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1. 发明授权

US4849371A Monocrystalline semiconductor buried layers for electrical contacts to semiconductor devices 失效
标题翻译：用于与半导体器件电接触的单晶半导体掩埋层
公开(公告)号：US4849371A
公开(公告)日：1989-07-18
申请号：US271359
申请日：1988-11-15
申请人： Kent W. Hansen , Frank S. D'Aragona , Hang M. Liaw
发明人： Kent W. Hansen , Frank S. D'Aragona , Hang M. Liaw
IPC分类号： H01L21/74
CPC分类号： H01L21/743 , Y10S148/011
摘要： A method and product for monocrystalline semiconductor buried layer contacts formed from recrystallized polycrystalline buried layers.
摘要翻译：由再结晶多晶埋层形成的单晶半导体埋层接触的方法和产品。

2. 发明授权

US3964920A Solder glass composition and method of using same for encapsulating devices 失效
标题翻译：焊料玻璃组合物及其使用方法用于封装装置
公开(公告)号：US3964920A
公开(公告)日：1976-06-22
申请号：US409843
申请日：1973-10-26
申请人： Earl K. Davis , Kent W. Hansen , Duane C. Silvis
发明人： Earl K. Davis , Kent W. Hansen , Duane C. Silvis
IPC分类号： C03C3/14 , C03C3/074 , C03C4/00 , C03C8/24 , C03C14/00 , C04B37/00 , H01L23/10 , H01L23/29 , H01L23/495 , C03C3/04 , C03C3/10
CPC分类号： C03C4/00 , C03C14/004 , C03C3/0745 , C03C8/245 , C04B35/645 , C04B37/005 , H01L23/10 , H01L23/291 , H01L23/49541 , C03C2214/04 , C04B2235/6567 , C04B2237/068 , C04B2237/10 , C04B2237/343 , C04B2237/64 , C04B2237/708 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01079 , H01L2924/09701
摘要： A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO.sub.2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF.sub.2 about 2-10 percent, CdO about 1-5 percent, TiO.sub.2 about 0.5-3 percent and B.sub.2 O.sub.3 about 10-14 percent.
摘要翻译：公开了一种将两个陶瓷件，引线框架和半导体芯片一起密封在一起的方法，其中包括在整个密封过程中保持玻璃状的密封玻璃组合物施加压力。密封玻璃组合物包括密封玻璃和硅酸锆的混合物，其体积百分数为玻璃的50-62％和硅酸锆的50-38％。玻璃组分以单独的玻璃的百分比重量包含SiO 2约0-2％，PbO约65-72％，ZnO约5-10％，PbF 2约2-10％，CdO约1-5％，TiO 2 约0.5-3％，B2O3约10-14％。

3. 发明授权

US5555341A Waveguide with an electrically conductive channel 失效
标题翻译：带导电通道的波导
公开(公告)号：US5555341A
公开(公告)日：1996-09-10
申请号：US214524
申请日：1994-03-18
申请人： Ravinder K. Sharma , Michael S. Lebby , Davis H. Hartman , Kent W. Hansen
发明人： Ravinder K. Sharma , Michael S. Lebby , Davis H. Hartman , Kent W. Hansen
IPC分类号： G02B6/42 , G02B6/10
CPC分类号： G02B6/4249 , G02B6/4231 , G02B6/4292
摘要： An electrically conductive waveguide is provided. A waveguide including a core region, a cladding region, a first surface and an end surface is fabricated. Cladding region covers a portion of the core region forming the first surface, and a portion of the core region and the cladding region form the end surface. The first surface and the end surface meet to form a nexus. An opening located at the nexus of the first surface and the end surface is formed with a conductive member located in the opening.
摘要翻译：提供导电波导。制造包括芯区域，包层区域，第一表面和端面的波导管。包覆区域覆盖形成第一表面的芯区域的一部分，并且芯区域和包层区域的一部分形成端表面。第一表面和端面相交形成一个纽带。位于第一表面和端面的关系处的开口形成有位于开口中的导电构件。

4. 发明授权

US4131478A Sealing glass compositions and method 失效
标题翻译：密封玻璃的组成和方法
公开(公告)号：US4131478A
公开(公告)日：1978-12-26
申请号：US828017
申请日：1977-08-26
申请人： Earl K. Davis , Kent W. Hansen
发明人： Earl K. Davis , Kent W. Hansen
IPC分类号： C03C8/24 , C03C3/10
CPC分类号： C03C8/245
摘要： A solder glass/ceramic composition and method for sealing television picture tube components wherein the composition remains vitreous throughout the sealing process. The composition comprises a mixture of 9-15 weight percent aluminum oxide and 91-85 weight percent solder glass. The solder glass components comprise, in weight percent of the glass alone, SiO.sub.2 about 2-4 percent, PbO about 64-66 percent, PbF.sub.2 about 5-10 percent, ZnO about 6-9 percent, CdO about 4-6 percent, and B.sub.2 O.sub.3 about 12-14 percent.
摘要翻译：焊接玻璃/陶瓷组合物和密封电视显像管组件的方法，其中组合物在整个密封过程中保持玻璃状。该组合物包含9-15重量％的氧化铝和91-85重量％的焊料玻璃的混合物。焊料玻璃组分以单独的玻璃的重量百分比计包含SiO 2约2-4％，PbO约64-66％，PbF 2约5-10％，ZnO约6-9％，CdO约4-6％，以及 B2O3约12-14％。

