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1. 发明授权

US06412187B1 Analog quantity display method, analog quantity measuring method, and digital/analog display type measuring instrument 有权
标题翻译：模拟量显示方法，模拟量测量方法以及数字/模拟显示型测量仪
公开(公告)号：US06412187B1
公开(公告)日：2002-07-02
申请号：US09480998
申请日：2000-01-11
申请人： Koji Sasaki , Yoshitaka Kuji , Yuichi Ichikawa , Mikio Suzuki , Norihide Tsuyuki , Hiroyuki Ohta
发明人： Koji Sasaki , Yoshitaka Kuji , Yuichi Ichikawa , Mikio Suzuki , Norihide Tsuyuki , Hiroyuki Ohta
IPC分类号： G01B322
CPC分类号： G01B3/004 , G01D7/002
摘要： The present invention provides an analog quantity display method of counting displacement of a probe disposed in contact with an object to be measured and analog-displaying the obtained count value by an analog display section as an analog quantity. If a peak value of the count value exceeds a possible analog-display range of the analog display section, an offset provided for the analog-displayed count value is updated in such a manner that the peak value is displayed within the possible analog-display range. Further, an analog quantity measuring method is provided, which comprises counting displacement of the probe, compares the obtained count value with a peak value of the count value, holds the count value as a new peak value depending upon a result of the comparison, and executes the comparison and the holding of the peak value again if the difference between the present peak value and the present count value exceeds a predetermined value. The analog quantity display and measuring methods are applicable to a digital/analog display type measuring instrument comprising a counter for counting the displacement of the probe in contact with the measured object, a digital display section for digitally displaying the count value, and an analog display section located adjacent to the digital display section, for displaying the count value as the bar graph comprising the large number of analog bars arranged in juxtaposition in one direction.
摘要翻译：本发明提供了一种模拟量显示方法，用于计数与待测物体接触的探针的位移，并以模拟量模拟显示所获得的计数值。如果计数值的峰值超过模拟显示部分的可能的模拟显示范围，则为模拟显示的计数值提供的偏移被更新，使得峰值显示在可能的模拟显示范围内。此外，提供了一种模拟量测量方法，其包括计数探头的位移，将获得的计数值与计数值的峰值进行比较，根据比较结果将计数值保持为新的峰值，以及如果当前峰值和当前计数值之间的差值超过预定值，则再次执行比较和峰值保持。模拟量显示和测量方法适用于数字/模拟显示型测量仪器，其包括用于计数与测量对象接触的探头的位移的计数器，用于数字显示计数值的数字显示部分和模拟显示器位于与数字显示部分相邻的部分，用于将计数值显示为包括以一个方向并列排列的大量模拟条的条形图。

2. 发明授权

US08183681B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08183681B2
公开(公告)日：2012-05-22
申请号：US12493502
申请日：2009-06-29
申请人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
发明人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
IPC分类号： H01L23/48
CPC分类号： H01L23/051 , H01L23/24 , H01L2224/33181
摘要： A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the chip by a second bonding member; and a first stress relief member for reducing stress developed in the first bonding member due to the difference in thermal expansion between the chip and the base electrode. Both the base electrode and the first stress relief member are in direct contact with the lower surface of the first bonding member. A protrusion is formed upstanding from the base electrode in direct contact with the first bonding member, and the first stress relief member surrounds a circumferential portion of the protrusion.
摘要翻译：一种半导体器件，包括半导体芯片; 通过第一接合部件接合到所述芯片的下表面的导电基极; 通过第二接合部件将芯片的上表面接合的导电性引线电极; 以及由于芯片和基极之间的热膨胀差异，用于减小在第一接合部件中产生的应力的第一应力消除部件。基极和第一应力消除构件都与第一接合构件的下表面直接接触。从与第一接合构件直接接触的基极形成突起，并且第一应力消除构件围绕突起的周向部分。

3. 发明申请

US20090321783A1 Semiconductor Device 失效
标题翻译：半导体器件
公开(公告)号：US20090321783A1
公开(公告)日：2009-12-31
申请号：US12493502
申请日：2009-06-29
申请人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
发明人： Shinji Hiramitsu , Hiroyuki Ohta , Koji Sasaki , Masato Nakamura , Osamu Ikeda , Satoshi Matsuyoshi
IPC分类号： H01L29/86
CPC分类号： H01L23/051 , H01L23/24 , H01L2224/33181
摘要： A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the semiconductor chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the semiconductor chip by a second bonding member; and a first stress relief member for reducing stress developed in the first bonding member due to the difference in thermal expansion between the semiconductor chip and the base electrode, wherein both the base electrode and the first stress relief member are in direct contact with the lower surface of the first bonding member.
摘要翻译：一种半导体器件，包括半导体芯片; 通过第一接合部件接合到半导体芯片的下表面的导电基极; 导电引线电极，通过第二接合构件接合到半导体芯片的上表面; 以及由于所述半导体芯片和所述基极之间的热膨胀差异而减小在所述第一接合构件中产生的应力的第一应力消除构件，其中所述基极和所述第一应力消除构件都与所述下表面直接接触的第一粘合构件。

