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1. 发明申请

US20090317563A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR 失效
标题翻译：电子设备及其制造方法
公开(公告)号：US20090317563A1
公开(公告)日：2009-12-24
申请号：US12548262
申请日：2009-08-26
申请人： Kiwako OHMORI , Nobuo Tanabe , Akinobu Ono
发明人： Kiwako OHMORI , Nobuo Tanabe , Akinobu Ono
IPC分类号： B05D3/06
CPC分类号： H01L51/0015 , G03F7/039 , G03F7/093 , H01L51/5206
摘要： A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.
摘要翻译：一种电子器件的制造方法，该方法包括在基材上形成包含导电聚合物的透明导电膜，并将紫外光照射到透明导电膜的一部分上，使得透明导电膜的第一区域不被照射并且与第一区域相邻的第二区域被照射，从而形成照射部分和未照射部分。所述照射部的电阻值高于未照射部的电阻值。紫外线包括透明导电膜的导电性聚合物的吸收光谱中的吸光度的波长比背景的两倍以上。

2. 发明授权

US08007335B2 Manufacturing method for electronic device 失效
标题翻译：电子设备制造方法
公开(公告)号：US08007335B2
公开(公告)日：2011-08-30
申请号：US12548262
申请日：2009-08-26
申请人： Kiwako Ohmori , Nobuo Tanabe , Akinobu Ono
发明人： Kiwako Ohmori , Nobuo Tanabe , Akinobu Ono
IPC分类号： H01J9/00
CPC分类号： H01L51/0015 , G03F7/039 , G03F7/093 , H01L51/5206
摘要： A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.
摘要翻译：一种电子器件的制造方法，该方法包括在基材上形成包含导电聚合物的透明导电膜，并将紫外光照射到透明导电膜的一部分上，使得透明导电膜的第一区域不被照射并且与第一区域相邻的第二区域被照射，从而形成照射部分和未照射部分。所述照射部的电阻值高于未照射部的电阻值。紫外线包括透明导电膜的导电性聚合物的吸收光谱中的吸光度的波长比背景的两倍以上。

3. 发明授权

US08018146B2 Electronic device and manufacturing method therefor 失效
标题翻译：电子设备及其制造方法
公开(公告)号：US08018146B2
公开(公告)日：2011-09-13
申请号：US11768399
申请日：2007-06-26
申请人： Kiwako Ohmori , Nobuo Tanabe , Akinobu Ono
发明人： Kiwako Ohmori , Nobuo Tanabe , Akinobu Ono
IPC分类号： H01L51/00
CPC分类号： H01L51/0015 , G03F7/039 , G03F7/093 , H01L51/5206
摘要： A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.
摘要翻译：一种电子器件的制造方法，该方法包括在基材上形成包含导电聚合物的透明导电膜，并将紫外光照射到透明导电膜的一部分上，使得透明导电膜的第一区域不被照射并且与第一区域相邻的第二区域被照射，从而形成照射部分和未照射部分。所述照射部的电阻值高于未照射部的电阻值。紫外线包括透明导电膜的导电性聚合物的吸收光谱中的吸光度的波长比背景的两倍以上。

