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1. 发明申请

US20120217653A1 SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD 审中-公开
标题翻译：半导体器件和噪声抑制方法
公开(公告)号：US20120217653A1
公开(公告)日：2012-08-30
申请号：US13508073
申请日：2010-09-01
申请人： Koichi Takemura , Hisashi Ishida
发明人： Koichi Takemura , Hisashi Ishida
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/48 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/552 , H01L24/16 , H01L24/17 , H01L24/32 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2225/06513 , H01L2225/06517 , H01L2225/06531 , H01L2225/06537 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01033 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2224/05552 , H01L2924/00
摘要： A first semiconductor chip (200) is mounted on a second semiconductor chip (100). The first semiconductor chip (200) has a first conductor pattern (222). The second semiconductor chip (100) has a second conductor pattern (122). The second conductor pattern (122) is formed at a region overlapping the first conductor pattern (222) in a plan view. At least one element selected from a group consisting of the first conductor pattern (222) and the second conductor pattern (122) has a repetitive structure.
摘要翻译：第一半导体芯片（200）安装在第二半导体芯片（100）上。第一半导体芯片（200）具有第一导体图案（222）。第二半导体芯片（100）具有第二导体图案（122）。第二导体图案（122）形成在与俯视图中的第一导体图案（222）重叠的区域。选自由第一导体图案（222）和第二导体图案（122）组成的组中的至少一个元件具有重复结构。

2. 发明授权

US08345184B2 Surface light source apparatus 有权
标题翻译：表面光源装置
公开(公告)号：US08345184B2
公开(公告)日：2013-01-01
申请号：US12663731
申请日：2008-06-10
申请人： Masayuki Shinohara , Yasuhiro Tanoue , Kazuhide Hirota , Koichi Takemura , Takuma Iwase , Takako Ishikawa , Yoshihiro Ueno , Morihisa Ota , Jun Kishimoto , Gouo Kurata , Yukihiro Takahashi , Hiroyuki Miyamoto
发明人： Masayuki Shinohara , Yasuhiro Tanoue , Kazuhide Hirota , Koichi Takemura , Takuma Iwase , Takako Ishikawa , Yoshihiro Ueno , Morihisa Ota , Jun Kishimoto , Gouo Kurata , Yukihiro Takahashi , Hiroyuki Miyamoto
IPC分类号： G02F1/1335 , F21V7/04
CPC分类号： G02B6/0035 , G02B6/0016 , G02B6/0018 , G02B6/002 , G02B6/0036 , G02B6/0038
摘要： A light guide plate (63) includes a light introducing section (65), which is at a position facing a point light source (62), for confining light from the point light source, and a light guide plate main body (64), which has a thickness smaller than a thickness at an end of the light introducing section on the point light source side, for outputting the confined light to an outside from a light outputting surface by light outputting means (70). The light introducing section (65) has an inclined surface (67), which is inclined from a surface of the light introducing section towards a surface of the light guide plate main body (64). The inclined surface (67) has a directivity converting pattern (68) for converting a directivity expansion in a thickness direction of the light guide plate of the light entered to the light introducing section (65) to directivity characteristics tilted towards a direction parallel to a surface direction of the light guide plate. The directivity converting pattern (68) has a structure in which a plurality of V-shaped groove structures (68a) are lined.
摘要翻译：导光板（63）包括位于与点光源（62）相对的位置的用于限制来自点光源的光的光导入部（65）和导光板主体（64），其厚度小于点光源侧的光导入部分的端部的厚度，用于通过光输出装置（70）从光输出表面将限制的光输出到外部。光导入部65具有从导光部的表面朝向导光板主体64的表面倾斜的倾斜面67。倾斜面（67）具有指向性转换图案（68），用于将入射到光导入部（65）的光的导光板的厚度方向的方向性扩展转换成朝向与导光板的表面方向。方向转换图案（68）具有多个V形槽结构（68a）被排列的结构。

