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1. 发明授权

US6031067A Soluble polyimide resin and process of preparation of the same 失效
标题翻译：可溶性聚酰亚胺树脂及其制备方法
公开(公告)号：US6031067A
公开(公告)日：2000-02-29
申请号：US86387
申请日：1998-05-29
申请人： Kil-Yeong Choi , Mi-Hie Yi , Wenxi Huang
发明人： Kil-Yeong Choi , Mi-Hie Yi , Wenxi Huang
IPC分类号： C08G73/00 , C08G73/10 , C08G69/26
CPC分类号： C08G73/10
摘要： The invention herein relates to a soluble polyimide resin and the process of preparation of the same, wherein aromatic tetracarboxylic dianhydride and aromatic diamine having an alicyclic group with various structures of substituted alkyl groups are used to yield a novel form of a polyimide resin, which has superior heat-resistance, solubility and transparency.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance and solubility, which is prepared by means of reacting aromatic diamine monomers having a novel chemical structure with various types of aromatic tetracarboxilic acid dianhydrides, in stead of aromatic diamine used for the preparation of the conventional polyimide resin. As a result, the polymers so obtained had the glass transition temperature of 250.degree. C..about.400.degree. C. and showed a increase in solubility in proportion to the increase in volume of the alkyl group. Further, the polymers herein showed superior solubility at room temperature in various types of organic solvents, e.g., THF.
摘要翻译：本发明涉及一种可溶性聚酰亚胺树脂及其制备方法，其中使用芳族四羧酸二酐和具有各种取代烷基结构的脂环族基团的芳族二胺以产生新型的聚酰亚胺树脂，其具有优异的耐热性，溶解性和透明度。更具体地说，本发明涉及具有优异的耐热性和溶解性的新型聚酰亚胺树脂，其通过使具有新型化学结构的芳族二胺单体与各种类型的芳族四羧酸二酐反应而制备，而不是使用芳族二胺用于制备常规的聚酰亚胺树脂。结果，如此获得的聚合物的玻璃化转变温度为250℃，差异为400℃，并且与烷基体积的增加成比例地显示出溶解度增加。此外，本文的聚合物在各种类型的有机溶剂例如THF中在室温下表现出优异的溶解度。

2. 发明授权

US06162893A Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof 失效
标题翻译：具有用于液晶取向层的二烷基取代基的可溶性聚酰亚胺树脂，其单体及其制造方法
公开(公告)号：US06162893A
公开(公告)日：2000-12-19
申请号：US138377
申请日：1998-08-24
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jae-Geun Park , Dae-Woo Ihm
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jae-Geun Park , Dae-Woo Ihm
IPC分类号： C08G73/10 , G02F1/1337 , A61K38/17
CPC分类号： C08G73/1078 , C08G73/1039 , C08G73/1067 , C08G73/1071 , G02F1/133723
摘要： The invention herein relates to a soluble polyimide resin having a dialkyl substituent for a liquid alignment layer, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having a dialkyl substituent are used to yield said soluble polyimide resin which has superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity. According to the present invention, the soluble polyimide polymer having a dialkyl substituent, for a liquid crystal alignment layer, comprising the following a repetitive unit of formula 1: ##STR1## Consequently, the polyimide resin under the present invention not only has superior heat-resistance but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring a low temperature processing. Further, the invention has the effects of providing a polyimide resin with superior physical property for heat-resistance structural material, and the monomer therein, in addition to the manufacturing methods thereof.
摘要翻译：本发明涉及具有用于液体取向层的二烷基取代基的可溶性聚酰亚胺树脂，其中使用具有二烷基取代基的脂族四羧酸二酐和芳族二胺，得到所述可溶性聚酰亚胺树脂，其具有优异的耐热性，溶解性，透明性和液晶对准能力。根据本发明，用于液晶取向层的具有二烷基取代基的可溶性聚酰亚胺聚合物包含以下式1的重复单元：因此，本发明的聚酰亚胺树脂不仅具有优异的耐热性，而且优异的溶解性和透明性，其可以用作需要低温加工的TFT-LCD的液晶取向层。此外，除了其制造方法之外，本发明还具有提供对耐热结构材料及其单体具有优异物理性质的聚酰亚胺树脂的效果。

