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1. 发明授权

US5584746A Method of polishing semiconductor wafers and apparatus therefor 失效
标题翻译：研磨半导体晶片的方法及其设备
公开(公告)号：US5584746A
公开(公告)日：1996-12-17
申请号：US283152
申请日：1994-08-03
申请人： Kouichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
发明人： Kouichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
IPC分类号： B24B37/30 , B24B1/00 , B24B29/00
CPC分类号： B24B37/30
摘要： A method of polishing semiconductor wafers and apparatus therefore are described. According to the present invention, a semiconductor wafer mounted on the lower side of a wafer mounting plate may be polished on a polishing pad by the front referenced polishing technique due to a flexibility of the wafer mounting plate to make the same to conform in detail with the backside contour of the wafer under polishing pressure and a selected flexibility differential between a wafer holding region and the outer moving region of the wafer mounting plate. An apparatus includes the wafer mounting plate that also works as a vacuum chuck plate is constructed out of a flexible thin disc of hard plastics, a central round region is used for a wafer holding region facing the backside of the wafer and the outside annular region is more flexible to work as a moving region, a pan-shaped rubber sheet is secured to a ring projection, the wafer mounting disc is adhered to the inner periphery of the rubber sheet at and along the periphery thereof to generate a sealed space, passes for vacuum communication and for a compressed air supply are formed through a rotary shaft, and vacuum chuck holes are communicated with the vacuum pass and the compressed air pass is in communication with a sealed space in the wafer holder.
摘要翻译：因此，对半导体晶片及其装置进行研磨的方法进行了说明。根据本发明，安装在晶片安装板的下侧的半导体晶片可以通过前置抛光技术在抛光垫上抛光，这是由于晶片安装板的灵活性使其与抛光压力下的晶片的背面轮廓和晶片保持区域与晶片安装板的外部移动区域之间的选定的柔性差异。一种装置，包括晶片安装板，其作为真空吸盘板，由硬塑料的柔性薄盘构成，中心圆形区域用于面向晶片背面的晶片保持区域，外部环形区域为更灵活地作为移动区域工作，将盘形橡胶片固定到环形突起，晶片安装盘在其周围并沿其周边粘附到橡胶片的内周，以产生密封空间，通过通过旋转轴形成真空连通和压缩空气供给，并且真空吸盘孔与真空通道连通，压缩空气通道与晶片保持器中的密封空间连通。

2. 发明授权

US5564965A Polishing member and wafer polishing apparatus 失效
标题翻译：抛光件和晶圆抛光装置
公开(公告)号：US5564965A
公开(公告)日：1996-10-15
申请号：US355212
申请日：1994-12-09
申请人： Kouichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
发明人： Kouichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
IPC分类号： B24B37/22 , B24D13/14 , B24B5/00
CPC分类号： B24B37/22
摘要： A polishing apparatus is provided which can effect surface-based polishing of a wafer without causing the wafer to produce an undulation or peripheral protrusion. A sheetlike polishing member 5 constructed by superposing a foam sheet 2 containing minute closed cells in a web of chloroprene rubber and a velour type non-woven fabric (polishing cloth 3) is attached fast to the surface of a polishing table 1. The polishing member is capable of polishing a given wafer while maintaining the uniformity of thickness of the wafer or an oxide film formed on the surface of the wafer because, during the application of pressure by a pressing member 14, the polishing pressure is uniformly distributed throughout the entire rear surface of the wafer and the polishing member is bent in conformity with the global rises and falls in the wafer surface.
摘要翻译：提供一种抛光装置，其可以实现晶片的基于表面的抛光，而不会导致晶片产生起伏或周边突起。通过将包含微小闭孔的发泡片2叠加在氯丁橡胶和丝绒型无纺布（抛光布3）的网中而构成的片状抛光构件5快速地附着在抛光台1的表面上。抛光构件能够在保持晶片的厚度均匀性或形成在晶片表面上的氧化物膜的同时抛光给定晶片，因为在通过按压部件14施加压力期间，抛光压力均匀地分布在整个后部晶片的表面和抛光构件与晶片表面的全局上升和下降一致地弯曲。