3. 发明申请

US20080289434A1 FLUID FLOW MEASURING INSTRUMENT 有权
标题翻译：流体流量测量仪
公开(公告)号：US20080289434A1
公开(公告)日：2008-11-27
申请号：US12028539
申请日：2008-02-08
申请人： Koichi Takemura , Daisuke Bessyo , Fumikazu Shiba , Yuji Nakabayashi
发明人： Koichi Takemura , Daisuke Bessyo , Fumikazu Shiba , Yuji Nakabayashi
IPC分类号： G01F1/66
CPC分类号： G01F1/667
摘要： A measurement control section comprises a time measuring section for controlling an operation of measuring a travel time of an ultrasonic wave. The measurement control section operations, based on a high rate clock signal supplied from a ceramic oscillation circuit during the time measuring operation. A clock control section stops the high rate clock signal supplied from the ceramic oscillation circuit every time when the time measuring section completes its time measuring operation, and uses a low rate clock signal supplied from a quartz oscillation circuit to count a standby time between the end of measuring the travel time and the start of carrying out the next measuring operation.
摘要翻译：测量控制部分包括用于控制测量超声波行进时间的操作的时间测量部分。测量控制部分基于在时间测量操作期间从陶瓷振荡电路提供的高速率时钟信号进行操作。每当时间测量部分完成其时间测量操作时，时钟控制部分停止从陶瓷振荡电路提供的高速率时钟信号，并且使用从石英振荡电路提供的低速率时钟信号来计数结束之间的待机时间测量行驶时间和开始进行下一次测量操作。

4. 发明授权

US06772643B2 Flow meter 失效
标题翻译：流量计
公开(公告)号：US06772643B2
公开(公告)日：2004-08-10
申请号：US10410529
申请日：2003-04-09
申请人： Osamu Eguchi , Koichi Takemura , Shuji Ab
发明人： Osamu Eguchi , Koichi Takemura , Shuji Ab
IPC分类号： G01F166
CPC分类号： G01F1/668
摘要： A flow meter measures a flow rate of fluid flowing through a flow passage based on a duration of propagation of an ultrasonic wave along the flow passage. A signal of the received ultrasonic wave is then compared with a reference voltage to detect an arrival of the ultrasonic wave. A voltage setting unit determines the reference voltage to an appropriate level according to a signal output from a propagation measuring unit which measures a duration of propagation of the ultrasonic wave along the flow passage from the start of transmission of the ultrasonic wave to the output of a signal from a judging unit as the reference voltage being changed. The reference voltage is determined readily and accurately, the flow meter measures the flow rate with the appropriate reference voltage.
摘要翻译：流量计基于超声波沿着流路的传播持续时间来测量流过流道的流体的流量。然后将接收到的超声波的信号与参考电压进行比较，以检测超声波的到达。电压设定单元根据从传播测量单元输出的信号来确定参考电压到适当的电平，该传播测量单元测量从超声波的发射开始到超声波的输出的超声波沿着流路的传播持续时间当参考电压被改变时来自判断单元的信号。参考电压被容易且准确地确定，流量计用适当的参考电压来测量流量。

5. 发明授权

US06730955B2 Semiconductor memory and process for fabricating the same 失效
公开(公告)号：US06730955B2
公开(公告)日：2004-05-04
申请号：US10100336
申请日：2002-03-18
申请人： Sota Shinohara , Koichi Takemura , Yasuhiro Tsujita , Hidemitsu Mori
发明人： Sota Shinohara , Koichi Takemura , Yasuhiro Tsujita , Hidemitsu Mori
IPC分类号： H01L2968
CPC分类号： H01L27/11502 , H01L27/11507 , H01L28/55 , H01L28/75
摘要： In a semiconductor memory, a barrier layer formed of a first metal film, a metal nitride film and a second metal film laminated in the named order is formed under a lower electrode of a ferroelectric capacitor in a memory cell, in order to minimize a pealing and lifting of the lower electrode from an underlying plug in the process of forming a ferroelectric material film as a capacitor dielectric film and in its succeeding annealing process. The metal nitride film is formed of a nitride of a metal constituting the first or second metal film.

