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    • 6. 发明授权
    • Semi-aqueous solvent cleaning of paste processing residue from substrates
    • 半水溶剂清洗膏从底物处理残留物
    • US06742530B2
    • 2004-06-01
    • US10294236
    • 2002-11-14
    • Krishna G. SachdevJames N. HumenikChon Cheong LeiGlenn A. Pomerantz
    • Krishna G. SachdevJames N. HumenikChon Cheong LeiGlenn A. Pomerantz
    • B08B308
    • H01L21/02063B23K35/025C11D7/263C11D11/0047C11D11/007C23G5/032H05K3/1233H05K3/26Y10S134/902
    • A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
    • 清洁与半导体制造工艺有关的物体的过程,例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说,该方法在半导体封装衬底的制造中,将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散,焊料柱附件和BGA(球栅阵列)附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地,通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法,从金属,陶瓷和塑料基材中清除糊状残余物。
    • 8. 发明授权
    • Semi-aqueous solvent cleaning of paste processing residue from substrates
    • 半水溶剂清洗膏从底物处理残留物
    • US06569252B1
    • 2003-05-27
    • US09609283
    • 2000-06-30
    • Krishna G. SachdevJames N. HumenikChon Cheong LeiGlenn A. Pomerantz
    • Krishna G. SachdevJames N. HumenikChon Cheong LeiGlenn A. Pomerantz
    • C23G502
    • H01L21/02063B23K35/025C11D7/263C11D11/0047C11D11/007C23G5/032H05K3/1233H05K3/26Y10S134/902
    • A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
    • 清洁与半导体制造工艺有关的物体的过程,例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说,该方法在半导体封装衬底的制造中,将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散,焊料柱附件和BGA(球栅阵列)附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地,通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法,从金属,陶瓷和塑料基材中清除糊状残余物。