3. 发明授权

US5241037A Nadimide-terminated polyarylates and cured polyarylate resins 失效
标题翻译： NADIM封端的多元醇酯和固化的聚氨酯树脂
公开(公告)号：US5241037A
公开(公告)日：1993-08-31
申请号：US909319
申请日：1992-07-06
申请人： Kil-Yeong Choi , Mi-Hie Yi , Sam-Kwon Choi
发明人： Kil-Yeong Choi , Mi-Hie Yi , Sam-Kwon Choi
IPC分类号： C08F299/04 , C08F290/00 , C08G63/19 , C08G63/195 , C08G63/20 , C08G63/52 , C08G63/685 , C08G63/88 , C08G63/91
CPC分类号： C08G63/88 , C08G63/20 , C08G63/6856
摘要： Nadimide-terminated polyarylate prepolymers having the formula (I) ##STR1## wherein n is an integer not less than 1, and cured polyarylate resins produced by thermal curing the prepolymers, and processes for producing them are disclosed.The cured polyarylate resins according to the present invention have excellent chemical resistance and high-temperature resistance as well as good mechanical properties and processability.
摘要翻译：公开了具有式（I）的N-酰亚胺封端的多芳基化合物预聚物，其中n是不小于1的整数，并且通过热固化预聚物制备的固化的聚芳酯树脂及其制备方法。根据本发明的固化的聚芳酯树脂具有优异的耐化学性和耐高温性以及良好的机械性能和加工性能。

4. 发明授权

US5824766A Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them 失效
标题翻译：聚酰胺酰胺酸树脂预聚物，由其制备的高耐热聚酰胺酰亚胺泡沫及其制备方法
公开(公告)号：US5824766A
公开(公告)日：1998-10-20
申请号：US586972
申请日：1996-01-16
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Young-Taik Hong
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Young-Taik Hong
IPC分类号： C08G73/10 , C08G73/14 , C08J9/00 , C08J9/02
CPC分类号： C08J9/02 , C08G73/14 , C08J2379/08
摘要： A polyamideamic acid resin prepolymer represented by formula A having isophorone diamine as one of monomers, ##STR1## in which k, l, m and n are integer of 1 or more, respectively, and ##EQU1## --R-- is at least one group selected from the group consisting of ##STR2## --R'-- is a cis- and trans-conformational mixture of ##STR3## high heat resistant polyamideimide foam produced therefrom, and processes for producing them are disclosed.
摘要翻译：由式A表示的具有异佛尔酮二胺作为单体之一的聚酰胺酰胺酸树脂预聚物，其中k，l，m和n分别为1以上的整数，＆lt; IMAGE＆gt;（A）＆lt; IMAGE＆gt; > -R-是至少一种选自由其制备的高耐热性聚酰胺酰亚胺泡沫的第一混合物组成的组，以及用于制备它们的方法。

5. 发明授权

US6046303A Soluble polyimide resin having alkoxy substituents and the preparation method thereof 失效
标题翻译：具有烷氧基取代基的可溶性聚酰亚胺树脂及其制备方法
公开(公告)号：US6046303A
公开(公告)日：2000-04-04
申请号：US151722
申请日：1998-09-11
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jeong-Ghi Koo , Jae-Eun Cho
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jeong-Ghi Koo , Jae-Eun Cho
IPC分类号： G02F1/1337 , C08G73/10
CPC分类号： C08G73/10 , C08G73/1042 , G02F1/133723
摘要： The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the manufacturing method thereof, wherein a mixture of aliphatic tetracarboxylic acid dianhydrides and aromatic diamine having aliphatic side chains are used to yield a soluble polyimide resin which has superior heat-resistance, solubility, surface hardness, transparency and liquid crystal alignment capacity.The soluble polyimide resin having alkoxy substituents, for a liquid crystal layer, according to the present invention, is manufactured by adding a mixture of dioxotetrahydrofuran 3-methylcyclohexene-1,2-dicarboxylic dianhydride, which is an aliphatic tetracarboxylic acid dianhydride and aromatic tetracarboxylic acid dianhydride to a mixture of aromatic diamine, and said dioxotetrahydrofuran 3-methylcyclohexene- 1,2-dicarboxylic dianhydride is used in the amount of 50 to 99 mol % to the total amount of anhydrides.The polyimide resin according to the present invention not only has superior heat-resistance and mechanical characteristics but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring difficult processing condition such as a low temperature and vigorous rubbing processing. Further, the polyimide resin may be useful as basic heat resistant structural materials for advanced industry.
摘要翻译：本发明涉及一种用于液晶取向层的可溶性聚酰亚胺树脂及其制造方法，其中使用具有脂肪族侧链的脂肪族四羧酸二酐和芳香族二胺的混合物，得到耐热性优异的可溶性聚酰亚胺树脂，溶解度，表面硬度，透明度和液晶取向能力。通过将作为脂肪族四羧酸二酐的二氧代四氢呋喃-3-甲基环己烯-1,2-二甲酸二酐和芳香族四羧酸的混合物加入本发明的液晶层中，具有烷氧基取代基的可溶性聚酰亚胺树脂二酐与芳族二胺的混合物和所述二氧四氢呋喃-3-甲基环己烯-1,2-二羧酸二酐的用量相对于酸酐总量为50〜99摩尔％。根据本发明的聚酰亚胺树脂不仅具有优异的耐热性和机械特性，而且具有优异的溶解性和透明性，其可以应用于需要难处理条件如TFT的LCD-LCD的液晶取向层，如低温和有力的摩擦加工。此外，聚酰亚胺树脂可用作先进工业的基础耐热结构材料。

