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1. 发明申请

US20050272202A1 Random access memory 审中-公开
标题翻译：随机存取存储器
公开(公告)号：US20050272202A1
公开(公告)日：2005-12-08
申请号：US11189860
申请日：2005-07-25
申请人： Kirk Prall , Robert Kerr , Christopher Murphy , D. Durcan
发明人： Kirk Prall , Robert Kerr , Christopher Murphy , D. Durcan
IPC分类号： H01L21/02 , H01L21/8242 , H01L27/108
CPC分类号： H01L27/10852 , H01L27/10811 , H01L27/10817 , H01L27/10855 , H01L27/10873 , H01L28/91
摘要： A process for enhancing refresh in Dynamic Random Access Memories wherein n-type impurities are implanted into the capacitor buried contact after formation of the access transistor components. The process comprises forming a gate insulating layer on a substrate and a transistor gate electrode on the gate insulating layer. First and second transistor source/drain regions are formed on the substrate adjacent to opposite sides of the gate electrodes. N-type impurities, preferably phosphorous atoms, are then implanted into the first source/drain region which will serve as the capacitor buried contact.
摘要翻译：一种用于增强动态随机存取存储器中的刷新的过程，其中在形成存取晶体管部件之后，将n型杂质注入到电容器埋入接触中。该工艺包括在衬底上形成栅极绝缘层，在栅极绝缘层上形成晶体管栅电极。第一和第二晶体管源极/漏极区域形成在与栅电极的相对侧相邻的衬底上。然后将N型杂质（优选磷原子）注入到用作电容器掩埋接触的第一源极/漏极区域中。

2. 发明申请

US20060211211A1 Methods of forming pluralities of capacitors 有权
公开(公告)号：US20060211211A1
公开(公告)日：2006-09-21
申请号：US11083489
申请日：2005-03-18
申请人： Gurtej Sandhu , D. Durcan
发明人： Gurtej Sandhu , D. Durcan
IPC分类号： H01L21/20
CPC分类号： H01L28/90 , H01L27/0805 , Y10T29/43
摘要： The invention includes methods of forming pluralities of capacitors. In one implementation, a method of forming a plurality of capacitors includes providing a plurality of capacitor electrodes within a capacitor array area over a substrate. The capacitor electrodes comprise outer lateral sidewalls. The plurality of capacitor electrodes is supported at least in part with a retaining structure which engages the outer lateral sidewalls. The retaining structure is formed at least in part by etching a layer of material which is not masked anywhere within the capacitor array area to form said retaining structure. The plurality of capacitor electrodes is incorporated into a plurality of capacitors. Other aspects and implementations are contemplated.

3. 发明申请

US20070018342A1 Devices with nanocrystals and methods of formation 有权
标题翻译：具有纳米晶体和形成方法的器件
公开(公告)号：US20070018342A1
公开(公告)日：2007-01-25
申请号：US11185113
申请日：2005-07-20
申请人： Gurtej Sandhu , D. Durcan
发明人： Gurtej Sandhu , D. Durcan
IPC分类号： H01L21/336
CPC分类号： H01L29/66825 , B82Y10/00 , H01L21/28273 , H01L29/42332 , Y10S438/962
摘要： An aspect relates to a method of growing nanoscale structures on a semiconductor substrate. According to various embodiments, nucleation sites are created on a surface of the substrate. The creation of the nucleation sites includes implanting ions with an energy and a dose selected to provide a controllable distribution of the nucleation sites across the surface of the substrate. Nanoscale structures are grown using the controllable distribution of nucleation sites to seed the growth of the nanoscale structures. According to various embodiments, the nanoscale structures include at least one of nanocrystals, nanowires and nanotubes. According to various nanocrystal embodiments, the nanocrystals are positioned within a gate stack and function as a floating gate for a nonvolatile device. Other aspects and embodiments are provided herein.
摘要翻译：一个方面涉及在半导体衬底上生长纳米尺度结构的方法。根据各种实施方案，在基材的表面上形成成核位点。成核位点的产生包括用选择的能量和剂量植入离子，以提供成核位点跨衬底表面的可控分布。使用成核位点的可控分布来生长纳米结构以使纳米尺度结构的生长进行种子生长。根据各种实施方案，纳米尺度结构包括纳米晶体，纳米线和纳米管中的至少一种。根据各种纳米晶体实施例，纳米晶体位于栅极堆叠内并用作非易失性器件的浮动栅极。本文提供了其它方面和实施例。

