方法; DRAM存储单元结构; 电容器结构; 和单片集成电路。本发明包括一种形成电容器的方法，包括以下步骤：a）在节点位置上形成硅材料块，所述质量包括暴露的掺杂硅和暴露的未掺杂硅; b）从暴露的未掺杂的硅而不是暴露的掺杂的硅基本上选择性地形成坚固的多晶硅; 以及c）在坚固的多晶硅和掺杂硅附近形成电容器电介质层和互补的电容器板。本发明还包括一种电容器，包括：a）第一电容器板; b）第二电容器板; c）在第一和第二电容器板之间的电容器电介质层; 以及d）所述第一和第二电容器板中的至少一个包括抵抗所述电容器介电层的表面，并且其中所述表面包括掺杂的坚固的多晶硅和掺杂的非坚固的多晶硅。

10. 发明授权

US06710390B2 Capacitors and DRAM arrays 失效
标题翻译：电容器和DRAM阵列
公开(公告)号：US06710390B2
公开(公告)日：2004-03-23
申请号：US09261920
申请日：1999-03-03
申请人： Kunal R. Parekh , John K. Zahurak , Phillip G. Wald
发明人： Kunal R. Parekh , John K. Zahurak , Phillip G. Wald
IPC分类号： H01L27108
CPC分类号： H01L27/10888 , H01L27/10852 , H01L27/10855 , H01L28/82 , H01L28/84 , H01L28/90 , H01L29/94 , Y10S438/964
摘要： The invention includes a number of methods and structures pertaining to semiconductor circuit technology, including: methods of forming DRAM memory cell constructions; methods of forming capacitor constructions; DRAM memory cell constructions; capacitor constructions; and monolithic integrated circuitry. The invention includes a method of forming a capacitor comprising the following steps: a) forming a mass of silicon material over a node location, the mass comprising exposed doped silicon and exposed undoped silicon; b) substantially selectively forming rugged polysilicon from the exposed undoped silicon and not from the exposed doped silicon; and c) forming a capacitor dielectric layer and a complementary capacitor plate proximate the rugged polysilicon and doped silicon. The invention also includes a capacitor comprising: a) a first capacitor plate; b) a second capacitor plate; c) a capacitor dielectric layer intermediate the first and second capacitor plates; and d) at least one of the first and second capacitor plates comprising a surface against the capacitor dielectric layer and wherein said surface comprises both doped rugged polysilicon and doped non-rugged polysilicon.
摘要翻译：本发明包括许多与半导体电路技术有关的方法和结构，包括：形成DRAM存储单元结构的方法; 形成电容器结构的方法; DRAM存储单元结构; 电容器结构; 和单片集成电路。本发明包括一种形成电容器的方法，包括以下步骤：a）在节点位置上形成硅材料块，所述质量包括暴露的掺杂硅和暴露的未掺杂硅; b）从暴露的未掺杂的硅而不是暴露的掺杂的硅基本上选择性地形成坚固的多晶硅; 以及c）在坚固的多晶硅和掺杂硅附近形成电容器电介质层和互补的电容器板。本发明还包括一种电容器，包括：a）第一电容器板; b）第二电容器板; c）在第一和第二电容器板之间的电容器电介质层; 以及d）所述第一和第二电容器板中的至少一个包括抵抗所述电容器介电层的表面，并且其中所述表面包括掺杂的坚固的多晶硅和掺杂的非坚固的多晶硅。

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