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    • 4. 发明申请
    • Cooling device capable of reducing thickness of electronic apparatus
    • 能减少电子设备厚度的冷却装置
    • US20080030948A1
    • 2008-02-07
    • US11905895
    • 2007-10-05
    • Atsuko TanakaMasuo Ohnishi
    • Atsuko TanakaMasuo Ohnishi
    • H05K7/20
    • G06F1/203
    • A printed circuit board unit with a cooling device includes a printed circuit board; a ventilation fan including blades rotating around a rotation axis intersecting the printed circuit board; a housing wall standing from a surface of the printed circuit board at a periphery of the ventilation fan; an inlet defined in the printed circuit board inside the housing wall and located under the blades of the ventilation fan; and an outlet defined in the housing wall to open in parallel with the surface of the printed circuit board. An electronic apparatus is also provided which further includes an electronic component mounted on the printed circuit board.
    • 具有冷却装置的印刷电路板单元包括印刷电路板; 通风扇,包括围绕与印刷电路板交叉的旋转轴线旋转的叶片; 在所述通风扇的周围从所述印刷电路板的表面站立的外壳壁; 位于外壳壁内的位于通风扇的叶片下方的印刷电路板中的入口; 以及限定在壳体壁中以与印刷电路板的表面平行打开的出口。 还提供了还包括安装在印刷电路板上的电子部件的电子设备。