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    • 9. 发明授权
    • Electro static discharge protection device
    • 静电放电保护装置
    • US08198651B2
    • 2012-06-12
    • US12250436
    • 2008-10-13
    • Gernot LangguthWolfgang SoldnerCornelius Christian Russ
    • Gernot LangguthWolfgang SoldnerCornelius Christian Russ
    • H01L29/02
    • H01L29/7436H01L27/0262H01L27/092H01L2924/0002H01L2924/00
    • A semiconductor device for protecting against an electro static discharge is disclosed. In one embodiment, the semiconductor device includes a first low doped region disposed in a substrate, a first heavily doped region disposed within the first low doped region, the first heavily doped region comprising a first conductivity type, and the first low doped region comprising a second conductivity type, the first and the second conductivity types being opposite, the first heavily doped region being coupled to a node to be protected. The semiconductor device further includes a second heavily doped region coupled to a first power supply potential node, the second heavily doped region being separated from the first heavily doped region by a portion of the first low doped region, and a second low doped region disposed adjacent the first low doped region, the second low doped region comprising the first conductivity type. A third heavily doped region is disposed in the second low doped region, the third heavily doped region comprising the second conductivity type and being coupled to a second power supply potential node.
    • 公开了一种用于防止静电放电的半导体器件。 在一个实施例中,半导体器件包括设置在衬底中的第一低掺杂区域,设置在第一低掺杂区域内的第一重掺杂区域,第一重掺杂区域包括第一导电类型,第一低掺杂区域包括 第二导电类型,第一和第二导电类型是相反的,第一重掺杂区域耦合到待保护的节点。 所述半导体器件还包括耦合到第一电源电势节点的第二重掺杂区域,所述第二重掺杂区域由所述第一低掺杂区域的一部分与所述第一重掺杂区域分离,以及邻近设置的第二低掺杂区域 第一低掺杂区域,第二低掺杂区域包括第一导电类型。 第三重掺杂区域设置在第二低掺杂区域中,第三重掺杂区域包括第二导电类型并耦合到第二电源电位节点。
    • 10. 发明申请
    • Electro Static Discharge Protection Device
    • 静电放电保护装置
    • US20100090283A1
    • 2010-04-15
    • US12250436
    • 2008-10-13
    • Gernot LangguthWolfgang SoldnerCornelius Christian Russ
    • Gernot LangguthWolfgang SoldnerCornelius Christian Russ
    • H01L23/58H01L21/04
    • H01L29/7436H01L27/0262H01L27/092H01L2924/0002H01L2924/00
    • A semiconductor device for protecting against an electro static discharge is disclosed. In one embodiment, the semiconductor device includes a first low doped region disposed in a substrate, a first heavily doped region disposed within the first low doped region, the first heavily doped region comprising a first conductivity type, and the first low doped region comprising a second conductivity type, the first and the second conductivity types being opposite, the first heavily doped region being coupled to a node to be protected. The semiconductor device further includes a second heavily doped region coupled to a first power supply potential node, the second heavily doped region being separated from the first heavily doped region by a portion of the first low doped region, and a second low doped region disposed adjacent the first low doped region, the second low doped region comprising the first conductivity type. A third heavily doped region is disposed in the second low doped region, the third heavily doped region comprising the second conductivity type and being coupled to a second power supply potential node.
    • 公开了一种用于防止静电放电的半导体器件。 在一个实施例中,半导体器件包括设置在衬底中的第一低掺杂区域,设置在第一低掺杂区域内的第一重掺杂区域,第一重掺杂区域包括第一导电类型,第一低掺杂区域包括 第二导电类型,第一和第二导电类型是相反的,第一重掺杂区域耦合到待保护的节点。 所述半导体器件还包括耦合到第一电源电势节点的第二重掺杂区域,所述第二重掺杂区域由所述第一低掺杂区域的一部分与所述第一重掺杂区域分离,以及邻近设置的第二低掺杂区域 第一低掺杂区域,第二低掺杂区域包括第一导电类型。 第三重掺杂区域设置在第二低掺杂区域中,第三重掺杂区域包括第二导电类型并耦合到第二电源电位节点。