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1. 发明授权

US4818821A Brazed leaded package 失效
标题翻译：钎焊包装
公开(公告)号：US4818821A
公开(公告)日：1989-04-04
申请号：US175450
申请日：1988-03-30
申请人： Robert M. Wentworth , Brian Webb
发明人： Robert M. Wentworth , Brian Webb
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads terminate on the top of the heat conductive support in a braze pad to which are brazed formed leads for providing interface connection to a semiconductor integrated circuit contained within the package. The package can be sealed by using a solid ceramic cover having a glazed glass on its bottom side which is heated up to reflow and provide the seal.
摘要翻译：钎焊的有铅封装被提供有埋入的钎焊区域，从而消除了对钎焊区域的后续保护电镀的需要。该封装具有支撑多个引线的导热支撑。引线的远端终止在钎焊焊盘上的导热支撑件的顶部上，钎焊的成形引线用于提供与包含在封装内的半导体集成电路的接口连接。该封装可以通过使用在底部具有玻璃玻璃的固体陶瓷盖进行密封，该陶瓷盖被加热以回流并提供密封。

2. 发明授权

US5477084A Microelectronic device packaging containing a liquid and method 失效
标题翻译：含有液体的微电子器件封装和方法
公开(公告)号：US5477084A
公开(公告)日：1995-12-19
申请号：US367628
申请日：1995-01-03
申请人： Brian A. Webb , Robert M. Wentworth
发明人： Brian A. Webb , Robert M. Wentworth
IPC分类号： H01L21/54 , H01L23/22 , H01L23/42 , H01L25/04
CPC分类号： H01L23/22 , H01L21/54 , H01L23/42 , H01L2924/0002 , Y10T29/49146
摘要： A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).
摘要翻译：一种含液体微电子器件封装的制造方法。该方法包括以下步骤：提供（32）包括微电子器件（22）的底座（16）和围绕基座（16）围绕设置的密封区域，提供（34）盖子（12）并提供（34）密封剂（14）设置在基部（16）和盖（12）之间。该方法还包括以下步骤：将基底（16），密封剂（14）和盖（12）浸入温度高于密封剂活化温度的液体（24）中并保持（38）基底（16），密封剂（14）和液体（24）中的盖子（12）足以允许液体（24）进入基部（16）和盖（12）之间的时间，并加热并由此激活密封剂（14）。该方法还包括从液体（24）中移除（40）底座（16），盖子（12）和密封剂（14）以提供密封的含液体的微电子器件封装（10）。

3. 发明授权

US5413965A Method of making microelectronic device package containing a liquid 失效
标题翻译：制造含有液体的微电子器件封装的方法
公开(公告)号：US5413965A
公开(公告)日：1995-05-09
申请号：US119555
申请日：1993-09-13
申请人： Brian A. Webb , Robert M. Wentworth
发明人： Brian A. Webb , Robert M. Wentworth
IPC分类号： H01L21/54 , H01L23/22 , H01L23/42 , H01L21/56
CPC分类号： H01L23/22 , H01L21/54 , H01L23/42 , H01L2924/0002 , Y10T29/49146
摘要： A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).
摘要翻译：一种含液体微电子器件封装的制造方法。该方法包括以下步骤：提供（32）包括微电子器件（22）的底座（16）和围绕基座（16）围绕设置的密封区域，提供（34）盖子（12）并提供（34）密封剂（14）设置在基部（16）和盖（12）之间。该方法还包括以下步骤：将基底（16），密封剂（14）和盖（12）浸入温度高于密封剂活化温度的液体（24）中并保持（38）基底（16），密封剂（14）和液体（24）中的盖子（12）足以允许液体（24）进入基部（16）和盖（12）之间的时间，并加热并由此激活密封剂（14）。该方法还包括从液体（24）中移除（40）底座（16），盖子（12）和密封剂（14）以提供密封的含液体的微电子器件封装（10）。

4. 发明授权

US4184189A Capacitive pressure sensor and method of making it 失效
标题翻译：电容式压力传感器及其制作方法
公开(公告)号：US4184189A
公开(公告)日：1980-01-15
申请号：US933318
申请日：1978-08-14
申请人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
发明人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
IPC分类号： G01L9/12 , C03C8/24 , C03C27/06 , G01L9/00 , C03B23/20
CPC分类号： G01L9/0075 , C03C27/06 , C03C8/245 , Y10T29/43
摘要： An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.
摘要翻译：廉价的玻璃电容式压力传感器。导电电容器电极设置在两个平板玻璃板上，一个用作隔膜，另一个用作基板。电极以间隔开的基本平行的关系定位，以形成平行板电容器的板。玻璃板与密封玻璃混合物一起密封在一起以结合导体之间的体积。体积处于参考压力，优选实质上真空。要测量的压力与该参考压力之间的差异导致通过测量两个电极之间的电容而检测的玻璃隔膜的弯曲。在玻璃板之间提供气密密封的合适的密封玻璃混合物以重量百分数包含8-10SiO 2，1-2 Al 2 O 3，55-60PbO，7-9 PbF 2，7-10 ZnO，4-6 CdO和10-15B2O3。密封玻璃混合物必须真空处理，以在真空中进行气密封装。

5. 发明授权

US5790728A Optical coupling component and method of making the same 失效
标题翻译：光耦合元件及其制作方法
公开(公告)号：US5790728A
公开(公告)日：1998-08-04
申请号：US671866
申请日：1996-06-28
申请人： Robert M. Wentworth
发明人： Robert M. Wentworth
IPC分类号： G02B6/42 , G02B6/43 , G02B6/34
CPC分类号： G02B6/43 , G02B6/4204 , G02B6/4232
摘要： An optical component (40) is formed by bonding a light generating device (43) onto a transparent substrate (41). The light generating device can be attached to the transparent substrate (41) using a flip-chip bond. A light detecting device (51) is also bonded to the transparent substrate (41) and positioned so that a portion of the optical signal provided by the light generating device (43) is reflected to the light detecting device (51) through the transparent substrate (41). A holographic film (42) may be formed on the transparent substrate (41) to diffuse the optical signal provided by the light generating device (43).
摘要翻译：通过将发光装置（43）接合到透明基板（41）上而形成光学部件（40）。发光装置可以使用倒装芯片接合而附接到透明基板（41）。光检测装置（51）也结合到透明基板（41）上并且定位成使得由发光装置（43）提供的光信号的一部分通过透明基板反射到光检测装置（51）（41）。可以在透明基板（41）上形成全息膜（42），以扩散由光产生装置（43）提供的光信号。

6. 发明授权

US5590232A Optical package and method of making 失效
标题翻译：光学封装及其制作方法
公开(公告)号：US5590232A
公开(公告)日：1996-12-31
申请号：US390209
申请日：1995-02-16
申请人： Robert M. Wentworth , David Galloway , Garland D. Cotney , Brian A. Webb
发明人： Robert M. Wentworth , David Galloway , Garland D. Cotney , Brian A. Webb
IPC分类号： G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/4249
摘要： An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.
摘要翻译：一种光学封装，包括壳体，其限定安装区域，其中形成在所述壳体中的引线各自具有在所述安装区域中的第一端和在所述壳体外部的第二端。其上具有光子器件的半导体裸片安装在安装区域中并电连接到引线。光子器件的有源光区域可通过安装区域访问。光纤对准结构安装在用于接收光纤的安装区域中，并将光纤与光子器件的有源光区域对准。

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