4. 发明申请

US20050116203A1 Conductive composition, conductive film, and process for the formation of the film 有权
标题翻译：导电组合物，导电膜和用于形成膜的方法
公开(公告)号：US20050116203A1
公开(公告)日：2005-06-02
申请号：US10510512
申请日：2003-04-09
申请人： Katsuhiko Takahashi , Kiwako Ohmori , Masanori Endo , Hikaru Yasuhara , Takayuki Imai , Akinobu Ono , Toshiyuki Honda , Koji Okamoto , Masafumi Ito
发明人： Katsuhiko Takahashi , Kiwako Ohmori , Masanori Endo , Hikaru Yasuhara , Takayuki Imai , Akinobu Ono , Toshiyuki Honda , Koji Okamoto , Masafumi Ito
IPC分类号： C08K3/08 , C08K3/22 , C08K3/26 , C08L61/00 , C08L63/00 , C08L67/00 , C09D5/24 , C09J9/02 , H01B1/22 , H05K1/09 , H01C1/00
CPC分类号： H05K1/095 , C08K3/22 , C08K3/26 , C08K2003/0806 , C08K2003/2286 , C08L61/00 , C08L63/00 , C08L67/00 , C09D5/24 , C09J9/02 , H01B1/22
摘要： A conductive composition capable of producing a conductive paint with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 μm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound is preferably from 0.01 to 10 μm.
摘要翻译：一种导电组合物，其能够制备具有优异柔性和高导电性的导电涂料，与金属银相当，而不用高温作为成膜条件。导电组合物包括颗粒状银化合物和粘合剂，以及任选的还原剂和粘合剂。使用氧化银，碳酸银和乙酸银等作为颗粒状银化合物。乙二醇，二乙二醇和乙二醇二乙酸酯等用作还原剂，并且使用多价酚化合物，酚醛树脂，醇酸树脂或聚酯树脂等热固性树脂或热塑性树脂使用平均粒径为20nm〜5μm的苯乙烯树脂或聚对苯二甲酸乙二醇酯作为粘合剂。此外，颗粒状银化合物的平均粒径优选为0.01〜10μm。

5. 发明授权

US07771627B2 Conductive composition 有权
标题翻译：导电组成
公开(公告)号：US07771627B2
公开(公告)日：2010-08-10
申请号：US10510512
申请日：2003-04-09
申请人： Katsuhiko Takahashi , Kiwako Ohmori , Masanori Endo , Hikaru Yasuhara , Takayuki Imai , Akinobu Ono , Toshiyuki Honda , Koji Okamoto , Masafumi Ito
发明人： Katsuhiko Takahashi , Kiwako Ohmori , Masanori Endo , Hikaru Yasuhara , Takayuki Imai , Akinobu Ono , Toshiyuki Honda , Koji Okamoto , Masafumi Ito
IPC分类号： H01B1/20
CPC分类号： H05K1/095 , C08K3/22 , C08K3/26 , C08K2003/0806 , C08K2003/2286 , C08L61/00 , C08L63/00 , C08L67/00 , C09D5/24 , C09J9/02 , H01B1/22
摘要： A conductive composition capable of producing a conductive coating with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 μm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound may be from 0.01 to 10 μm.
摘要翻译：一种导电组合物，其能够制备具有优异的柔性和高导电性的导电涂层，与金属银相当，而不用高温作为成膜条件。导电组合物包括颗粒状银化合物和粘合剂，以及任选的还原剂和粘合剂。使用氧化银，碳酸银和乙酸银等作为颗粒状银化合物。乙二醇，二乙二醇和乙二醇二乙酸酯等用作还原剂，并且使用多价酚化合物，酚醛树脂，醇酸树脂或聚酯树脂等热固性树脂或热塑性树脂使用平均粒径为20nm〜5μm的苯乙烯树脂或聚对苯二甲酸乙二醇酯作为粘合剂。此外，颗粒状银化合物的平均粒径可以为0.01〜10μm。

6. 发明申请

US20090139748A1 WIRING SUBSTRATE 失效
标题翻译：接线基板
公开(公告)号：US20090139748A1
公开(公告)日：2009-06-04
申请号：US12324516
申请日：2008-11-26
申请人： Shuzo HIRATA , Akinobu Ono
发明人： Shuzo HIRATA , Akinobu Ono
IPC分类号： H05K1/00
CPC分类号： H05K1/117 , H05K1/095 , H05K3/247 , H05K3/28 , H05K2201/035 , H05K2201/0769 , H05K2201/09436 , H05K2201/09709
摘要： A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.
摘要翻译：布线基板设置有基板，形成在基板的表面上的导电电路以及覆盖导电电路的绝缘层。在布线基板的配合部分中，绝缘层形成有一个开口部分，一部分导电电路通过该开口部分露出或显示为暴露表面。在导电电路的暴露表面上形成由导电构件制成的电极层。电极层的底面与导电电路连接。电极层的上表面在导电电路的布线的宽度方向W上延伸，以覆盖绝缘层的一部分。

