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    • 1. 发明授权
    • Method for forming barrier and seed layer
    • 形成屏障和种子层的方法
    • US06489231B1
    • 2002-12-03
    • US09907424
    • 2001-07-17
    • Kiran KumarZhihai WangWilbur G. Gatabay
    • Kiran KumarZhihai WangWilbur G. Gatabay
    • H01L214763
    • H01L21/76873H01L21/2652H01L21/28247H01L21/2855H01L21/3144H01L21/31662H01L21/3211H01L21/76843H01L21/76877H01L29/6659
    • A method for creating a highly reflective surface on an electroplated conduction layer. A barrier layer is deposited on a substrate using a self ionized plasma deposition process. The barrier layer has a thickness of no more than about one hundred angstroms. An adhesion layer is deposited on the barrier layer, using a self ionized plasma deposition process. A seed layer is deposited on the adhesion layer, also using a self ionized plasma deposition process, at a bias of no less than about one hundred and fifty watts. The combination of the barrier layer, adhesion layer, and seed layer is at times referred to herein as the barrier seed layer. The conduction layer is electroplated on the seed layer, thereby forming the highly reflective surface on the conduction layer, where the highly reflective surface has a reflectance of greater than about seventy percent.
    • 一种在电镀导电层上形成高反射面的方法。 使用自电离等离子体沉积工艺在衬底上沉积阻挡层。 阻挡层的厚度不大于约一百埃。 使用自电离等离子体沉积工艺在阻挡层上沉积粘附层。 种子层沉积在粘附层上,也使用自电离等离子体沉积工艺,偏压不小于约一百五十瓦。 阻挡层,粘合层和种子层的组合在本文中有时被称为阻挡种子层。 将导电层电镀在种子层上,由此在导电层上形成高反射表面,其中高反射表面的反射率大于约百分之七十。
    • 3. 发明授权
    • Substrate processing system
    • US06518193B1
    • 2003-02-11
    • US09802424
    • 2001-03-09
    • Kiran KumarZhihai WangRudy RiosWilbur G. CatabayRichard D. Schinella
    • Kiran KumarZhihai WangRudy RiosWilbur G. CatabayRichard D. Schinella
    • H01L21302
    • H01L21/67167C23C14/566C23C16/4401H01L21/67017H01L21/67201H01L21/76802H01L21/76843
    • An apparatus for performing contaminant sensitive processing on a substrate. A substrate load chamber receives the substrate from an ambient contaminant laden environment, and isolates the substrate from the ambient contaminant laden environment. The substrate load chamber further forms a first environment of intermediate cleanliness around the substrate. A substrate pass through chamber receives the substrate from the substrate load chamber, and isolates the substrate from the intermediate cleanliness of the first environment of the substrate load chamber. The substrate pass through chamber further forms a second environment of high cleanliness around the substrate. A substrate transfer chamber receives the substrate from the substrate pass through chamber, and isolates the substrate from the high cleanliness of the second environment of the substrate pass through chamber. The substrate transfer chamber maintains a third environment of high cleanliness around the substrate, and transfers the substrate into more than one substrate processing chambers, where the substrate is selectively transferred into and out of the more than one substrate processing chambers without leaving the high cleanliness of the third environment. The substrate transfer chamber also selectively passes the substrate to the substrate pass through chamber when the substrate pass through chamber has formed the high cleanliness of the second environment. The substrate pass through chamber also receives the substrate from the substrate transfer chamber, and selectively passes the substrate to the substrate load chamber when the substrate load chamber has formed the intermediate cleanliness of the first environment. The substrate load chamber receives the substrate from the substrate pass through chamber, and selectively passes the substrate out of the substrate load chamber and into the ambient contaminant laden environment when the substrate load chamber is not open to the substrate pass through chamber.
    • 8. 发明申请
    • METHOD AND APPARATUS FOR PROVISIONING A PRICE-DIFFERENTIATED PRODUCT WHILE DETERRING PIRACY
    • 用于提供定价产品的方法和装置
    • US20140067502A1
    • 2014-03-06
    • US13599561
    • 2012-08-30
    • Sanjeev Kumar BiswasKiran KumarSuraj RanjanMayank GoyalAnubhav MalhotraPritom Baruah
    • Sanjeev Kumar BiswasKiran KumarSuraj RanjanMayank GoyalAnubhav MalhotraPritom Baruah
    • G06Q30/02G06Q30/06
    • G06Q30/0607
    • A method and apparatus for provisioning price-differentiated products while deterring piracy comprising creating a plurality of triples, wherein each triple comprises a first component, a second component, and a third component, wherein each triple uniquely identifies a price-differentiated product; providing to a vendor of the product a plurality of pairs, wherein each pair in the plurality of pairs comprises the first component and the second component of the triple for each price-differentiated product provided to the vendor; receiving the pair from the vendor when the product is sold; providing to a purchaser identification verifier the pair for the product that was sold; receiving from the purchaser identification verifier the second component of the triple upon verification of an identity of a purchaser; and providing product activation information to the identity verified purchaser in response to receiving the second component, wherein the activation information enables use of the product.
