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    • 3. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND READ METHOD FOR THE SAME
    • 非易失性半导体存储器件及其读取方法
    • US20130148406A1
    • 2013-06-13
    • US13700329
    • 2012-07-11
    • Kazuhiko ShimakawaKiyotaka TsujiRyotaro Azuma
    • Kazuhiko ShimakawaKiyotaka TsujiRyotaro Azuma
    • G11C13/00
    • G11C13/004G11C7/14G11C11/1673G11C13/0004G11C2013/0054G11C2213/71G11C2213/72G11C2213/73G11C2213/77
    • A cross point nonvolatile memory device capable of suppressing sneak-current-caused reduction in sensitivity of detection of a resistance value of a memory element is provided. The device includes perpendicular bit and word lines; a cross-point cell array including memory cells each having a resistance value reversibly changing between at least two resistance states according to electrical signals, arranged on cross-points of the word and bit lines; an offset detection cell array including an offset detection cell having a resistance higher than that of the memory cell in a high resistance state, the word lines being shared by the offset detection cell array; a read circuit (a sense amplifier) that determines a resistance state of a selected memory cell based on a current through the selected bit line; and a current source which supplies current to the offset detection cell array in a read operation period.
    • 提供一种能够抑制潜流引起的对存储元件的电阻值的检测灵敏度的降低的交叉点非易失性存储装置。 该设备包括垂直位和字线; 交叉点单元阵列,其包括存储单元,每个存储单元具有电阻值,该电阻值根据电信号在至少两个电阻状态之间可逆地改变;布置在字和位线的交叉点上; 偏移检测单元阵列,包括在高电阻状态下具有高于存储单元的电阻的偏移检测单元,所述字线由偏移检测单元阵列共享; 读取电路(读出放大器),其基于通过所选位线的电流确定所选存储单元的电阻状态; 以及在读取操作时段中向偏移检测单元阵列提供电流的电流源。
    • 4. 发明授权
    • Nonvolatile semiconductor memory device and read method for the same
    • 非易失性半导体存储器件及其读取方法相同
    • US08953363B2
    • 2015-02-10
    • US13700329
    • 2012-07-11
    • Kazuhiko ShimakawaKiyotaka TsujiRyotaro Azuma
    • Kazuhiko ShimakawaKiyotaka TsujiRyotaro Azuma
    • G11C11/00G11C13/00G11C11/16G11C7/14
    • G11C13/004G11C7/14G11C11/1673G11C13/0004G11C2013/0054G11C2213/71G11C2213/72G11C2213/73G11C2213/77
    • A cross point nonvolatile memory device capable of suppressing sneak-current-caused reduction in sensitivity of detection of a resistance value of a memory element is provided. The device includes perpendicular bit and word lines; a cross-point cell array including memory cells each having a resistance value reversibly changing between at least two resistance states according to electrical signals, arranged on cross-points of the word and bit lines; an offset detection cell array including an offset detection cell having a resistance higher than that of the memory cell in a high resistance state, the word lines being shared by the offset detection cell array; a read circuit (a sense amplifier) that determines a resistance state of a selected memory cell based on a current through the selected bit line; and a current source which supplies current to the offset detection cell array in a read operation period.