4. 发明申请

US20060077704A1 Integrated circuit including sensor to sense environmental data, and system for testing 有权
标题翻译：集成电路包括感应环境数据的传感器，以及用于测试的系统
公开(公告)号：US20060077704A1
公开(公告)日：2006-04-13
申请号：US11286918
申请日：2005-11-23
申请人： Mark Tuttle , D. Durcan
发明人： Mark Tuttle , D. Durcan
IPC分类号： G11C11/00
CPC分类号： G11C11/16 , G11C29/02 , G11C29/028 , G11C2029/5006
摘要： An integrated circuit includes operational circuitry; a sensor configured to sense an environmental parameter; and adjustment circuitry coupled to the sensor and to the operational circuitry and configured to affect the operational circuitry to at least partially counteract the effects of the environmental parameter. A method of testing an integrated circuit includes supporting a sensor in the integrated circuit and using the sensor to sense environmental data.
摘要翻译：集成电路包括操作电路; 被配置为感测环境参数的传感器; 以及耦合到所述传感器和所述操作电路并被配置为影响所述操作电路以至少部分抵消所述环境参数的影响的调节电路。一种测试集成电路的方法包括在集成电路中支持传感器，并使用传感器来感测环境数据。

5. 发明申请

US20070032035A1 Container capacitor structure and method of formation thereof 失效
公开(公告)号：US20070032035A1
公开(公告)日：2007-02-08
申请号：US11545252
申请日：2006-10-10
申请人： D. Durcan , Trung Doan , Roger Lee , Fernando Gonzalez , Er-Xuan Ping
发明人： D. Durcan , Trung Doan , Roger Lee , Fernando Gonzalez , Er-Xuan Ping
IPC分类号： H01L21/20
CPC分类号： H01L28/91 , H01L27/10811 , H01L27/10817 , H01L27/10852 , H01L27/10888 , H01L28/65 , Y10S257/905
摘要： Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of electrode (“bottom electrodes”) of the container capacitor structure. The etch provides a recess between proximal pairs of container capacitor structures, which recess is available for forming additional capacitance. Accordingly, a capacitor dielectric and a top electrode are formed on and adjacent to, respectively, both an interior surface and portions of the exterior surface of the first electrode. Advantageously, surface area common to both the first electrode and second electrodes is increased over using only the interior surface, which provides additional capacitance without a decrease in spacing for clearing portions of the capacitor dielectric and the second electrode away from a contact hole location. Furthermore, such clearing of the capacitor dielectric and the second electrode portions may be done at an upper location of a substrate assembly in contrast to clearing at a bottom location of a contact via.

6. 发明申请

US20060262511A1 Method for integrated circuit fabrication using pitch multiplication 失效
公开(公告)号：US20060262511A1
公开(公告)日：2006-11-23
申请号：US11492513
申请日：2006-07-24
申请人： Mirzafer Abatchev , Gurtej Sandhu , Luan Tran , William Rericha , D. Durcan
发明人： Mirzafer Abatchev , Gurtej Sandhu , Luan Tran , William Rericha , D. Durcan
IPC分类号： H05K1/11
CPC分类号： H01L21/0337 , H01L21/0332 , H01L21/0338 , H01L21/3081 , H01L21/3086 , H01L21/3088 , H01L21/31144 , H01L21/32139 , Y10S438/947 , Y10S438/95
摘要： Different sized features in the array and in the periphery of an integrated circuit are patterned on a substrate in a single step. In particular, a mixed pattern, combining two separately formed patterns, is formed on a single mask layer and then transferred to the underlying substrate. The first of the separately formed patterns is formed by pitch multiplication and the second of the separately formed patterns is formed by conventional photolithography. The first of the separately formed patterns includes lines that are below the resolution of the photolithographic process used to form the second of the separately formed patterns. These lines are made by forming a pattern on photoresist and then etching that pattern into an amorphous carbon layer. Sidewall pacers having widths less than the widths of the un-etched parts of the amorphous carbon are formed on the sidewalls of the amorphous carbon. The amorphous carbon is then removed, leaving behind the sidewall spacers as a mask pattern. Thus, the spacers form a mask having feature sizes less than the resolution of the photolithography process used to form the pattern on the photoresist. A protective material is deposited around the spacers. The spacers are further protected using a hard mask and then photoresist is formed and patterned over the hard mask. The photoresist pattern is transferred through the hard mask to the protective material. The pattern made out by the spacers and the temporary material is then transferred to an underlying amorphous carbon hard mask layer. The pattern, having features of difference sizes, is then transferred to the underlying substrate.