7. 发明授权

US08222536B2 Wiring substrate 失效
标题翻译：接线基板
公开(公告)号：US08222536B2
公开(公告)日：2012-07-17
申请号：US12324516
申请日：2008-11-26
申请人： Shuzo Hirata , Akinobu Ono
发明人： Shuzo Hirata , Akinobu Ono
IPC分类号： H05K1/11
CPC分类号： H05K1/117 , H05K1/095 , H05K3/247 , H05K3/28 , H05K2201/035 , H05K2201/0769 , H05K2201/09436 , H05K2201/09709
摘要： A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.
摘要翻译：布线基板设置有基板，形成在基板的表面上的导电电路以及覆盖导电电路的绝缘层。在布线基板的配合部分中，绝缘层形成有一个开口部分，一部分导电电路通过该开口部分露出或显示为暴露表面。在导电电路的暴露表面上形成由导电构件制成的电极层。电极层的底面与导电电路连接。电极层的上表面在导电电路的布线的宽度方向W上延伸，以覆盖绝缘层的一部分。

8. 发明授权

US4861559A Continuous sterilizing and packing apparatus 失效
标题翻译：连续灭菌包装设备
公开(公告)号：US4861559A
公开(公告)日：1989-08-29
申请号：US942376
申请日：1986-12-16
申请人： Ko Sugisawa , Kazuya Sekiguchi , Kiyoaki Tuji , Akinobu Ono
发明人： Ko Sugisawa , Kazuya Sekiguchi , Kiyoaki Tuji , Akinobu Ono
IPC分类号： B65B55/04 , A23L3/18 , A61L2/00 , B65B3/00 , B65B3/14 , B65B55/14
CPC分类号： A23L3/18 , B65B3/14 , B65B55/14
摘要： An apparatus for continuously sterilizes and fills food and medicines containing solids. In this apparatus, a filler nozzle is disposed downstream of a back-pressure tank, and a control valve is interposed between the back-pressure tank and the filler nozzle for controlling the flow rate of the products which are delivered from the sterilizer to the back-pressure tank. The control valve avoids a remarkable pressure loss which might otherwise be invited in the series passages of the apparatus. The outflow of air from the back pressure tank to the filler nozzle is minimized so that the back pressure can be applied to the sterilizer as stably as possible. At the same time, the sterilized products are continuously fed to the filler nozzle so that they can be packed simultaneously with their upstream sterilization.
摘要翻译：用于连续消毒和填充含有固体的食品和药物的装置。在该装置中，在背压罐的下游配置有填充喷嘴，并且在背压罐和填充喷嘴之间配置有控制阀，用于控制从灭菌器向背部输送的产品的流量压力罐。控制阀避免了可能会在设备的串联通道中引起明显的压力损失。将空气从背压罐流出到填充喷嘴的流量最小化，使得背压可以尽可能稳定地施加到灭菌器。同时，将灭菌的产品连续地供给到填充喷嘴，使得它们可以与其上游灭菌同时进行包装。

9. 发明授权

US4597945A Sterilization apparatus 失效
标题翻译：灭菌装置
公开(公告)号：US4597945A
公开(公告)日：1986-07-01
申请号：US587368
申请日：1984-03-08
申请人： Ko Sugisawa , Kazuya Sekiguchi , Kiyoaki Tsuzi , Akinobu Ono
发明人： Ko Sugisawa , Kazuya Sekiguchi , Kiyoaki Tsuzi , Akinobu Ono
IPC分类号： A23L3/18 , A61L2/06 , B65B55/14 , G05D16/00
CPC分类号： A61L2/06 , A23L3/185 , B65B55/14
摘要： A sterilization apparatus suitable for sterilizing food and medicines containing solid particles, which comprises a forcing device, a sterilizer, a backpressure tank and a backpressure device. The sterilization apparatus is sterilized beforehand under application of a backpressure by employing the forcing device and the backpressure device. The products are sterilized in the sterilizer under pressure by the forcing device and the backpressure tank, and then the sterilized products are collected in the backpressure tank.
摘要翻译：一种灭菌装置，适用于对包含强制装置，灭菌器，背压罐和背压装置的含有固体颗粒的食品和药物进行杀菌。通过使用强制装置和背压装置，在应用背压下预先对灭菌装置进行灭菌。产品在压力下通过强制装置和背压罐在灭菌器中灭菌，然后将无菌产品收集在背压罐中。

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