6. 发明授权

US5521276A Polyamideimide resins containing isophorone diamine structures 失效
标题翻译：含有异佛尔酮二胺结构的聚酰胺酰亚胺树脂
公开(公告)号：US5521276A
公开(公告)日：1996-05-28
申请号：US263470
申请日：1994-06-22
申请人： Kil-Yeong Choi , Mi-Hie Yi , Jae-Heung Lee , Moon-Young Jin , Young-Taik Hong
发明人： Kil-Yeong Choi , Mi-Hie Yi , Jae-Heung Lee , Moon-Young Jin , Young-Taik Hong
IPC分类号： C08G73/14 , C08G75/20 , C09K21/14 , C08G73/10
CPC分类号： C08G73/14 , C08G75/20 , C09K21/14
摘要： Polyamideimide resins having the formula (I) ##STR1## in which repeating units are bound in a head to tail or head to head manner,R is at least two divalent groups selected from the group consisting of ##STR2## (cis-, trans- conformational mixture) wherein one divalent group is ##STR3## group in a PAI molecule, produced by introducing isophorone diamine into the conventional aromatic polyamideimide resins.
摘要翻译：具有式（I）的聚酰胺酰亚胺化合物（I）其中重复单元以头对尾或头对头的方式结合，R是选自由下列组成的组中的至少两个二价基团：通过将异佛尔酮二胺引入到常规芳族聚酰胺酰亚胺树脂中而产生的PAI分子中的一个二价基团为“IMAGE”（顺式 - 反式构型混合物）。

7. 发明授权

US6013760A Soluble polyimide resin for liquid crystal alignment layer and process of preparation of the same 失效
标题翻译：用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法
公开(公告)号：US6013760A
公开(公告)日：2000-01-11
申请号：US86385
申请日：1998-05-29
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Dae-Woo Ihm , Jae-Min Oh
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Dae-Woo Ihm , Jae-Min Oh
IPC分类号： C08G73/10 , G02F1/1337 , C08G69/28
CPC分类号： C08G73/10 , G02F1/133723 , Y10T428/31721
摘要： The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the process of preparation of the same, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having the amide group are used to yield a novel form of a polyimide resin having superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance, solubility, liquid crystal alignment property, and high pretilt angle, which is prepared by means of jointly using the aromatic diamine, used for the preparation of the conventional polyimide resin, and the aromatic diamine having a long alkyl chain with a substituted amide group, and reacting the same with various types of carboxylic dianhydride.
摘要翻译：本发明涉及用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法，其中使用具有酰胺基的脂族四羧酸二酐和芳族二胺以产生具有优异的耐热性的聚酰亚胺树脂的新型，电阻，溶解度，透明度和液晶取向能力。更具体地说，本发明涉及一种新型的聚酰亚胺树脂，其具有优异的耐热性，溶解性，液晶取向性和高预倾角，这是通过共同使用芳族二胺制备的，用于制备常规聚酰亚胺树脂和具有取代酰胺基的长烷基链的芳族二胺，并使其与各种羧酸二酐反应。

