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1. 发明授权

US5826778A Clamping mechanism for a bonding apparatus 失效
标题翻译：粘合装置的夹紧机构
公开(公告)号：US5826778A
公开(公告)日：1998-10-27
申请号：US754978
申请日：1996-11-22
申请人： Koji Sato , Junichi Ide , Yukitaka Sonoda
发明人： Koji Sato , Junichi Ide , Yukitaka Sonoda
IPC分类号： H01L21/60 , H01L21/603
CPC分类号： H01L24/86 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082
摘要： A bonding apparatus provided with a clamping device for holding a workpiece such as a tab tape, comprising an upper clamper and a lower clamper which are respectively divided into two sections. The upper and lower clampers are respectively mounted on an upper clamper holding plate and a lower clamper holding plate so that the gaps between facing surfaces of the respective sections of the clampers can be adjusted.
摘要翻译：一种粘合装置，其具有夹持装置，该夹持装置用于保持诸如片状带的工件，包括分别分为两部分的上部夹持器和下部夹持器。上下夹具分别安装在上夹持器保持板和下夹持器保持板上，使得可以调节夹具的各个部分的相对表面之间的间隙。

2. 发明授权

US5306139A Suction adhesion-type holder 失效
标题翻译：吸附粘合型支架
公开(公告)号：US5306139A
公开(公告)日：1994-04-26
申请号：US792708
申请日：1991-11-15
申请人： Kanji Ozawa , Yukitaka Sonoda
发明人： Kanji Ozawa , Yukitaka Sonoda
IPC分类号： C30B25/12 , C30B31/14 , F27D5/00 , H01L21/52 , H01L21/60 , H01L21/683
CPC分类号： H01L21/6838 , C30B25/12 , C30B31/14 , F27D5/00 , H01L2224/851 , Y10S165/90
摘要： A suction adhesion-type holder used, for example, in a bonding machine including an air cooling device provided between a bonding stage and a vacuum pump that creates a vacuum suction in the bonding stage through the cooling device. Air suction holes formed in the bonding stage, that has a heating element, are connected to the air cooling device via a pipe and air heated by the bonding stage is cooled in the air cooling device when the heated air flows in a spiral pipe installed inside the cooling device and then sucked into the vacuum pump. The spiral pipe is cooled by a fan.
摘要翻译：一种吸附粘合型保持器，例如在包括设置在接合台和真空泵之间的空气冷却装置的接合机中使用，其通过冷却装置在接合台中产生真空吸力。在具有加热元件的接合台上形成的空气吸入孔通过管道连接到空气冷却装置，并且当加热的空气在安装在内部的螺旋管中流动时，在结合台加热的空气在空气冷却装置中被冷却冷却装置然后吸入真空泵。螺旋管由风扇冷却。

3. 发明授权

US5225026A Bonding method and apparatus therefor 失效
标题翻译：接合方法及其装置
公开(公告)号：US5225026A
公开(公告)日：1993-07-06
申请号：US801443
申请日：1991-12-02
申请人： Kanji Ozawa , Yukitaka Sonoda
发明人： Kanji Ozawa , Yukitaka Sonoda
IPC分类号： G01B11/24 , G01B11/27 , H01L21/52 , H01L21/60 , H01L21/68 , H05K13/04
CPC分类号： G01B11/272 , H01L21/682 , H05K13/0413 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091
摘要： Two parts to be bonded together, such as a circuit board and a chip, are brought into one-above-the-other relationship, and before bonding is performed, a detecting device with an upper opening and a lower opening is set between the two parts, and by the use of optical system that is lights which passes through the openings, a positional alignment between the two parts is performed by correcting any discrepancy between the two so that the two parts are properly set one on the other and accurate bonding is executed to the two parts.
摘要翻译：要结合在一起的两个部分，例如电路板和芯片，彼此具有一个关系，并且在接合之前，将具有上部开口和下部开口的检测装置设置在两个部件，并且通过使用通过开口的光的光学系统，通过校正两者之间的任何差异来执行两部分之间的位置对准，使得两个部分彼此适当地设置，并且精确的结合是执行到两部分。

4. 发明授权

US5190205A Bonding head assembly 失效
标题翻译：粘接头总成
公开(公告)号：US5190205A
公开(公告)日：1993-03-02
申请号：US785494
申请日：1991-10-31
申请人： Kanji Ozawa , Yukitaka Sonoda
发明人： Kanji Ozawa , Yukitaka Sonoda
IPC分类号： H01L21/60 , B23K20/02
CPC分类号： B23K20/021
摘要： A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.
摘要翻译：一种焊接头组件，包括在其下表面上形成的凹面上具有真空抽吸孔或电磁体的保持块，松动地穿过保持块的中心孔并且在下端具有接合工具的中心轴，摆动球连接到中心轴的上部。在接合工具与工件接触之后，真空抽吸或电磁体被激活，使得摆动球与保持块的凹面紧密接触，从而将摆动球牢固地保持在保持块中，并且因此，设置中心轴的位置并因此设定接合工具。

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