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1. 发明授权

US06548179B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 失效
标题翻译：聚酰亚胺膜，制造方法和具有聚酰亚胺膜基材的金属互连板
公开(公告)号：US06548179B2
公开(公告)日：2003-04-15
申请号：US09925211
申请日：2001-08-09
申请人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
发明人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
IPC分类号： B32B2700
CPC分类号： C08J5/18 , C08G73/1042 , C08J2379/08 , H05K1/0346 , Y10T428/24802 , Y10T428/24917 , Y10T428/31721
摘要： A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
摘要翻译：通过将苯均二酸二酐与苯二胺，亚甲基二苯胺和3,4'-氧二苯胺以特定摩尔比组合共聚制备聚酰亚胺膜。聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB）高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

2. 发明授权

US06908685B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 有权
标题翻译：聚酰亚胺膜，制造方法和具有聚酰亚胺膜基材的金属互连板
公开(公告)号：US06908685B2
公开(公告)日：2005-06-21
申请号：US10343277
申请日：2001-08-23
申请人： Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
发明人： Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
IPC分类号： C08G73/10 , H05K1/03 , B32B15/08 , B32B27/08 , C08L77/00
CPC分类号： H05K1/0346 , C08G73/1042 , Y10S428/901 , Y10T428/24917 , Y10T428/31678 , Y10T428/31721
摘要： The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
摘要翻译：本发明提供一种聚酰亚胺膜，其由均苯四酸二酐制备的聚酰胺酸与10至60mol％的苯二胺和40至90mol％的3,4'-氧二苯胺（基于总二胺）组合。聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB）高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

3. 发明授权

US06555238B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 失效
公开(公告)号：US06555238B2
公开(公告)日：2003-04-29
申请号：US09927647
申请日：2001-08-10
申请人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
发明人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
IPC分类号： B32B1508
CPC分类号： C08J5/18 , C08G73/1042 , C08G73/1071 , C08J2379/08 , H05K1/0346 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

4. 发明授权

US08114500B2 Polyimide film and method of manufacture thereof 有权
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：US08114500B2
公开(公告)日：2012-02-14
申请号：US12609702
申请日：2009-10-30
申请人： Naofumi Yasuda , Hiroki Ishikawa , Hirokazu Yokoyama
发明人： Naofumi Yasuda , Hiroki Ishikawa , Hirokazu Yokoyama
IPC分类号： B32B15/088 , B29C55/14 , C08J5/18
CPC分类号： H05K1/0346 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0393 , H05K2201/0154 , H05K2201/0212 , Y10S977/773 , Y10S977/775 , Y10T428/24405
摘要： The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.
摘要翻译：本发明的目的是提供一种具有优异的通过特性的聚酰亚胺膜，特别是在自动光学检测系统（AOI）中，更不用说运行特性（易滑动特性）和粘附性。

5. 发明申请

US20090068403A1 POLYIMIDE FILM AND COPPER-CLAD LAMINATE USING IT AS BASE MATERIAL 审中-公开
标题翻译：聚酰亚胺膜和铜箔层压板使用其作为基材
公开(公告)号：US20090068403A1
公开(公告)日：2009-03-12
申请号：US12209462
申请日：2008-09-12
申请人： Naofumi Yasuda , Hiroki Ishikawa
发明人： Naofumi Yasuda , Hiroki Ishikawa
IPC分类号： B32B3/30 , C08G73/10
CPC分类号： H05K1/0346 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B2457/00 , C08G73/10 , C08L79/08 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/068 , Y10T428/24355 , Y10T428/265
摘要： To provide a polyimide film, which has excellent size stability and is suitable for a substrate for fine pitch circuits, especially COF (Chip on Film) being wired at a narrow pitch in the width direction of the film, and a copper-clad laminate using the film as a base material.
摘要翻译：为了提供具有优异的尺寸稳定性并且适用于细间距电路的基板的聚酰亚胺膜，特别是在膜的宽度方向上以窄间距布线的COF（膜上贴片）和使用该片作为基材。

6. 发明授权

US4840488A Photoelectric type displacement detecting instrument 失效
标题翻译：光电式位移检测仪
公开(公告)号：US4840488A
公开(公告)日：1989-06-20
申请号：US086627
申请日：1987-07-24
申请人： Yoshihiko Kabaya , Naofumi Yasuda , Toshihiro Omi
发明人： Yoshihiko Kabaya , Naofumi Yasuda , Toshihiro Omi
IPC分类号： G01D5/347 , G01D5/36
CPC分类号： G01D5/36 , G01D5/34715
摘要： A photoelectric type displacement detecting instrument comprising: a main optical lattice formed on a first member; an auxiliary optical lattice formed on a second member; a light emitter for emitting detecting light to the both optical lattices in a direction from the outer side of the second member to the first member; a light receiver opposed to the light emitter, interposing therebetween the both optical lattices, for receiving the detecting light transmitted through the both optical lattices, transducing changes in the value of the received light through the repeat of overlappings due to relative movements between the both optical lattices into electric signals; and an electronic circuit for calculating a relative moving distance between the main optical lattice and the auxiliary optical lattice on the basis of the electric signals. The auxiliary optical lattice is formed into a plurality of parts by a phase dividing frame; the light receiver is divided into a plurality of parts corresponding in number to the parts of the auxiliary optical lattice. The light emitter is of such an arrangement that the light diffused from a light emitting element is reflected in parallel in the direction of the main optical lattice and the auxiliary optical lattice, and transmitted through a surface, where the optical lattices are formed, perpendicularly.
摘要翻译： PCT No.PCT / JP87 / 00154 Sec。 371日期1987年7月24日 102（e）1987年7月24日PCT PCT 1987年3月12日PCT公布。公开号WO87 / 05693 日期：1987年9月24日。一种光电式位移检测仪，包括：形成在第一构件上的主光栅; 形成在第二构件上的辅助光栅; 光发射器，用于在从第二构件的外侧到第一构件的方向上向两个光栅发射检测光; 与光发射器相对的光接收器，插入两个光栅之间，用于接收透过两个光栅的检测光，通过由于两个光学元件之间的相对运动而导致的重复重复而导致的接收光的值的变化格子变成电信号以及电子电路，用于基于电信号计算主光栅和辅助光栅之间的相对移动距离。辅助光栅由相位分割框形成多个部分; 光接收器被分成多个对应于辅助光栅的部分的部分。光发射器具有这样的布置：从发光元件扩散的光在主光学晶格和辅助光学晶格的方向上被平行地反射，并通过形成光栅的表面垂直地透射。

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