    • 提供一种能够抑制潜流引起的对存储元件的电阻值的检测灵敏度的降低的交叉点非易失性存储装置。 该设备包括垂直位和字线; 交叉点单元阵列,其包括存储单元,每个存储单元具有电阻值,该电阻值根据电信号在至少两个电阻状态之间可逆地改变;布置在字和位线的交叉点上; 偏移检测单元阵列,包括在高电阻状态下具有高于存储单元的电阻的偏移检测单元,所述字线由偏移检测单元阵列共享; 读取电路(读出放大器),其基于通过所选位线的电流确定所选存储单元的电阻状态; 以及在读取操作时段中向偏移检测单元阵列提供电流的电流源。
    • 5. 发明授权
    • Variable resistance element and nonvolatile semiconductor memory device using the same
    • 可变电阻元件和使用其的非易失性半导体存储器件
    • US08350245B2
    • 2013-01-08
    • US13133809
    • 2009-12-08
    • Kiyotaka Tsuji
    • Kiyotaka Tsuji
    • H01L29/02
    • H01L27/101H01L27/2436H01L27/2472H01L45/08H01L45/1233H01L45/146H01L45/1625H01L45/1675
    • To provide a variable resistance element capable of preventing the interface resistance, in a side of the variable resistance element in which resistance change is not allowed, from changing to high resistance due to applied voltage. The variable resistance element is configured by providing a variable resistance film (265) between a first electrode (280) and a second electrode (250), the oxygen concentration within the film of the variable resistance film (265) is high at the side of an interface with the second electrode (250) (high-concentration variable resistance layer (260)) and low at the side of an interface with the first electrode (280) (low-concentration variable resistance layer (270)), and the junction surface area between the low-concentration variable resistance layer (270) and the first electrode (280) is larger than the interface surface area between the high-concentration variable resistance layer (260) and the second electrode (250).
    • 为了提供一种可变电阻元件,能够防止在不允许电阻变化的可变电阻元件侧的界面电阻由于施加的电压而变为高电阻。 可变电阻元件通过在第一电极(280)和第二电极(250)之间设置可变电阻膜(265)而构成,可变电阻膜(265)的膜内的氧浓度在 与第二电极(250)(高浓度可变电阻层(260))的界面和与第一电极(280)的界面侧的低(低浓度可变电阻层(270))的界面, 低浓度可变电阻层(270)和第一电极(280)之间的表面积大于高浓度可变电阻层(260)和第二电极(250)之间的界面面积。
    • 6. 发明申请
    • VARIABLE RESISTANCE ELEMENT AND MANUFACTURING METHOD OF THE SAME
    • 可变电阻元件及其制造方法
    • US20110074539A1
    • 2011-03-31
    • US12994916
    • 2010-04-14
    • Kiyotaka Tsuji
    • Kiyotaka Tsuji
    • H01C7/10H01C17/00
    • H01L45/1246H01L27/101H01L45/08H01L45/1233H01L45/146H01L45/1625H01L45/1683Y10T29/49082
    • A variable resistance element capable of increasing stability of a resistance changing operation and reducing a current necessary for changing, to a low resistance state for the first time, the variable resistance element in an initial state immediately after manufacture. The variable resistance element includes: a first electrode (101); a memory cell hole (150) formed above the first electrode (101); a first variable resistance layer (201) covering a bottom of the memory cell hole (150) and an upper surface of the first electrode (101); a second variable resistance layer (202) formed on the first variable resistance layer (201); and a second electrode (102) formed on the memory cell hole (150), in which a thickness of the first variable resistance layer (201) at the bottom of the memory cell hole (150) gradually decreases toward an edge area of the memory cell hole (150) and has a local minimum value around the edge area of the memory cell hole (150). Furthermore, an oxygen concentration in the first variable resistance layer (201) is higher than an oxygen concentration in the second variable resistance layer (202).