5. 发明授权

US5848466A Method for forming a microelectronic assembly 失效
标题翻译：微电子组件的形成方法
公开(公告)号：US5848466A
公开(公告)日：1998-12-15
申请号：US752019
申请日：1996-11-19
申请人： Daniel Joseph Viza , Dennis Brian Miller , William M. Beckenbaugh , Conrad S. Monroe , Kent W. Hansen
发明人： Daniel Joseph Viza , Dennis Brian Miller , William M. Beckenbaugh , Conrad S. Monroe , Kent W. Hansen
IPC分类号： H01L21/60 , H01L23/485 , H01L23/498 , H05K1/11 , H05K3/32 , H05K3/40 , H05K3/34
CPC分类号： H05K1/112 , H01L23/49827 , H01L23/4985 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16237 , H01L2224/81801 , H01L2224/83101 , H01L2224/83856 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/10575 , H05K2201/10674 , H05K2203/1189 , H05K2203/1446 , H05K3/321 , H05K3/4038 , Y10T29/49144 , Y10T29/49165
摘要： A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).
摘要翻译：通过将集成电路部件（20）接合到基板（12）上而形成微电子组件（10）。基板（12）包括通孔（22）和闭合通孔（22）的金属触头（24）。诸如焊膏或导电环氧树脂的粘合剂（14）被分配到与金属接触件（24）相邻的通孔（22）中。将包括部分固化膜（18）的载带（16）放置在基板（12）上，使得膜（18）覆盖通孔（22），并在基板（12）和电影（18）。集成电路部件（20）被叠加到基板（12）上，使得集成电路部件（20）上的导电凸块（26）穿透并延伸穿过薄膜（18）并与通孔中的粘结剂（14）接触（22）。穿孔期间移位的部分（44）被接收在间隙（28）中。因此，膜（18）被插入在基板（12）和集成电路部件（20）之间。然后将预组件（38）加热以将粘合剂（14）粘合到金属接触件（24）上并固化膜（18）以形成整体组件（10）。

6. 发明授权

US4184189A Capacitive pressure sensor and method of making it 失效
标题翻译：电容式压力传感器及其制作方法
公开(公告)号：US4184189A
公开(公告)日：1980-01-15
申请号：US933318
申请日：1978-08-14
申请人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
发明人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
IPC分类号： G01L9/12 , C03C8/24 , C03C27/06 , G01L9/00 , C03B23/20
CPC分类号： G01L9/0075 , C03C27/06 , C03C8/245 , Y10T29/43
摘要： An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.
摘要翻译：廉价的玻璃电容式压力传感器。导电电容器电极设置在两个平板玻璃板上，一个用作隔膜，另一个用作基板。电极以间隔开的基本平行的关系定位，以形成平行板电容器的板。玻璃板与密封玻璃混合物一起密封在一起以结合导体之间的体积。体积处于参考压力，优选实质上真空。要测量的压力与该参考压力之间的差异导致通过测量两个电极之间的电容而检测的玻璃隔膜的弯曲。在玻璃板之间提供气密密封的合适的密封玻璃混合物以重量百分数包含8-10SiO 2，1-2 Al 2 O 3，55-60PbO，7-9 PbF 2，7-10 ZnO，4-6 CdO和10-15B2O3。密封玻璃混合物必须真空处理，以在真空中进行气密封装。

7. 发明授权

US5550941A Optoelectronic interface module 失效
标题翻译：光电接口模块
公开(公告)号：US5550941A
公开(公告)日：1996-08-27
申请号：US393763
申请日：1995-02-24
申请人： Michael S. Lebby , Christopher K. Y. Chun , Shun-Meen Kuo , Kent W. Hansen
发明人： Michael S. Lebby , Christopher K. Y. Chun , Shun-Meen Kuo , Kent W. Hansen
IPC分类号： H01L27/15 , G02B6/42 , H01L23/538 , H01S5/022 , H01S5/40 , G02B6/30
CPC分类号： G02B6/4249 , H01L23/5387 , G02B6/4292 , H01L2924/0002 , Y10T156/10
摘要： A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).
摘要翻译：提供具有多个电气追踪（118）的柔性电路膜（103）。提供具有能够接受柔性电路膜（103）的空腔（112）的模具（102）。将柔性电路膜（103）放入模具（102）中。第一光学部分（203）在模具（102）的空腔（112）中用柔性电路膜（103）模制，以将柔性电路膜（103）连接到第一光学部分（203）。

8. 发明授权

US5482658A Method of making an optoelectronic interface module 失效
标题翻译：制造光电接口模块的方法
公开(公告)号：US5482658A
公开(公告)日：1996-01-09
申请号：US106472
申请日：1993-08-13
申请人： Michael S. Lebby , Christopher K. Y. Chun , Shun-Meen Kuo , Kent W. Hansen
发明人： Michael S. Lebby , Christopher K. Y. Chun , Shun-Meen Kuo , Kent W. Hansen
IPC分类号： H01L27/15 , G02B6/42 , H01L23/538 , H01S5/022 , H01S5/40 , B29D11/00
CPC分类号： G02B6/4249 , H01L23/5387 , G02B6/4292 , H01L2924/0002 , Y10T156/10
摘要： A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).
摘要翻译：提供具有多个电气追踪（118）的柔性电路膜（103）。提供具有能够接受柔性电路膜（103）的空腔（112）的模具（102）。将柔性电路膜（103）放入模具（102）中。第一光学部分（203）在模具（102）的空腔（112）中用柔性电路膜（103）模制，以将柔性电路膜（103）连接到第一光学部分（203）。

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