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1. 发明授权

US06558233B1 Wafer polishing method, wafer cleaning method and wafer protective film 失效
标题翻译：晶圆抛光法，晶圆清洗法及晶圆保护膜
公开(公告)号：US06558233B1
公开(公告)日：2003-05-06
申请号：US09719564
申请日：2000-12-28
申请人： Takashi Matsuoka , Naotaka Toyama , Hideki Munakata , Hisashi Masumura
发明人： Takashi Matsuoka , Naotaka Toyama , Hideki Munakata , Hisashi Masumura
IPC分类号： B24B100
CPC分类号： H01L21/02052 , H01L21/02024
摘要： Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.
摘要翻译：提供一种晶片抛光方法，其中在单面抛光中，用保护膜覆盖晶片保持表面（一个侧表面），抛光晶片抛光表面（另一侧表面），使得晶片保持表面可以防止被抛光剂蚀刻和污染; 可以有效地除去在抛光后保留在晶片保持面上的保护膜的晶片清洗方法，并且容易地处理废物清洁溶液; 以及晶片保护膜，其在抛光中充分地覆盖晶片保持表面，但在清洁中被有效地去除。在晶片抛光方法中，晶片的一个侧表面的晶片保持表面和其另一侧表面的晶片抛光表面被抛光抛光剂，抛光晶片抛光表面，同时覆盖晶片保持表面具有对抛光剂的耐蚀刻性的合成树脂保护膜，对晶片的良好粘合性和抛光后容易从晶片剥离的性质。

2. 发明授权

US06422922B1 Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece 失效
标题翻译：用于抛光的工件架，抛光工件的设备和抛光工件的方法
公开(公告)号：US06422922B1
公开(公告)日：2002-07-23
申请号：US09647505
申请日：2000-09-29
申请人： Kouichi Okamura , Fumio Suzuki , Hisashi Masumura , Kouzi Morita , Naotaka Toyama
发明人： Kouichi Okamura , Fumio Suzuki , Hisashi Masumura , Kouzi Morita , Naotaka Toyama
IPC分类号： B24B100
CPC分类号： B24B37/30
摘要： A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.
摘要翻译：一种用于抛光的工件保持器，包括：工件保持器主体，其具有用于通过真空吸附保持工件的多个穿孔;以及保持器背板，其与保持器主体的背面紧密接触并具有用于真空的凹槽，其中，背板由合成树脂构成，具有70以上且低于98的Asker C硬度，以及用于研磨工件的装置以及利用该工件抛光工件的方法。通过改善用于通过真空抽吸保持工件的用于抛光的工件保持器的保持器背板的材料，以增强与保持体的密封性，从而显影不应该将保持器主体的变形转移到工件表面的保持器背板，即使抛光剂浆料被引入和固化，也可提供具有高精度的工件保持表面的抛光用工件保持器，用于研磨工件的设备和抛光工件的方法。

3. 发明授权

US08287331B2 Method for manufacturing polishing pad, and method for polishing wafer 有权
标题翻译：抛光垫的制造方法以及抛光晶片的方法
公开(公告)号：US08287331B2
公开(公告)日：2012-10-16
申请号：US12078525
申请日：2008-04-01
申请人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
发明人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24D18/00 , B24B37/20 , Y10T428/24992
摘要： There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.
摘要翻译：公开了一种用于制造由聚氨酯泡沫垫形成的抛光垫的方法，该抛光垫安装在转台上以抛光晶片，所述方法至少包括以下步骤：切割聚氨酯泡沫块以提供聚氨酯泡沫垫; 对该聚氨酯泡沫垫进行冲压加工，压力为15000g / cm 2以上，通过该方法制造的研磨垫，以及使用该抛光垫对晶片进行研磨的方法。可以提供一种能够稳定地获得具有高平坦度等的晶片的抛光垫的制造方法。

4. 发明授权

US06386957B1 Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus 失效
标题翻译：用于抛光的工件支架，其制造方法，抛光工件的方法和抛光装置
公开(公告)号：US06386957B1
公开(公告)日：2002-05-14
申请号：US09581707
申请日：2000-06-16
申请人： Hisashi Masumura , Kouichi Tanaka , Fumio Suzuki , Kouzi Morita , Kouichi Okamura , Naotaka Toyama
发明人： Hisashi Masumura , Kouichi Tanaka , Fumio Suzuki , Kouzi Morita , Kouichi Okamura , Naotaka Toyama
IPC分类号： B24B100
CPC分类号： B24B37/30 , B05D1/32 , B05D3/042 , B24B7/00 , B25B11/005 , H01L21/6838
摘要： By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.
摘要翻译：通过改善通过真空吸附保持工件的用于抛光的工件保持器的工件保持体的材料和用于涂覆保持件的工件保持表面的树脂膜的材料，并且开发用树脂涂覆表面的方法，在树脂涂布过程中不会使树脂堵塞保持体的穿孔，提供了具有高精度的工件保持面的研磨用工件保持架及其制造方法。根据本发明，提供了一种用于抛光的工件保持器，其具有设置有多个用于通过真空吸附保持工件的多孔的工件保持器本体，其中，保持器主体的保持表面涂覆有涂覆膜，将热固性树脂固化在保持表面上并加热固化，并且对该涂膜的表面进行抛光及其制造方法。

5. 发明申请

US20080248728A1 Method for manufacturing polishing pad, polishing pad, and method for polishing wafer 有权
标题翻译：制造抛光垫的方法，抛光垫和抛光晶片的方法
公开(公告)号：US20080248728A1
公开(公告)日：2008-10-09
申请号：US12078525
申请日：2008-04-01
申请人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
发明人： Koichi Kanaya , Masayoshi Sekizawa , Naotaka Toyama
IPC分类号： B24D11/00 , B24D18/00 , B24B1/00
CPC分类号： B24D18/00 , B24B37/20 , Y10T428/24992
摘要： There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.
摘要翻译：公开了一种用于制造由聚氨酯泡沫垫形成的抛光垫的方法，该抛光垫安装在转台上以抛光晶片，所述方法至少包括以下步骤：切割聚氨酯泡沫块以提供聚氨酯泡沫垫; 对该聚氨酯泡沫垫进行压力加工，压力为15000g / cm 2以上，通过该方法制造的研磨垫，以及使用该抛光垫来研磨晶片的方法。可以提供一种能够稳定地获得具有高平坦度等的晶片的抛光垫的制造方法。

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