4. 发明授权

US06554194B1 IC card and its manufacturing method 失效
标题翻译： IC卡及其制造方法
公开(公告)号：US06554194B1
公开(公告)日：2003-04-29
申请号：US09391089
申请日：1999-09-16
申请人： Koji Sasaki , Naoto Saito , Hideo Miura , Hiroyuki Ohta , Kunio Matsumoto , Ryozo Yoshino
发明人： Koji Sasaki , Naoto Saito , Hideo Miura , Hiroyuki Ohta , Kunio Matsumoto , Ryozo Yoshino
IPC分类号： G06K1906
CPC分类号： G06K19/07728 , G06K19/077
摘要： An IC card has an IC chip and a circuit layer formed between layers of a base material that are adhered together by an adhesive. The IC card has a thickness of 0.25 to 0.76 mm and therefore the thickness of the IC chip needs to be about 0.2 mm, which requires grinding of the IC chip. In use, the IC card is subject to bending forces which apply a bending stress on the chip. In the process of grinding the IC chip, grinding flaws having sharp parts arise that reduce the bending strength of the chip. Also, during the dicing process of the wafer, chipping occurs that results in notches having sharp tip parts being formed in the chip. The grinding flaws that result from the grinding and the notches that result from the chipping are etched to remove their sharpness, which occurs at the tip part of the grinding flaw or the tip part of the notch. By rounding these sharp parts through the etching step, the bending strength of the IC chip increases and the durability of the IC card is ensured.
摘要翻译： IC卡具有通过粘合剂粘合在一起的基底材料层之间形成的IC芯片和电路层。 IC卡的厚度为0.25〜0.76mm，因此IC芯片的厚度需要为0.2mm左右，需要研磨IC芯片。在使用中，IC卡受到在芯片上施加弯曲应力的弯曲力。在研磨IC芯片的过程中，产生具有尖锐部分的研磨缺陷会降低芯片的弯曲强度。此外，在晶片的切割处理期间，发生切屑，导致在芯片中形成具有尖锐尖端部分的凹口。由研磨产生的磨削缺陷和由切屑引起的切口被蚀刻以去除其在磨削缺口的尖端部分或凹口的尖端部分发生的锋利度。通过蚀刻步骤对这些尖锐部分进行四舍五入，IC芯片的弯曲强度增加，并且确保了IC卡的耐久性。

5. 发明授权

US10827095B2 Image forming apparatus management system, image forming apparatus, managing apparatus, terminal apparatus, image forming apparatus managing method, and image forming program 有权
公开(公告)号：US10827095B2
公开(公告)日：2020-11-03
申请号：US16031532
申请日：2018-07-10
申请人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Daiya Miyasaka , Tomoko Nishizawa , Yasuhiko Tsugawa , Yohei Ono
发明人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Daiya Miyasaka , Tomoko Nishizawa , Yasuhiko Tsugawa , Yohei Ono
IPC分类号： H04N1/00 , H04N1/44 , G06F3/12 , H04N1/21
摘要： A disclosed managing apparatus and image forming apparatus management system ensure confidentiality of information in an image forming apparatus while usability is maintained. An image forming apparatus acquires IC card identifying information with an IC card reader. A management server acquires a user ID associated with the acquired IC card identifying information and use limit information concerning use of the image forming apparatus. A process is performed in the image forming apparatus in accordance with the use limit information.

6. 发明授权

US09307117B2 Management apparatus, image forming apparatus management system for managing usage of the image forming apparatus 有权
公开(公告)号：US09307117B2
公开(公告)日：2016-04-05
申请号：US14866474
申请日：2015-09-25
申请人： Atsushi Sakagami , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
发明人： Atsushi Sakagami , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
IPC分类号： G06K15/00 , H04N1/44 , H04N1/32
CPC分类号： H04N1/4426 , G06F3/1222 , G06F21/34 , G06F21/608 , G06F21/629 , G06K15/40 , G06K15/4095 , H04N1/32122 , H04N1/32561 , H04N1/4413 , H04N1/4433 , H04N1/444 , H04N2201/0094 , H04N2201/3205 , H04N2201/3221
摘要： A management apparatus connected to an image forming apparatus for managing usage of the image forming apparatus is disclosed. The management apparatus includes a user data storage part for storing user identification data and use restriction data corresponding to the user identification data, and a use restriction data acquiring part for acquiring the use restriction data corresponding to the user identification data.

7. 发明申请

US20160021279A1 MANAGEMENT APPARATUS, IMAGE FORMING APPARATUS MANAGEMENT SYSTEM FOR MANAGING USAGE OF THE IMAGE FORMING APPARATUS 审中-公开
公开(公告)号：US20160021279A1
公开(公告)日：2016-01-21
申请号：US14866474
申请日：2015-09-25
申请人： Atsushi Sakagami , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
发明人： Atsushi Sakagami , Naoto Sakurai , Daiya Miyasaka , Koji Sasaki , Tomoko Nishizawa
IPC分类号： H04N1/44 , H04N1/32
CPC分类号： H04N1/4426 , G06F3/1222 , G06F21/34 , G06F21/608 , G06F21/629 , G06K15/40 , G06K15/4095 , H04N1/32122 , H04N1/32561 , H04N1/4413 , H04N1/4433 , H04N1/444 , H04N2201/0094 , H04N2201/3205 , H04N2201/3221
摘要： A management apparatus connected to an image forming apparatus for managing usage of the image forming apparatus is disclosed. The management apparatus includes a user data storage part for storing user identification data and use restriction data corresponding to the user identification data, and a use restriction data acquiring part for acquiring the use restriction data corresponding to the user identification data.