7. 发明申请

US20060006445A1 Container capacitor structure and method of formation thereof 失效
公开(公告)号：US20060006445A1
公开(公告)日：2006-01-12
申请号：US11217742
申请日：2005-09-01
申请人： D. Durcan , Trung Doan , Roger Lee , Fernando Gonzalez , Er-Xuan Ping
发明人： D. Durcan , Trung Doan , Roger Lee , Fernando Gonzalez , Er-Xuan Ping
IPC分类号： H01L27/108
CPC分类号： H01L28/91 , H01L27/10811 , H01L27/10817 , H01L27/10852 , H01L27/10888 , H01L28/65 , Y10S257/905
摘要： Container capacitor structure and method of construction. An etch mask and etch are used to expose portions of an exterior surface of an electrode (“bottom electrodes”) of the structure. The etch provides a recess between proximal pairs of container capacitor structures, which is available for forming additional capacitance. A capacitor dielectric and top electrode are formed on and adjacent to, respectively, both an interior surface and portions of the exterior surface of the first electrode. Surface area common to both the first electrode and second electrodes is increased over using only the interior surface, providing additional capacitance without decreasing spacing for clearing portions of the capacitor dielectric and the second electrode away from a contact hole location. Clearing of the capacitor dielectric and the second electrode portions may be done at an upper location of a substrate assembly in contrast to clearing at a bottom location of a contact via.

8. 发明申请

US20070161251A1 PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES 失效
标题翻译：相对于光刻特征的PITCH减少图案
公开(公告)号：US20070161251A1
公开(公告)日：2007-07-12
申请号：US11681027
申请日：2007-03-01
申请人： Luan Tran , William Rericha , John Lee , Ramakanth Alapati , Sheron Honarkhah , Shuang Meng , Puneet Sharma , Jingyi Bai , Zhiping Yin , Paul Morgan , Mirzafer Abatchev , Gurtej Sandhu , D. Durcan
发明人： Luan Tran , William Rericha , John Lee , Ramakanth Alapati , Sheron Honarkhah , Shuang Meng , Puneet Sharma , Jingyi Bai , Zhiping Yin , Paul Morgan , Mirzafer Abatchev , Gurtej Sandhu , D. Durcan
IPC分类号： H01L21/302
CPC分类号： H01L21/0338 , H01L21/0337 , H01L21/3086 , H01L21/3088
摘要： Differently-sized features of an integrated circuit are formed by etching a substrate using a mask which is formed by combining two separately formed patterns. Pitch multiplication is used to form the relatively small features of the first pattern and conventional photolithography used to form the relatively large features of the second pattern. Pitch multiplication is accomplished by patterning a photoresist and then etching that pattern into an amorphous carbon layer. Sidewall spacers are then formed on the sidewalls of the amorphous carbon. The amorphous carbon is removed, leaving behind the sidewall spacers, which define the first mask pattern. A bottom anti-reflective coating (BARC) is then deposited around the spacers to form a planar surface and a photoresist layer is formed over the BARC. The photoresist is next patterned by conventional photolithography to form the second pattern, which is then is transferred to the BARC. The combined pattern made out by the first pattern and the second pattern is transferred to an underlying amorphous silicon layer and the pattern is subjected to a carbon strip to remove BARC and photoresist material. The combined pattern is then transferred to the silicon oxide layer and then to an amorphous carbon mask layer. The combined mask pattern, having features of difference sizes, is then etched into the underlying substrate through the amorphous carbon hard mask layer.
摘要翻译：通过使用通过组合两个单独形成的图案形成的掩模蚀刻衬底来形成集成电路的不同尺寸的特征。间距乘法用于形成第一图案的相对较小的特征以及用于形成第二图案的较大特征的常规光刻。间距倍增通过对光致抗蚀剂进行图案化，然后将该图案蚀刻成无定形碳层来实现。然后在无定形碳的侧壁上形成侧壁间隔物。去除无定形碳，留下限定第一掩模图案的侧壁间隔物。然后将底部抗反射涂层（BARC）沉积在间隔物周围以形成平坦表面，并且在BARC上形成光致抗蚀剂层。接下来通过常规光刻法将光致抗蚀剂图案化以形成第二图案，然后将其转印到BARC。通过第一图案和第二图案形成的组合图案被转印到下面的非晶硅层，并且图案经受碳带以去除BARC和光致抗蚀剂材料。然后将组合图案转移到氧化硅层，然后转移到无定形碳掩模层。具有不同尺寸特征的组合掩模图案然后通过无定形碳硬掩模层蚀刻到下面的衬底中。