3. 发明授权

US5718620A Polishing machine and method of dissipating heat therefrom 失效
公开(公告)号：US5718620A
公开(公告)日：1998-02-17
申请号：US346200
申请日：1994-11-22
申请人： Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
发明人： Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
IPC分类号： B24B37/015 , B24B37/04 , B24B37/12 , B24B37/16 , B24B49/14 , B24B55/02 , B24B19/22
CPC分类号： B24B37/16 , B24B37/015 , B24B37/12 , B24B55/02
摘要： A polishing machine for polishing a flat workpiece such as a semiconductor wafer has a rotatable reference table supporting an abrasive cloth disposed on a surface thereof, and a rotatable workpiece holder for holding a flat workpiece against the abrasive cloth. While the flat workpiece is being polished by the abrasive cloth, an abrasive compound is supplied between the abrasive cloth and the flat workpiece. The reference table has grooves defined therein for dissipating heat from the reference table and the abrasive cloth while the flat workpiece is being polished by the abrasive cloth. The grooves may be supplied with either the abrasive compound or a coolant.

4. 发明授权

US5335457A Method of chucking semiconductor wafers 失效
标题翻译：夹紧半导体晶片的方法
公开(公告)号：US5335457A
公开(公告)日：1994-08-09
申请号：US966484
申请日：1992-10-26
申请人： Akira Matsuda , Shigeki Shudo , Noboru Shimamoto , Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
发明人： Akira Matsuda , Shigeki Shudo , Noboru Shimamoto , Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304 , H01L21/683 , B24B7/22
CPC分类号： H01L21/6838
摘要： A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.
摘要翻译：一种夹持半导体晶片的方法，其中在具有用于真空吸附的精细通孔的硬质基板的表面上形成具有高平坦度的硅氧烷弹性层。在硅弹性层中的下一个细小的通孔中，每个通孔与硬质基底的细通孔相通。接下来，半导体晶片通过从基板的背面真空夹持而保持在硬质基板上，以便仅在晶片抛光期间通过硅树脂弹性层的表面粘合将半导体晶片牢固地保持在基板上。该方法不需要在抛光过程中将半导体晶片保持在硬表面上的蜡或类似的粘合剂，并且可以实现用于半导体晶片的高精度和高质量的表面抛光工艺。

5. 发明授权

US5400547A Polishing machine and method of dissipating heat therefrom 失效
标题翻译：抛光机及其散热方法
公开(公告)号：US5400547A
公开(公告)日：1995-03-28
申请号：US22478
申请日：1993-02-25
申请人： Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
发明人： Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
IPC分类号： B24B37/015 , B24B37/04 , B24B37/12 , B24B37/16 , B24B49/14 , B24B55/02 , B24B7/22
CPC分类号： B24B37/16 , B24B37/015 , B24B37/12 , B24B55/02
摘要： A polishing machine for polishing a flat workpiece such as a semiconductor wafer has a rotatable reference table supporting an abrasive cloth disposed on a surface thereof, and a rotatable workpiece holder for holding a flat workpiece against the abrasive cloth. While the flat workpiece is being polished by the abrasive cloth, an abrasive compound is supplied between the abrasive cloth and the flat workpiece. The reference table has grooves defined therein for dissipating heat from the reference table and the abrasive cloth while the flat workpiece is being polished by the abrasive cloth. The grooves may be supplied with either the abrasive compound or a coolant.
摘要翻译：用于抛光诸如半导体晶片的平坦工件的抛光机具有支撑布置在其表面上的研磨布的可旋转参考台和用于将平坦工件保持在研磨布上的可旋转工件保持器。当平面工件被研磨布抛光时，研磨剂在磨料与平面工件之间供应。参考台具有限定在其中的凹槽，用于在通过研磨布抛光平坦工件时从参考台和研磨布散发热量。凹槽可以被供给研磨剂或冷却剂。

6. 发明授权

US06386957B1 Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus 失效
标题翻译：用于抛光的工件支架，其制造方法，抛光工件的方法和抛光装置
公开(公告)号：US06386957B1
公开(公告)日：2002-05-14
申请号：US09581707
申请日：2000-06-16
申请人： Hisashi Masumura , Kouichi Tanaka , Fumio Suzuki , Kouzi Morita , Kouichi Okamura , Naotaka Toyama
发明人： Hisashi Masumura , Kouichi Tanaka , Fumio Suzuki , Kouzi Morita , Kouichi Okamura , Naotaka Toyama
IPC分类号： B24B100
CPC分类号： B24B37/30 , B05D1/32 , B05D3/042 , B24B7/00 , B25B11/005 , H01L21/6838
摘要： By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.
摘要翻译：通过改善通过真空吸附保持工件的用于抛光的工件保持器的工件保持体的材料和用于涂覆保持件的工件保持表面的树脂膜的材料，并且开发用树脂涂覆表面的方法，在树脂涂布过程中不会使树脂堵塞保持体的穿孔，提供了具有高精度的工件保持面的研磨用工件保持架及其制造方法。根据本发明，提供了一种用于抛光的工件保持器，其具有设置有多个用于通过真空吸附保持工件的多孔的工件保持器本体，其中，保持器主体的保持表面涂覆有涂覆膜，将热固性树脂固化在保持表面上并加热固化，并且对该涂膜的表面进行抛光及其制造方法。