8. 发明授权

US08553245B2 Management of image forming apparatus based on user authentication 失效
标题翻译：基于用户认证的图像形成装置的管理
公开(公告)号：US08553245B2
公开(公告)日：2013-10-08
申请号：US12485206
申请日：2009-06-16
申请人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Tomoko Saeki , Tsuyoshi Hoshino
发明人： Atsushi Sakagami , Naoto Sakurai , Koji Sasaki , Tomoko Saeki , Tsuyoshi Hoshino
IPC分类号： G06K15/00
CPC分类号： H04N1/00856 , G03G15/5016 , G03G15/5091 , G03G2215/00109 , H04L63/0853 , H04N1/00244 , H04N1/00344 , H04N1/0035 , H04N1/00514 , H04N1/4406 , H04N1/442 , H04N1/4426 , H04N1/4433 , H04N2201/0039 , H04N2201/0094
摘要： An image forming apparatus connected via a network with an authentication server for user authentication based on biometric information about a user. The image forming apparatus is also connected with a managing server for managing an operation of the image forming apparatus. The image forming apparatus includes a transmission unit transmitting the biometric information about the user to the authentication server, a reception unit receiving use limit information corresponding to the biometric information about the user from the managing server, and a control unit controlling the operation of the image forming apparatus based on the use limit information.
摘要翻译：一种通过网络与基于用户认证的认证服务器连接的图像形成装置，用于基于关于用户的生物特征信息。图像形成装置还与用于管理图像形成装置的操作的管理服务器连接。所述图像形成装置包括：发送单元，向所述认证服务器发送关于所述用户的生物体信息;接收单元，从所述管理服务器接收与所述用户的生物体信息对应的使用限制信息;以及控制单元，控制所述图像的操作基于使用限制信息的成形装置。

9. 发明授权

US08434850B2 Liquid discharge head and manufacturing method of the same 有权
标题翻译：排液头及其制造方法相同
公开(公告)号：US08434850B2
公开(公告)日：2013-05-07
申请号：US13233875
申请日：2011-09-15
申请人： Satoshi Ibe , Hiroto Komiyama , Toshiaki Kurosu , Kouji Hasegawa , Koji Sasaki
发明人： Satoshi Ibe , Hiroto Komiyama , Toshiaki Kurosu , Kouji Hasegawa , Koji Sasaki
IPC分类号： B41J29/377 , B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A liquid discharge head having a liquid discharge head substrate including an element row in which a plurality of energy generating elements for generating thermal energy for use in discharging liquid are arranged, and a discharge port member corresponding to each of the plurality of energy generating elements, the discharge port members including a plurality of walls in contact with the liquid discharge head substrate to form a plurality of liquid chambers for storing liquid and a plurality of discharge ports which communicate with each of the plurality of the liquid chambers to discharge liquid with the thermal energy generated by the energy generating element. The liquid discharge head further includes a plurality of heat dissipating members corresponding to each of the plurality of the liquid chambers and having a first portion exposed to the liquid chamber and a second portion exposed to the atmosphere.
摘要翻译：一种液体排出头，其具有排液头基板，该液体排出头基板包括排列有用于产生排出液体的热能的多个能量产生元件的元件列，以及与多个能量产生元件中的每一个对应的排出口构件，所述排出口构件包括与所述液体排出头基板接触的多个壁，以形成用于储存液体的多个液体室和与所述多个所述液体室中的每一个连通的多个排出口，以将热量排出液体由能量产生元件产生的能量。液体排出头还包括对应于多个液体室中的每一个的多个散热构件，并且具有暴露于液体室的第一部分和暴露于大气的第二部分。

10. 发明授权

US08421232B2 Semiconductor device and automotive ac generator 有权
标题翻译：半导体装置和汽车交流发电机
公开(公告)号：US08421232B2
公开(公告)日：2013-04-16
申请号：US13117544
申请日：2011-05-27
申请人： Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
发明人： Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H05K3/3463 , B23K35/262 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/29211 , H01L2224/29311 , H01L2224/32225 , H01L2224/32245 , H01L2224/32507 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H05K3/244 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01016 , H01L2924/01028 , H01L2924/01032 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.
摘要翻译：半导体器件包括半导体元件，利用第一接合材料接合到半导体元件的第一表面的支撑构件和利用第二接合材料接合到支撑在支撑构件上的半导体元件的第二表面的引线电极，以及还包括制造半导体器件的方法。支撑构件和引线电极的各个连接部分是镀镍的，并且第一和第二接合材料中的每一个是Cu 6 Sn 5含量大于共晶含量的Sn焊料。

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