6. 发明申请

US20130005085A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130005085A1
公开(公告)日：2013-01-03
申请号：US13549001
申请日：2012-07-13
申请人： Akinobu SHIBUYA , Koichi Takemura , Akira Ouchi , Tomoo Murakami
发明人： Akinobu SHIBUYA , Koichi Takemura , Akira Ouchi , Tomoo Murakami
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L21/563 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/97 , H01L2221/68377 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83385 , H01L2224/97 , H01L2924/01004 , H01L2924/01006 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15788 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2224/81 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2924/00014
摘要： A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.
摘要翻译：衬底和半导体芯片通过倒装芯片互连连接。在衬底的连接焊盘和半导体芯片的输入/输出端子之间，注入底部填充材料。底部填充材料是填料和树脂的复合材料。此外，未被底部填充材料覆盖的基板的第一主表面和半导体芯片的侧表面被模制材料封装。成型材料是填料和树脂的复合材料。由模制材料覆盖的衬底和半导体芯片的集成体从上方和下方变薄。

7. 发明授权

US08237292B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08237292B2
公开(公告)日：2012-08-07
申请号：US12526236
申请日：2008-02-29
申请人： Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
发明人： Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
IPC分类号： H01L23/488
CPC分类号： H01L21/563 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/97 , H01L2221/68377 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83385 , H01L2224/97 , H01L2924/01004 , H01L2924/01006 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15788 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2224/81 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2924/00014
摘要： A substrate (1) and a semiconductor chip (5) are connected by means of flip-chip interconnection. Around connecting pads (3) of the substrate (1) and input/output terminals (10) of the semiconductor chip (5), an underfill material (7) is injected. The underfill material (7) is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 μm or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (1), which is not covered with the underfill material (7), and the side surfaces of the semiconductor chip (5) are encapsulated with a molding material (8). The molding material (8) is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180° C. An integrated body of the substrate (1) and the semiconductor chip (5), which are covered with the molding material (8), is thinned from above and below.
摘要翻译：基板（1）和半导体芯片（5）通过倒装芯片互连连接。在衬底（1）的连接焊盘（3）和半导体芯片（5）的输入/输出端子（10）之间，注入底部填充材料（7）。底部填充材料（7）是填料和树脂的复合材料，其中填料的最大粒径为5μm以下，填料含量为40〜60重量％。此外，未被底部填充材料（7）覆盖的基板（1）的第一主表面和半导体芯片（5）的侧表面被模制材料（8）封装。成型材料（8）是填料和树脂的复合材料，其填料含量超过75重量％，树脂的玻璃化转变温度超过180℃。基板（1）和半导体由模制材料（8）覆盖的芯片（5）从上方和下方变薄。

8. 发明申请

US20120002441A1 AREA LIGHT SOURCE DEVICE 有权
标题翻译：区域光源设备
公开(公告)号：US20120002441A1
公开(公告)日：2012-01-05
申请号：US13057300
申请日：2009-08-07
申请人： Mamoru Yabe , Koichi Takemura , Kazuhide Hirota , Chih Bun Shiu
发明人： Mamoru Yabe , Koichi Takemura , Kazuhide Hirota , Chih Bun Shiu
IPC分类号： F21V5/02
CPC分类号： G02B6/002 , G02B6/0023 , G02B6/0028 , G02B6/0051 , G02B6/0053 , G02B6/0081 , G02F1/133615
摘要： An area light source device has a diffusion plate and a prism sheet stacked on a light guide plate, and a light source disposed opposite an end face of the light guide plate. Light emitted from the light source is introduced to an inside of the light guide plate from the end face. Area light emission is obtained by outputting the light diffused in the light guide plate from the diffusion plate and the prism sheet through a front face disposed opposite the diffusion plate. The light guide plate includes a light guide section that includes the end face disposed opposite the light source, a light emitting section that is disposed opposite the diffusion plate, and a joining section that joins the light guide section and the light emitting section. The front surface in the joining section includes an inclined surface that is gradually retreated toward a rear surface on an opposite side from the light guide section toward the light emitting section. The front faces of the light guide section and the joining section are covered with a light shielding member. The light shielding member is fixed to the diffusion plate without interposing the prism sheet therebetween. The light shielding member and the inclined surface are arranged to allow air to be interposed therebetween.
摘要翻译：区域光源装置具有层叠在导光板上的漫射板和棱镜片以及与导光板的端面相对设置的光源。从光源发射的光从端面引入导光板的内部。通过从漫射板和棱镜片通过与扩散板相对设置的前表面输出在导光板中扩散的光来获得区域发光。导光板包括导光部，该导光部包括与光源相对设置的端面，与扩散板相对配置的发光部和与导光部和发光部接合的接合部。接合部的前表面包括朝向与导光部朝向发光部的相对侧的后表面逐渐退缩的倾斜面。导光部和接合部的前表面被遮光部件覆盖。光屏蔽构件固定在漫射板上，而不将棱镜片插入其间。遮光构件和倾斜表面被布置成允许空气插入其间。

