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1. 发明申请

US20130256063A1 LUBRICATING DEVICE FOR LINEAR TRANSMISSION MECHANISM 有权
标题翻译：线性传动机构润滑装置
公开(公告)号：US20130256063A1
公开(公告)日：2013-10-03
申请号：US13435999
申请日：2012-03-30
申请人： Kuan-Chun CHEN , Wu-Teng Hsieh
发明人： Kuan-Chun CHEN , Wu-Teng Hsieh
IPC分类号： F16N11/08
CPC分类号： F16N11/08
摘要： A lubricating device used in a linear transmission mechanism is disclosed to include a housing having an accommodation chamber and an opening formed on the inside and periphery thereof in equal cross section, a pressure member axially movable in the accommodation chamber, a screw rod pivotally mounted in the housing and having a first transmission portion located on one end thereof and extended out of the pressure member, a screw nut threaded onto the screw rod and driven by the screw rod to stop against the pressure member outside, a transmission member defining therein a transmission slot and a second transmission portion and a third transmission portion at two opposite sides of the transmission slot for alternatively rotating the first transmission portion, and driving device for reciprocating the transmission member.
摘要翻译：公开了一种在线性传动机构中使用的润滑装置，包括具有容纳室和在其内部和外周形成有相等截面的开口的壳体，在容纳室中可轴向移动的压力构件，可旋转地安装在壳体并且具有位于其一端并延伸出压力构件的第一传动部分，螺纹螺母螺纹连接并由螺杆驱动以阻止压力构件外部的传动构件，传动构件限定在其中的传动槽和第二传输部分和第三传输部分，在传输槽的两个相对侧，用于可选地旋转第一传动部分，以及用于使传动部件往复运动的驱动装置。

2. 发明申请

US20070298543A1 Method for Manufacturing Heat Sink of Semiconductor Device 有权
标题翻译：半导体器件散热片制造方法
公开(公告)号：US20070298543A1
公开(公告)日：2007-12-27
申请号：US11470273
申请日：2006-09-06
申请人： Yan-Kuin SU , Kuan-Chun CHEN , Chun-Liang LIN , Jin-Quan HUANG , Shu-Kai HU
发明人： Yan-Kuin SU , Kuan-Chun CHEN , Chun-Liang LIN , Jin-Quan HUANG , Shu-Kai HU
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L33/641 , H01S5/02256 , H01S5/02272 , H01S5/024 , H01S5/02476 , H01S5/4093
摘要： A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.
摘要翻译：描述了制造半导体器件的散热器的方法。在该方法中，提供了一种粘合带，其中胶带包括第一表面和相对侧上的第二表面，并且粘合带的第一表面粘附到临时基底的表面。提供至少一个半导体器件，其中半导体器件包括与第一侧相对的第一侧和第二侧，并且一个半导体器件的第一侧被压入并设置在粘合带的第二表面的一部分中并且暴露一个半导体器件的第二面。在半导体器件的第二侧和胶带的第二表面的暴露部分上形成薄金属层。在薄金属层上形成金属散热器。然后，去除胶带和临时基板。

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