    • 一种可变电阻元件,其能够增加电阻变化操作的稳定性,并且减少在制造后立即将初始状态中的可变电阻元件首次变为低电阻状态所需的电流。 可变电阻元件包括:第一电极(101); 形成在所述第一电极(101)上方的存储单元孔(150); 覆盖存储单元孔(150)底部的第一可变电阻层(201)和第一电极(101)的上表面; 形成在第一可变电阻层(201)上的第二可变电阻层(202); 以及形成在存储单元孔(150)上的第二电极(102),其中存储单元孔(150)底部的第一可变电阻层(201)的厚度朝向存储器的边缘区域逐渐减小 电池孔(150),并且在存储单元孔(150)的边缘区域周围具有局部最小值。 此外,第一可变电阻层(201)中的氧浓度高于第二可变电阻层(202)中的氧浓度。
    • 8. 发明申请
    • Magnetic memory, and its operating method
    • 磁记忆体及其操作方法
    • US20060056250A1
    • 2006-03-16
    • US10512545
    • 2003-04-21
    • Sadahiko MiuraTadahiko SugibayashiHideaki NumataKiyotaka Tsuji
    • Sadahiko MiuraTadahiko SugibayashiHideaki NumataKiyotaka Tsuji
    • G11C7/00
    • H01L27/228B82Y10/00G11C11/16
    • A technology for eliminating the defects in a tunnel insulation film of magnetic tunnel junction and for suppressing generation of a defective bit in an MRAM using magnetic tunnel junction in a memory. The magnetic memory includes a substrate, an interlayer insulation film covering the upper surface side of the substrate, memory cells, and plugs penetrating the interlayer insulation film. The memory cell includes a first magnetic layer formed on the upper surface side of the interlayer insulation film, a tunnel insulation layer formed on the first magnetic layer, and a second magnetic layer formed on the tunnel insulation layer. The plug is connected electrically with the first magnetic layer. The tunnel current passing part of the tunnel insulation layer located between the first and second magnetic layers is arranged, at least partially, so as not to overlap the plug in the direction perpendicular to the surface of the substrate.
    • 一种用于消除磁隧道结隧道绝缘膜中的缺陷并用于抑制在存储器中使用磁性隧道结的MRAM中的有缺陷位的产生的技术。 磁性存储器包括基板,覆盖基板的上表面侧的层间绝缘膜,存储单元和穿透层间绝缘膜的插塞。 存储单元包括形成在层间绝缘膜的上表面侧的第一磁性层,形成在第一磁性层上的隧道绝缘层和形成在隧道绝缘层上的第二磁性层。 插头与第一磁性层电连接。 位于第一和第二磁性层之间的隧道绝缘层的隧道电流通过部分被布置成至少部分地不与垂直于衬底的表面的方向上的插塞重叠。
    • 10. 发明申请
    • VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, METHOD OF MANUFACTURING THE SAME, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE
    • 可变电阻非易失性存储器元件,其制造方法和可变电阻非易失性存储器件
    • US20120193600A1
    • 2012-08-02
    • US13499961
    • 2011-07-01
    • Atsushi HimenoKiyotaka Tsuji
    • Atsushi HimenoKiyotaka Tsuji
    • H01L47/00H01L21/02
    • H01L27/2463H01L27/2409H01L45/08H01L45/1233H01L45/145H01L45/1625H01L45/1683
    • A variable resistance nonvolatile memory element (10) is formed from a first electrode (101) comprising a material including a metal as a main component, a variable resistance layer (102) having a reversibly changing resistance value in response to applied predetermined electric pulses having different polarities, a semiconductor layer (103) comprising a material including a nitrogen-deficient silicon nitride as a main component, and a second electrode (104). The variable resistance layer (102) includes a first variable resistance layer (102a) adjacent to the first electrode (101) and a second variable resistance layer (102b), both comprising a material including an oxygen-deficient transition metal oxide as a main component. The first variable resistance layer (102a) has a higher oxygen content atomic percentage than the second variable resistance layer (102b). A stacked structure of the variable resistance layer (102), the semiconductor layer (103), and the second electrode (104) functions as a bidirectional diode element (106).
    • 可变电阻非易失性存储元件(10)由包括以金属为主要成分的材料的第一电极(101)形成,可变电阻层(102)响应于所施加的预定电脉冲具有可逆变化的电阻值, 不同极性的半导体层(103)和第二电极(104),包括氮缺乏氮化物作为主要成分的材料。 可变电阻层(102)包括与第一电极(101)相邻的第一可变电阻层(102a)和第二可变电阻层(102b),二者包括以氧缺乏的过渡金属氧化物为主要成分的材料 。 第一可变电阻层(102a)具有比第二可变电阻层(102b)更高的氧含量原子百分比。 可变电阻层(102),半导体层(103)和第二电极(104)的堆叠结构用作双向二极管元件(106)。