7. 发明授权

US5525607A Xanthine compounds 失效
标题翻译：黄嘌呤化合物
公开(公告)号：US5525607A
公开(公告)日：1996-06-11
申请号：US63684
申请日：1993-05-20
申请人： Fumio Suzuki , Junichi Shimada , Akio Ishii , Tetsuji Ohno , Akira Karasawa , Kazuhiro Kubo , Hiromi Nonaka , Fumio Suzuki , Junichi Shimada , Akio Ishii , Tetsuji Ohno , Akira Karasawa , Kazuhiro Kubo , Hiromi Nonaka
发明人： Fumio Suzuki , Junichi Shimada , Akio Ishii , Tetsuji Ohno , Akira Karasawa , Kazuhiro Kubo , Hiromi Nonaka , Fumio Suzuki , Junichi Shimada , Akio Ishii , Tetsuji Ohno , Akira Karasawa , Kazuhiro Kubo , Hiromi Nonaka
IPC分类号： C07D473/06 , C07D473/08 , C07D473/20 , C07D473/22 , A61K31/52 , C07D473/00
CPC分类号： C07D473/06 , C07D473/08 , C07D473/20 , C07D473/22
摘要： Novel xanthine compounds represented by the following formula: ##STR1## wherein each of R.sup.1, R.sup.2 and R.sup.3 independently represents hydrogen or lower alkyl;each of X.sup.1 and X.sup.2 independently represents oxygen or sulfur; and Q represents: ##STR2## The compounds are useful as a diuretic, a renal-protecting agent and bronchodilator.
摘要翻译：由下式表示的新型黄嘌呤化合物：其中R 1，R 2和R 3各自独立地表示氢或低级烷基; X1和X2各自独立地表示氧或硫; Q表示：该化合物可用作利尿剂，肾保护剂和支气管扩张剂。

8. 发明授权

US08310753B2 Confocal scanning microscope 有权
标题翻译：共焦扫描显微镜
公开(公告)号：US08310753B2
公开(公告)日：2012-11-13
申请号：US12632007
申请日：2009-12-07
申请人： Fumio Suzuki , Naoshi Aikawa , Kotaro Yamaguchi
发明人： Fumio Suzuki , Naoshi Aikawa , Kotaro Yamaguchi
IPC分类号： G02B21/00 , G02B27/14
CPC分类号： G02B21/0036 , G02B21/0072 , G02B21/0076 , G02B26/105 , G02B27/0031
摘要： A confocal scanning microscope including: an objective system (second objective lens 23 and objective lens 24) illuminating a sample SA with illumination light; a scanning mechanism 31 scanning the sample SA to obtain an intensity signal; and a scanning optical system 32 provided between the scanning mechanism and the objective system. The scanning optical system composed of, in order from the scanning mechanism side, a first positive lens group G1, a second negative lens group G2, and a third positive lens group G3. The third lens group has two chromatic aberration correction portions each formed by a positive lens and a negative lens or negative lens and positive lens. Glass materials are selected such that one performs chromatization and the other performs achromatization, thereby providing a confocal scanning microscope capable of correcting lateral chromatic aberration generated in the objective system in the specific wavelength region by the scanning optical system.
摘要翻译：一种共焦扫描显微镜，包括：用照明光照射样品SA的物镜系统（第二物镜23和物镜24）扫描机构31扫描样本SA以获得强度信号; 以及设置在扫描机构和物镜系统之间的扫描光学系统32。扫描光学系统按照扫描机构侧的顺序由第一正透镜组G1，第二负透镜组G2和第三正透镜组G3构成。第三透镜组具有由正透镜和负透镜或负透镜和正透镜形成的两个色像差校正部。选择玻璃材料，使得一个进行着色，另一个进行消色化，从而提供能够通过扫描光学系统校正在特定波长区域中的物镜系统中产生的横向色差的共焦扫描显微镜。

