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    • 2. 发明授权
    • Resonance tunnel device
    • 共振隧道装置
    • US6015978A
    • 2000-01-18
    • US175505
    • 1998-10-20
    • Koichiro YukiKiyoyuki MoritaKiyoshi MorimotoYoshihiko Hirai
    • Koichiro YukiKiyoyuki MoritaKiyoshi MorimotoYoshihiko Hirai
    • H01L21/306H01L21/329H01L29/88H01L29/06
    • H01L29/6609H01L21/30608H01L29/882Y10S438/962
    • The method for forming a semiconductor microstructure of this invention includes the steps of: forming a mask pattern having a first opening and a second opening on a substrate having a semiconductor layer as an upper portion thereof; and selectively etching the semiconductor layer using the mask pattern to form a semiconductor microstructure extending in a first direction parallel to a surface of the substrate, wherein, in the step of selectively etching the semiconductor layer, an etching rate in a second direction vertical to the first direction and parallel to the surface of the substrate is substantially zero with respect to an etching rate in the first direction, and a width of the semiconductor microstructure is substantially equal to a shortest distance between the first opening and the second opening in the second direction.
    • 形成本发明的半导体微结构的方法包括以下步骤:在具有半导体层作为其上部的衬底上形成具有第一开口和第二开口的掩模图案; 以及使用所述掩模图案选择性地蚀刻所述半导体层,以形成在平行于所述基板的表面的第一方向上延伸的半导体微结构,其中,在选择性地蚀刻所述半导体层的步骤中,沿垂直于所述基板的第二方向的蚀刻速率 第一方向并平行于衬底的表面相对于第一方向上的蚀刻速率基本上为零,并且半导体微结构的宽度基本上等于第一开口和第二开口在第二方向上的最短距离 。
    • 8. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US06171905B2
    • 2001-01-09
    • US09192537
    • 1998-11-17
    • Kiyoyuki MoritaKiyoshi MorimotoKoichiro YukiKiyoshi Araki
    • Kiyoyuki MoritaKiyoshi MorimotoKoichiro YukiKiyoshi Araki
    • H01L21336
    • H01L21/76264H01L21/76267H01L21/76281H01L21/84H01L27/12H01L27/1203H01L29/7606H01L29/882
    • The invention provides a semiconductor device, having a variety of functions such as a bistable memory and a logic circuit, in which a MOS semiconductor element, a resonance tunnel diode, a hot electron transistor and the like are formed on a common substrate. An n-type Si layer and a p-type Si layer surrounded with an isolation oxide film are formed on an SOI substrate. A mask oxide film and a gate oxide film are formed, and the n-type Si layer is subjected to crystal anisotropic etching by using the mask oxide film as a mask, so as to change the n-type Si layer into the shape of a thin Si plate. After first and second tunnel oxide films are formed on side faces of this n-type Si layer, first and second polysilicon electrodes of a resonance tunnel diode and a polysilicon electrode working as a gate electrode of a MOS semiconductor element are formed out of a common polysilicon film. Thus, a Si/SiO2 type quantum device can be manufactured with ease at a low cost.
    • 本发明提供一种半导体器件,其具有各种功能,例如双稳态存储器和逻辑电路,其中在公共衬底上形成有MOS半导体元件,谐振隧道二极管,热电子晶体管等。 在SOI衬底上形成由隔离氧化膜包围的n型Si层和p型Si层。 形成掩模氧化膜和栅极氧化膜,并且通过使用掩模氧化膜作为掩模对n型Si层进行结晶各向异性蚀刻,以将n型Si层改变为 薄Si板。 在该n型Si层的侧面上形成第一和第二隧道氧化物膜之后,共用隧道二极管的第一和第二多晶硅电极和用作MOS半导体元件的栅电极的多晶硅电极由共同的 多晶硅膜。 因此,可以容易地以低成本制造Si / SiO 2型量子器件。
    • 9. 发明授权
    • MIS SOI semiconductor device with RTD and/or HET
    • 具有RTD和/或HET的MIS SOI半导体器件
    • US6091077A
    • 2000-07-18
    • US955267
    • 1997-10-21
    • Kiyoyuki MoritaKiyoshi MorimotoKoichiro YukiKiyoshi Araki
    • Kiyoyuki MoritaKiyoshi MorimotoKoichiro YukiKiyoshi Araki
    • H01L21/762H01L21/84H01L27/12H01L29/76H01L29/88H01L29/06
    • H01L21/76264H01L21/84H01L27/12H01L27/1203H01L29/7606H01L29/882H01L21/76267H01L21/76281
    • The invention provides a semiconductor device, having a variety of functions such as a bistable memory and a logic circuit, in which a MOS semiconductor element, a resonance tunnel diode, a hot electron transistor and the like are formed on a common substrate. An n-type Si layer and a p-type Si layer surrounded with an isolation oxide film are formed on an SOI substrate. A mask oxide film and a gate oxide film are formed, and the n-type Si layer is subjected to crystal anisotropic etching by using the mask oxide film as a mask, so as to change the n-type Si layer into the shape of a thin Si plate. After first and second tunnel oxide films are formed on side faces of this n-type Si layer, first and second polysilicon electrodes of a resonance tunnel diode and a polysilicon electrode working as a gate electrode of a MOS semiconductor element are formed out of a common polysilicon film. Thus, a Si/SiO.sub.2 type quantum device can be manufactured with ease at a low cost.
    • 本发明提供一种半导体器件,其具有各种功能,例如双稳态存储器和逻辑电路,其中在公共衬底上形成有MOS半导体元件,谐振隧道二极管,热电子晶体管等。 在SOI衬底上形成由隔离氧化膜包围的n型Si层和p型Si层。 形成掩模氧化膜和栅极氧化膜,并且通过使用掩模氧化膜作为掩模对n型Si层进行结晶各向异性蚀刻,以将n型Si层改变为 薄Si板。 在该n型Si层的侧面上形成第一和第二隧道氧化物膜之后,共用隧道二极管的第一和第二多晶硅电极和用作MOS半导体元件的栅电极的多晶硅电极由共同的 多晶硅膜。 因此,可以容易地以低成本制造Si / SiO 2型量子器件。