8. 发明授权

US5955568A Process for preparing polyamideimide resins by direct polymerization 失效
标题翻译：通过直接聚合制备聚酰胺酰亚胺树脂的方法
公开(公告)号：US5955568A
公开(公告)日：1999-09-21
申请号：US956923
申请日：1997-10-23
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
IPC分类号： C08G73/14 , C08G69/28
CPC分类号： C08G73/14
摘要： The disclosure describes a process for preparing a polyamideimide resin having high molecular weight in a simple manner wherein major problems of the prior processes such as low heat resistance and low melt flowability are improved. The process comprises condensation of an aromatic tricarboxylic acid anhydride and an aromatic diamine in a polar solvent, subjecting the resulting diimidedicarboxylic acid to acyl halogenating agent treatment to give an intermediate having good reactivity at low temperature, and then subjecting the latter to direct polymerization by using diamine as a nucleophilic agent to give a polyamideimide resin having high molecular weight. The polyamideimide resin prepared by the present invention can be used as major heat resistant structural material in advanced industries and as paint, sheet, adhesives, sliding material, fiber and film having heat resistance.
摘要翻译：本公开内容描述了以简单的方式制备具有高分子量的聚酰胺酰亚胺树脂的方法，其中诸如低耐热性和低熔融流动性的现有方法的主要问题得到改善。该方法包括在极性溶剂中将芳族三羧酸酐和芳族二胺缩合，将所得二酰亚胺二羧酸进行酰卤处理，得到在低温下具有良好反应性的中间体，然后使用后者通过使用二胺作为亲核剂，得到具有高分子量的聚酰胺酰亚胺树脂。本发明制备的聚酰胺酰亚胺树脂可用作先进工业中的主要耐热结构材料，可用作具有耐热性的油漆，片材，粘合剂，滑动材料，纤维和薄膜。

9. 发明授权

US5532334A Process for preparing polyamideimide resins having high molecular weight 失效
标题翻译：制备高分子量聚酰胺酰亚胺树脂的方法
公开(公告)号：US5532334A
公开(公告)日：1996-07-02
申请号：US339391
申请日：1994-11-14
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
IPC分类号： C08G73/14 , H01B3/30 , C08G69/26
CPC分类号： C08G73/14 , H01B3/303
摘要： A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.3 P wherein R is an aliphatic or aromatic substituent, or a compound which is phosphoric acid, pyrophosphoric acid, phosphorous pentaoxide or phosphorous pentachloride as a second catalyst at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours.
摘要翻译：制备如上所述的具有高分子量的聚酰胺酰亚胺树脂的方法，其中提高了诸如低耐热性和低熔融流动性的现有技术方法的主要问题。通过在30℃下以0.5g / dl的浓度作为溶剂的二甲基乙酰胺溶液测定的特性粘度为0.4至1.50dl / g的聚酰胺酰亚胺树脂通过芳族三羧酸酐与芳族二胺在N-甲基吡咯烷酮溶剂中，在50℃至130℃的温度下，在选自亚硫酰氯，对甲苯磺酰氯，磺酰氯，氰尿酰氯和三氯化磷的第一催化剂存在下，在时间为1至5小时，并且在第二催化剂存在下进一步反应，所述第二催化剂是式（RO）3P的化合物，其中R是脂族或芳族取代基，或者是磷酸化合物，焦磷酸，五氧化二磷或五氯化磷作为第二催化剂，温度为50〜130℃，时间为1〜5小时。

10. 发明授权

US5243010A Aromatic polyamide containing pendant silyl groups 失效
标题翻译：芳香族聚酰胺含有助剂SILYL组合物
公开(公告)号：US5243010A
公开(公告)日：1993-09-07
申请号：US852075
申请日：1992-03-13
申请人： Kil-Yeong Choi , Mi Hie Yi
发明人： Kil-Yeong Choi , Mi Hie Yi
IPC分类号： C08G69/32 , C08G69/42
CPC分类号： C08G69/42 , C08G69/32
摘要： This invention relates to the aromatic polyamide resin of the following general formula(I) having pendant silyl groups characterized in that the said polyamide resin has excellent solubility for the films to be easily prepared by solvent casting as well as useful as coating materials, can be used at higher temperature than the reported polyamides because of the excellent heat stability, and also has excellent adhesive strength in the blend with glass fiber. ##STR1##
摘要翻译：本发明涉及具有侧壁甲硅烷基的以下通式（I）的芳族聚酰胺树脂，其特征在于所述聚酰胺树脂对通过溶剂浇铸容易制备的膜具有优异的溶解性，并且可用作涂料，可以是由于具有优异的热稳定性，因此在比报道的聚酰胺更高的温度下使用，并且在与玻璃纤维的共混物中也具有优异的粘合强度。（一）

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