9. 发明申请

US20110182371A1 RADIO COMMUNICATION SYSTEM, RECEIVER, AND TRANSMITTER 有权
标题翻译：无线电通信系统，接收机和发射机
公开(公告)号：US20110182371A1
公开(公告)日：2011-07-28
申请号：US12737629
申请日：2009-07-30
申请人： Fumio Suzuki , Shoji Hatano , Noritoshi Hino , Masahito Taneda , Yoshimisa Kimura , Koichi Moriya
发明人： Fumio Suzuki , Shoji Hatano , Noritoshi Hino , Masahito Taneda , Yoshimisa Kimura , Koichi Moriya
IPC分类号： H04L27/00
CPC分类号： H04W56/00 , H04L7/10 , H04W52/0229 , Y02D70/00
摘要： Provided are a radio communication system, a receiver, and a transmitter, which are capable of reducing an operation time period of a reception circuit of the receiver and achieving reduction in power consumption even if there is a clock error between the transmitter and the receiver. In a case of a conventional method illustrated in FIG. 1(A), the receiver is operated earlier by a time period (Tm), to thereby achieve synchronization before the clock error of the receiver exceeds the time period (Tm). This requires an extended reception time period for achieving clock synchronization, which therefore prevents the receiver from reducing its power consumption. In view of this, according to the present invention, as illustrated in FIG. 1(B), a synchronization signal is continuously transmitted from the transmitter a plurality of times in a short period of time, and the receiver receives only one of the continuously-transmitted synchronization signals. With this, the receiver can achieve synchronization of a reference clock by starting a reception operation earlier only by a time period (Tm′) (Tm′≦Tm).
摘要翻译：提供一种无线电通信系统，接收机和发射机，其能够减少接收机的接收电路的操作时间段，并且即使在发射机和接收机之间存在时钟误差也能实现功率消耗的降低。在图1所示的常规方法的情况下，如图1（A）所示，接收机较早地运行时间（Tm），从而在接收机的时钟误差超过时间段（Tm）之前实现同步。这需要用于实现时钟同步的扩展接收时间段，从而防止接收机降低其功耗。鉴于此，根据本发明，如图1所示，如图1（B）所示，在短时间内多次从发送器连续发送同步信号，接收机仅接收连续发送的同步信号之一。由此，接收器可以通过仅通过时间段（Tm'）（Tm'＆nlE; Tm）开始接收操作来实现参考时钟的同步。

10. 发明申请

US20100176411A1 FLUORESCENT-LAMP-TYPE LED LIGHTING DEVICE 审中-公开
标题翻译：荧光灯型LED灯具
公开(公告)号：US20100176411A1
公开(公告)日：2010-07-15
申请号：US12667023
申请日：2007-07-09
申请人： Fumio Suzuki
发明人： Fumio Suzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/382 , F21K9/00 , F21K9/20 , F21Y2103/10 , F21Y2115/10 , G02B6/0055 , G02B6/0073 , H01L33/20 , H01L33/508
摘要： To provide a fluorescent-lamp-type LED lighting device that has a large amount of light intensity and that can replace a highly efficient existing lighting device, the fluorescent-lamp-type LED lighting device comprises an LED (3) comprising a thin plate-like semiconductor element body (31) that transmits light generated in a PN junction area (34) in the thickness direction and that emits the light from its surface, a surface electrode (32) arranged to cover the surface of the element body (31) and a plurality of cylindrical dielectric antennas (36) that penetrate the surface electrode (32) in its thickness direction and that condense the light transmitted through the inside of the semiconductor element body (31) and emit the light outside, and a lengthy exterior casing (2) made of resin having translucency. The LED (3) is arranged at both end parts of the exterior casing (2) or along its longitudinal direction. The light emitted from the LED (3) is irradiated outside through the exterior casing (2).
摘要翻译：为了提供具有大量光强度并且可以代替现有照明装置的荧光灯型LED照明装置，荧光灯型LED照明装置包括LED（3），LED（3）所述半导体元件体（31）在所述厚度方向上透过在PN结区域（34）中产生的光并从其表面发射光;布置成覆盖所述元件体（31）的表面的表面电极（32）以及多个在其厚度方向上穿透所述表面电极（32）的圆柱形介质天线（36），并且将透过所述半导体元件体（31）内部的光聚光并将所述光发射到外部，以及将长的外壳（2）由具有半透明度的树脂制成。 LED（3）设置在外壳（2）的两端部或其纵向方向。从LED（3）发出的光通过外壳（2）照射到外部。

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