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1. 发明授权

US5927193A Process for via fill 失效
标题翻译：过程填充过程
公开(公告)号：US5927193A
公开(公告)日：1999-07-27
申请号：US951704
申请日：1997-10-16
申请人： James G. Balz , Cynthia J. Calli , Jon A. Casey , David C. Long , Daniel S. Mackin , Keith C. O'Neil , Brenda L. Peterson , Glenn A. Pomerantz
发明人： James G. Balz , Cynthia J. Calli , Jon A. Casey , David C. Long , Daniel S. Mackin , Keith C. O'Neil , Brenda L. Peterson , Glenn A. Pomerantz
IPC分类号： B41M1/12 , H01L21/48 , H05K1/03 , H05K3/40
CPC分类号： B41M1/12 , H01L21/486 , H01L21/4867 , H05K3/4061 , H05K1/0306 , H05K2203/0156 , H05K2203/082
摘要： An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.
摘要翻译：提供了一种用于真空丝网印刷具有通孔和通孔和开口区域的毛坯的装置和方法，从而使装置中的真空泄漏最小化，并避免了筛板在毛坯的开放区域上的弯曲。提供了一种插入器装置，其包括至少两层，具有与毛坯和筛网的通孔开口对准的垂直通孔。插入器还包括垂直通孔，其与毛坯的开放区域和插入器的通气通道连通。多孔膜也可单独使用或与插入物结合使用以提供增强的筛选结果。

2. 发明授权

US06341417B1 Pre-patterned substrate layers for being personalized as needed 有权
标题翻译：根据需要进行个性化的预先图案化的衬底层
公开(公告)号：US06341417B1
公开(公告)日：2002-01-29
申请号：US09404510
申请日：1999-09-23
申请人： Dinesh Gupta , Lester Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Keith C. O'Neil , Brenda L. Peterson
发明人： Dinesh Gupta , Lester Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Keith C. O'Neil , Brenda L. Peterson
IPC分类号： H05K336
CPC分类号： H01L23/5382 , H01L2924/0002 , H05K1/0287 , H05K1/0298 , H05K1/0306 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.
摘要翻译：用于个性化多层衬底结构的方法和结构包括提供具有电特征并改变电特征的通用层以产生多层衬底的个性化层。

3. 发明授权

US5808268A Method for marking substrates 失效
标题翻译：标记基材的方法
公开(公告)号：US5808268A
公开(公告)日：1998-09-15
申请号：US686239
申请日：1996-07-23
申请人： James G. Balz , Mark J. LaPlante , David C. Long , Brenda L. Peterson
发明人： James G. Balz , Mark J. LaPlante , David C. Long , Brenda L. Peterson
IPC分类号： G06K1/12 , B23K26/00
CPC分类号： G06K1/126 , B41M5/24 , B41M5/26
摘要： A method for marking a surface with high-density indicia comprising the steps of providing a marking device, providing input data defining indicia to be marked on the surface wherein the indicia comprises characters and the input data further defines a font for each character of the indicia, determining pixels for each character in accordance with the font, forming raster lines in accordance with the pixels, and traversing each raster line with the marking device to mark the surface according to the pixels of the raster line. If a laser is used as the marking device, the laser may need time to recharge in between marking closely spaced pixels. Thus, the laser may pass over certain pixels while the laser is recharging. Therefore, the laser may have to make an additional pass over the raster line to mark the pixels that were skipped over while the laser was recharging.
摘要翻译：一种用于以高密度标记标记表面的方法，包括以下步骤：提供标记装置，提供定义要在表面上标记的标记的输入数据，其中标记包括字符，并且输入数据进一步限定标记的每个字符的字体根据该字体确定每个字符的像素，根据像素形成光栅线，以及用标记装置遍历每个光栅线，以根据光栅线的像素来标记表面。如果使用激光作为标记装置，激光器可能需要时间在标记紧密间隔的像素之间进行充电。因此，激光可以在激光器再充电时通过某些像素。因此，激光可能需要在光栅线上进行额外的通过，以便在激光充电时标记跳过的像素。

4. 发明授权

US06402866B1 Powdered metallic sheet method for deposition of substrate conductors 失效
标题翻译：用于沉积衬底导体的粉末金属片方法
公开(公告)号：US06402866B1
公开(公告)日：2002-06-11
申请号：US09410474
申请日：1999-09-30
申请人： Jon A. Casey , John U. Knickerbocker , David C. Long , Brenda L. Peterson
发明人： Jon A. Casey , John U. Knickerbocker , David C. Long , Brenda L. Peterson
IPC分类号： B32B3126
CPC分类号： H05K3/046 , H01L21/4867 , Y10T29/49163
摘要： A method and apparatus are provided for forming metal circuit patterns and other designs on greensheets and other substrates. The method and apparatus utilize a metal containing transfer sheet whereby selected portions of the metal containing transfer sheet are transferred to the greensheet forming the desired circuit pattern and then the transfer sheet removed. The metal containing transfer sheet may contain a release layer. Transfer methods include stamping, hot rolling, laser beam, heat, etc. and combinations thereof The transfer sheet may also have a stratified or graded vertical profile so that different conductivities or other circuit properties (transfer sheet adhesion, etc.) may be obtained in the formed pattern on the substrate.
摘要翻译：提供了一种方法和装置，用于在刮板和其它基底上形成金属电路图案和其它设计。该方法和设备利用含金属的转印片，由此将含金属转印片的选定部分转移到形成所需电路图案的毛坯上，然后移除转印片。含金属的转印片可以含有剥离层。转印方法包括冲压，热轧，激光束，热等及其组合。转印片材还可以具有分层或分级的垂直轮廓，从而可以获得不同的电导率或其它电路性质（转印片粘合等）衬底上形成的图案。