9. 发明申请

US20070148984A1 METHOD FOR INTEGRATED CIRCUIT FABRICATION USING PITCH MULTIPLICATION 失效
标题翻译：使用PITCH MULTIPLICATION的集成电路制造方法
公开(公告)号：US20070148984A1
公开(公告)日：2007-06-28
申请号：US11683518
申请日：2007-03-08
申请人： Mirzafer Abatchev , Gurtej Sandhu , Luan Tran , William Rericha , D. Durcan
发明人： Mirzafer Abatchev , Gurtej Sandhu , Luan Tran , William Rericha , D. Durcan
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/0337 , H01L21/0332 , H01L21/0338 , H01L21/3081 , H01L21/3086 , H01L21/3088 , H01L21/31144 , H01L21/32139 , Y10S438/947 , Y10S438/95
摘要： Different sized features in the array and in the periphery of an integrated circuit are patterned on a substrate in a single step. In particular, a mixed pattern, combining two separately formed patterns, is formed on a single mask layer and then transferred to the underlying substrate. The first of the separately formed patterns is formed by pitch multiplication and the second of the separately formed patterns is formed by conventional photolithography. The first of the separately formed patterns includes lines that are below the resolution of the photolithographic process used to form the second of the separately formed patterns. These lines are made by forming a pattern on photoresist and then etching that pattern into an amorphous carbon layer. Sidewall pacers having widths less than the widths of the un-etched parts of the amorphous carbon are formed on the sidewalls of the amorphous carbon. The amorphous carbon is then removed, leaving behind the sidewall spacers as a mask pattern. Thus, the spacers form a mask having feature sizes less than the resolution of the photolithography process used to form the pattern on the photoresist. A protective material is deposited around the spacers. The spacers are further protected using a hard mask and then photoresist is formed and patterned over the hard mask. The photoresist pattern is transferred through the hard mask to the protective material. The pattern made out by the spacers and the temporary material is then transferred to an underlying amorphous carbon hard mask layer. The pattern, having features of difference sizes, is then transferred to the underlying substrate.
摘要翻译：集成电路的阵列和周边中的不同尺寸的特征在单个步骤中在衬底上图案化。特别地，组合两个单独形成的图案的混合图案形成在单个掩模层上，然后转移到下面的基底。单独形成的图案中的第一个通过间距倍增形成，并且通过常规光刻形成第二个单独形成的图案。单独形成的图案中的第一个包括低于用于形成第二个单独形成的图案的光刻工艺的分辨率的线。这些线通过在光致抗蚀剂上形成图案然后将该图案刻蚀成无定形碳层而制成。在无定形碳的侧壁上形成宽度小于无定形碳的未蚀刻部分的宽度的侧壁盘。然后去除无定形碳，留下侧壁间隔物作为掩模图案。因此，间隔物形成具有小于用于在光致抗蚀剂上形成图案的光刻工艺的分辨率的特征尺寸的掩模。保护材料沉积在间隔物周围。使用硬掩模进一步保护间隔物，然后在硬掩模上形成并图案化光致抗蚀剂。光致抗蚀剂图案通过硬掩模转印到保护材料上。然后将由间隔物和临时材料制成的图案转移到下面的无定形碳硬掩模层。具有不同尺寸特征的图案然后被转移到下面的基底。