9. 发明申请

US20110304784A1 AREA LIGHT SOURCE DEVICE AND STEREOSCOPIC DISPLAY DEVICE 审中-公开
标题翻译：区域光源装置和立体显示装置
公开(公告)号：US20110304784A1
公开(公告)日：2011-12-15
申请号：US13157860
申请日：2011-06-10
申请人： Kazuhide Hirota , Gouo Kurata , Koichi Takemura , Yoshihiro Ueno , Yu Kioka
发明人： Kazuhide Hirota , Gouo Kurata , Koichi Takemura , Yoshihiro Ueno , Yu Kioka
IPC分类号： G02F1/13357 , F21V8/00
CPC分类号： G02B6/0076 , G02B6/0046 , G02B6/0053 , G02B27/2214
摘要： An area light source device has a first light guide plate, a first light source arranged facing a first end of the first light guide plate, a second light guide plate, and a second light source arranged facing a first end of the second light guide plate, the first light guide plate and the second light guide plate being overlapped to configure a light guide body. The first light guide plate and the second light guide plate are overlapped so that the first end face of the first light guide plate and a second end face positioned on an opposite side of the first end face of the second light guide plate are positioned on the same side.
摘要翻译：区域光源装置具有第一导光板，与第一导光板的第一端相对配置的第一光源，第二导光板和与第二导光板的第一端面对的第二光源第一导光板和第二导光板重叠配置导光体。第一导光板和第二导光板重叠，使得第一导光板的第一端面和位于第二导光板的第一端面的相反侧的第二端面位于同一面

10. 发明申请

US20110238332A1 FLOW MEASUREMENT DEVICE 有权
标题翻译：流量测量装置
公开(公告)号：US20110238332A1
公开(公告)日：2011-09-29
申请号：US12809311
申请日：2008-12-12
申请人： Fumikazu Shiba , Koichi Takemura , Daisuke Bessyo
发明人： Fumikazu Shiba , Koichi Takemura , Daisuke Bessyo
IPC分类号： G06F19/00
CPC分类号： G01F1/667 , G01F1/662
摘要： To find the propagation time of an ultrasonic wave, a difference occurs between the waveforms received upstream and downstream in a portion where the reception amplitude is comparatively large and it is prevented from being detected as an error of the propagation time. A reception signal is amplified in a reception unit 35 and reception point storage units 38 store the most recent reception point data in a plurality of storage sections in order until the signal level becomes a predetermined value (Vref). An average value of the two zero crossing points before and after the signal level becomes Vref can be adopted as a reception point, the propagation time with a small error of up and down offset, etc., is measured, and it is made possible to realize power saving operation by shortening the measurement time.
摘要翻译：为了找到超声波的传播时间，在接收幅度比较大的部分中接收的上下游波形之间出现差异，并且防止被检测为传播时间的误差。在接收单元35中放大接收信号，并且接收点存储单元38按顺序存储多个存储区中的最新接收点数据，直到信号电平变为预定值（Vref）为止。可以采用将信号电平变为Vref之前和之后的两个过零点的平均值作为接收点，测量上下偏移误差等的传播时间，并且可以通过缩短测量时间实现省电操作。

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