    • 一种用于在抑制盗版的同时提供价格差异化产品的方法和装置,包括创建多个三元组,其中每个三元组包括第一组件,第二组件和第三组件,其中每个三元组唯一地标识价格差异化产品; 向所述产品的供应商提供多对,其中所述多对中的每对对包括提供给所述供应商的每个价格差异化产品的所述三元组的第一组件和所述第三组件; 当产品销售时从供应商那里收到货物; 向购买者身份验证者提供销售产品的配对; 在购买者的身份验证后,从购买者身份验证者接收三重物品的第二部分; 以及响应于接收到所述第二组件向所述身份验证的购买者提供产品激活信息,其中所述激活信息使得能够使用所述产品。
    • 9. 发明申请
    • TECHNIQUES TO ACHIEVE ZERO ROAMING TIME FOR WORKGROUP BRIDGE DEVICES
    • 为工作组桥设备实现零滚动时间的技术
    • US20130148641A1
    • 2013-06-13
    • US13323955
    • 2011-12-13
    • Sidhananda Karthikeyan SivaprakasamJavier Contreras AlbesaKiran Kumar
    • Sidhananda Karthikeyan SivaprakasamJavier Contreras AlbesaKiran Kumar
    • H04W84/12
    • H04W36/30H04W84/12
    • Techniques are provided for providing seamless wireless communication services to client devices associated with an roaming workgroup bridge device to enable wireless communications between the client devices and a network using a first radio transceiver unit in communication with a first root access point device that provides connectivity to the network. The workgroup bridge device scans a frequency band to detect a second wireless root access point device using a second radio transceiver unit. Signal strength values of signals received by the first radio transceiver unit are compared to a threshold signal strength value. When the signal strength of the received signals is below the threshold, communication services are provided to the client devices using the second radio transceiver unit in communication with the second root access point device. Communications between the client devices and the first root access point device are then terminated.
    • 提供技术用于向与漫游工作组桥接设备相关联的客户端设备提供无缝无线通信服务,以实现客户设备之间的无线通信,以及使用与第一根接入点设备通信的第一无线电收发器单元的网络,该第一无线电收发器单元提供与 网络。 工作组桥接设备使用第二无线电收发器单元扫描频带以检测第二无线根接入点设备。 将由第一无线电收发器单元接收的信号的信号强度值与阈值信号强度值进行比较。 当接收到的信号的信号强度低于阈值时,使用与第二根接入点设备进行通信的第二无线电收发单元向客户端设备提供通信服务。 然后终止客户端设备和第一根接入点设备之间的通信。
    • 10. 发明授权
    • Apparatus and method for electrical determination of delamination at one
or more interfaces within a semiconductor wafer
    • 用于在半导体晶片内的一个或多个界面处电分离的电测定装置和方法
    • US6066561A
    • 2000-05-23
    • US995260
    • 1997-12-19
    • Kiran KumarDavid J. Heine
    • Kiran KumarDavid J. Heine
    • H01L21/66H01L21/00
    • H01L22/12
    • An apparatus and method are presented for electrically determining whether delamination has occurred at one or more interfaces within a semiconductor wafer. The semiconductor wafer includes a test structure formed within dielectric layers upon an upper surface of a semiconductor substrate. The test structure includes an electrically conductive structure, a pair of electrically conductive contact plugs, and a probe pad. The conductive structure is formed within an opening in a first dielectric layer, and is in electrical contact with the upper surface of the semiconductor substrate. The conductive structure is preferably made up of the same vertical stack of layers of selected electrically conductive materials used to form interconnects within the semiconductor wafer. A second dielectric layer if formed over the first dielectric layer and the conductive structure. The pair of electrically conductive contact plugs extend vertically through respective holes in the second dielectric layer. An electrically conductive probe pad is formed upon an upper surface of the second dielectric layer and extends between the pair of contact plugs. Each contact plug is in electrical contact with the probe pad and the electrically conductive structure. During testing, a probe of a measurement device is brought into contact with the probe pad. The measurement device measures the electrical resistance and/or reactance between the probe pad and the semiconductor substrate. The resulting resistance and/or reactance measurement may be compared to an expected resistance and/or reactance value to determine if delamination has occurred at one or more interfaces within the semiconductor wafer.
    • 提出了用于电学确定半导体晶片内的一个或多个界面是否发生分层的装置和方法。 半导体晶片包括在半导体衬底的上表面上的电介质层内形成的测试结构。 测试结构包括导电结构,一对导电接触插塞和探针垫。 导电结构形成在第一电介质层的开口内,与半导体衬底的上表面电接触。 导电结构优选地由用于在半导体晶片内形成互连的所选择的导电材料的相同的垂直堆叠堆叠构成。 如果形成在第一介电层和导电结构上的第二介电层。 一对导电接触插塞通过第二电介质层中的相应孔垂直延伸。 导电探针垫形成在第二电介质层的上表面上并在该对接触插塞之间延伸。 每个接触插塞与探针垫和导电结构电接触。 在测试期间,测量装置的探针与探针垫接触。 测量装置测量探针焊盘和半导体衬底之间的电阻和/或电抗。 可以将所得到的电阻和/或电抗测量与期望的电阻和/或电抗值进行比较,以确定在半导体晶片内的一个或多个界面处是否发生分层。