10. 发明申请

US20060211260A1 Pitch reduced patterns relative to photolithography features 有权
标题翻译：相对于光刻特征的间距减小
公开(公告)号：US20060211260A1
公开(公告)日：2006-09-21
申请号：US11214544
申请日：2005-08-29
申请人： Luan Tran , William Rericha , John Lee , Ramakanth Alapati , Sheron Honarkhah , Shuang Meng , Puneet Sharma , Jingyi (Jenny) Bai , Zhiping Yin , Paul Morgan , Mirzafer Abatchev , Gurtej Sandhu , D. Durcan
发明人： Luan Tran , William Rericha , John Lee , Ramakanth Alapati , Sheron Honarkhah , Shuang Meng , Puneet Sharma , Jingyi (Jenny) Bai , Zhiping Yin , Paul Morgan , Mirzafer Abatchev , Gurtej Sandhu , D. Durcan
IPC分类号： H01L21/31
CPC分类号： H01L21/0338 , H01L21/0337 , H01L21/3086 , H01L21/3088
摘要： Differently-sized features of an integrated circuit are formed by etching a substrate using a mask which is formed by combining two separately formed patterns. Pitch multiplication is used to form the relatively small features of the first pattern and conventional photolithography used to form the relatively large features of the second pattern. Pitch multiplication is accomplished by patterning a photoresist and then etching that pattern into an amorphous carbon layer. Sidewall spacers are then formed on the sidewalls of the amorphous carbon. The amorphous carbon is removed, leaving behind the sidewall spacers, which define the first mask pattern. A bottom anti-reflective coating (BARC) is then deposited around the spacers to form a planar surface and a photoresist layer is formed over the BARC. The photoresist is next patterned by conventional photolithography to form the second pattern, which is then is transferred to the BARC. The combined pattern made out by the first pattern and the second pattern is transferred to an underlying amorphous silicon layer and the pattern is subjected to a carbon strip to remove BARC and photoresist material. The combined pattern is then transferred to the silicon oxide layer and then to an amorphous carbon mask layer. The combined mask pattern, having features of difference sizes, is then etched into the underlying substrate through the amorphous carbon hard mask layer.
摘要翻译：通过使用通过组合两个单独形成的图案形成的掩模蚀刻衬底来形成集成电路的不同尺寸的特征。间距乘法用于形成第一图案的相对较小的特征以及用于形成第二图案的较大特征的常规光刻。间距倍增通过对光致抗蚀剂进行图案化，然后将该图案蚀刻成无定形碳层来实现。然后在无定形碳的侧壁上形成侧壁间隔物。去除无定形碳，留下限定第一掩模图案的侧壁间隔物。然后将底部抗反射涂层（BARC）沉积在间隔物周围以形成平坦表面，并且在BARC上形成光致抗蚀剂层。接下来通过常规光刻法将光致抗蚀剂图案化以形成第二图案，然后将其转印到BARC。通过第一图案和第二图案形成的组合图案被转印到下面的非晶硅层，并且图案经受碳带以去除BARC和光致抗蚀剂材料。然后将组合图案转移到氧化硅层，然后转移到无定形碳掩模层。具有不同尺寸特征的组合掩模图案然后通过无定形碳硬掩模层蚀刻到下面的衬底中。

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