5. 发明授权

US06475555B2 Process for screening features on an electronic substrate with a low viscosity paste 有权
标题翻译：用低粘度糊剂在电子基片上筛选特征的方法
公开(公告)号：US06475555B2
公开(公告)日：2002-11-05
申请号：US09429256
申请日：1999-10-29
申请人： Jon A. Casey , Dinesh Gupta , Lester Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Brenda L. Peterson , Robert A. Rita
发明人： Jon A. Casey , Dinesh Gupta , Lester Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Brenda L. Peterson , Robert A. Rita
IPC分类号： B05D132
CPC分类号： H05K3/1233 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/227 , H05K2201/0116 , H05K2203/0783 , H01L2924/00
摘要： A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.
摘要翻译：一种方法，其中将低粘度的含金属浆料筛选到陶瓷毛坯上，然后设置以增加其粘度。在一种方法中，低粘度是由过量的溶剂引起的，然后将其印迹或以其它方式除去，使得糊料的粘度增加。在另一种方法中，低粘度糊剂含有交联剂，其使糊剂在筛选后增加其粘度。

6. 发明授权

US08089133B2 Optical assemblies for transmitting and manipulating optical beams 有权
标题翻译：用于传输和操纵光束的光学组件
公开(公告)号：US08089133B2
公开(公告)日：2012-01-03
申请号：US10993305
申请日：2004-11-19
申请人： Dinesh Gupta , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
发明人： Dinesh Gupta , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
IPC分类号： H01L31/0232
CPC分类号： G02B6/3522 , G02B6/2817 , G02B6/3544 , G02B6/3574 , G02B6/3598 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4269 , G02B6/4281 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.
摘要翻译：提供用于引导光束的光学立方体和光学立方体组件。光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。光学立方体可以包括用于引导光束的双向或多方向光束引导元件。光学立方体组件可以包括附接到光学立方体的柔性芯片组件。芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

7. 发明授权

US06961995B2 Method of making an electronic package 失效
公开(公告)号：US06961995B2
公开(公告)日：2005-11-08
申请号：US10251072
申请日：2002-09-19
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L21/44 , H01L21/48 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/40 , H05K3/46 , H01K3/10 , B44C1/22 , C03C15/00 , H05K7/12 , C23E1/00
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/113 , H05K3/3436 , H05K3/3457 , H05K3/4053 , H05K3/4069 , H05K3/4605 , H05K3/4644 , H05K3/4688 , H05K2201/0133 , H05K2201/015 , H05K2201/09436 , H05K2201/09509 , H05K2201/10734 , H05K2203/061 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

8. 发明授权

US06458623B1 Conductive adhesive interconnection with insulating polymer carrier 有权
标题翻译：与绝缘聚合物载体的导电胶粘剂互连
公开(公告)号：US06458623B1
公开(公告)日：2002-10-01
申请号：US09765030
申请日：2001-01-17
申请人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
发明人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/30107 , H05K3/321 , H05K3/3436 , H05K2201/09472 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.
摘要翻译：提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地将固体导电材料附着到导电粘合剂上。然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构。

9. 发明授权

US07278207B2 Method of making an electronic package 失效
公开(公告)号：US07278207B2
公开(公告)日：2007-10-09
申请号：US11182167
申请日：2005-07-15
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01K3/10 , H01R12/04 , H01L21/00
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/113 , H05K3/3436 , H05K3/3457 , H05K3/4053 , H05K3/4069 , H05K3/4605 , H05K3/4644 , H05K3/4688 , H05K2201/0133 , H05K2201/015 , H05K2201/09436 , H05K2201/09509 , H05K2201/10734 , H05K2203/061 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

10. 发明授权

US06486415B2 Compliant layer for encapsulated columns 有权
标题翻译：封装柱的合规层
公开(公告)号：US06486415B2
公开(公告)日：2002-11-26
申请号：US09761124
申请日：2001-01-16
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01P1204
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/113 , H05K3/3436 , H05K3/3457 , H05K3/4053 , H05K3/4069 , H05K3/4605 , H05K3/4644 , H05K3/4688 , H05K2201/0133 , H05K2201/015 , H05K2201/09436 , H05K2201/09509 , H05K2201/10734 , H05K2203/061 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.
摘要翻译：提供电子封装和制造电子封装的方法。电介质材料层位于包括多个导电触点的衬底的第一表面上。至少一个通孔形成在电介质材料层中，与多个导电触点中的至少一个对准。导电材料位于基本上填充通孔的至少一个通孔中。至少一个导电构件定位在通孔中的导电材料上并与导电材料电接触。该电子封装提高了组件的现场使用寿命，该组件包括附接到衬底的第二表面的半导体芯片和附着到导电构件的印刷线路板。

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